Abstract: A method and an apparatus for repairing resist latent image on a wafer are disclosed. In the method, an image scanner equipped with a first and a second wafer carrier, and a primary imaging column and a secondary imaging column is utilized to conduct the processes of imaging a resist latent image on a first wafer and repairing a defect in a resist latent image on a second wafer positioned on a second wafer carrier simultaneously. The primary imaging column and the secondary imaging column may be situated in the same vacuum chamber to facilitate operation.

Abstract: A new method is provided for the creation of contact holes. The invention provides two masks. The first mask, referred to as the packed mask, comprises the desired contact holes, which are part of the creation of a semiconductor device. To the packed mask are added padding holes in order to increase the hole density of the packed mask. The second mask, referred to an the unpacking mask, comprises openings at the same locations as the locations of the padding holes of the first mask, the openings provided in the second mask have slightly larger dimensions than the padding holes of the first mask. A first exposure is made using the packed mask, a second exposure of the same surface area is made using the unpacking mask. The unpacking mask is used to selectively cover the padding contact holes, resulting in the final image.

Abstract: A minimal amount of waste in liquid resist material is achieved by dispensing through small openings at close proximity to the substrate. An airtight substrate chamber as well as airtight sealing of dispensing assembly and airtight sealing of the space that does not have to be opened for substrate loading and unloading, are used to facilitate a uniform and planarized coating after a high-speed spin off of excess resist.

Abstract: A structure and fabrication method for a phase-shifting lithographic mask wherein an attenuated phase-shifting mesh structure (Att PSM) is combined with an alternating-element phase shifting mask (Alt PSM) to provide a mask combination consisting of phase-shifted and unshifted attenuated backgrounds in which the phase-shifted attenuated backgrounds surrounds the unshifted components and the unshifted attenuated background surrounds the phase-shifted components.

Abstract: A photolithographic technique and apparatus involving two exposures and the sectioning of a first original mask opening that has segments which conflict with a second original mask opening. A plurality of segmented openings are configured in a first mask including at least one phase shifted opening and at least one non-phase shifted opening. Imaging radiation is projected through the plurality of segmented openings onto at least two electromagnetic radiation application regions (EARs) on a surface to be imaged during one exposure, with one of the two EAR's being phase shifted and the other non-phase shifted. At least one segmented opening is formed in a second mask. Radiation is projected through the second mask segmented opening onto one or more EARs on the surface during another exposure. At least one of the second mask EARs interconnects at least one of the phase shifted EARs and one of the non-phase shifted EARs.

Abstract: A structure and fabrication method for an alternating-element phase-shifting mask (Alt PSM) wherein all the mask pattern components extending in a first direction, such as the x direction are formed on a first mask substrate and all the mask pattern components extending in a second direction orthogonal to the first direction, such as the y direction, are formed on a second mask substrate. The two mask substrates are either combined together in a single mask for a single exposure step on a wafer, or separate exposures may be made through each mask and superimposed on a single wafer.

Abstract: Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle or an adjacent chamber, applying the resist by spraying a very thin layer of the resist material and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity.

Abstract: A phase-contrast microscope with a quarter-wave plate in a pupil plane with a thickness of .lambda..theta./2.pi. is provided for the inspection of a phase-shifting mask. The angle .theta. and the wavelength .lambda. are adjustable to optimize the phase detection sensitivity. A similar .theta. and .lambda. optimization scheme is applied to an interference microscope assembly wherein an inspection beam is split into two beams by a beam splitter to be reflected by mirrors and then recombined at a second beam splitter. A mirror in one of the beams can be moved to change .theta. to its optimum value at a given .lambda. which can be changed by light source selection or by filter change.

Abstract: A phase-shifting mask consisting of phase shifting rim surrounding every pattern. The 0.degree. and 180.degree. areas defined by a straightforward rim phase-shifting mask are reversed alternately for closely packed patterns. This reversal can take the form of 0.degree. to 180.degree. and 180.degree. to 0.degree. as well as the form of 0.degree. to 180.degree. and 0.degree. to -180.degree. . For small opaque lines, the rim phase shifter may become the only picture element, leaving no mask absorber pattern inside the rim. Individual or uniform pattern sizing can be used to ensure a large common exposure-defocus window. Various fabrication techniques requiring or not requiring a second aligned exposure during mask fabrication, combining with several different forms of mask substrate are also described.

Abstract: Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle or an adjacent chamber, applying the resist by spraying a very thin layer of the resist material and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity.

Abstract: Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle, applying the resist by spraying a very thin layer of the resist material, monitoring and adjusting the resist thickness during spinning in vapor, and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity.

Abstract: Feature biassing applied to phase shifting masks is used to improve the exposure latitude and depth of focus of an optical projection imaging system. Making the phase shifters absorptive facilitates a phase shifting mask system for arbitrary layouts. Combining phase shifters of different levels of absorption further enhance the improvements. Even more enhancement can be gained by combining biassing with absorption levels.

Abstract: A phase-shifting mask is composed of material including a substrate carrying a first phase-shifting layer having a phase-shift of .THETA., a second phase-shifting layer stacked upon the first layer having a phase-shift of (2.pi.-.THETA.), and a third phase-shifting layer stacked upon the second layer next with a phase-shift of .THETA.. Missing phase-shifters, unwanted phase-shifters, or defects in the transparent films are repaired by removing one or two layers depending upon whether the phase-shifting status has to be retained or altered.

Abstract: A lithographic process having improved image quality by employing a mask that includes a plurality of opaque elements or transparent elements that are smaller than the resolution of the lighography to be employed in order to control the transmittance of the actinic light exposure area.

Abstract: A patterned image including on a substrate, a patterned image of a first resist polymeric material and patterned image of a second and different resist material on the first resist polymeric material. The polymeric material contains reactive hydrogen functional groups and/or reactive hydrogen precursor groups. At least the surface layer of the delineated and uncovered first resist polymer material is reacted with a multifunctional organometallic material containing at least two functional groups that are reactive with the functional groups of the polymeric material.

Abstract: A system for evaluating and measuring the performance of lithographic structures, and more particularly for monitoring the optical parameters of a projection lithography system which uses the instant electrical readout from an array of photosensitive detectors fabricated on a silicon wafer in combination with a computer for real-time characterization of lithographic devices and the evaluation of optical E-beam, ion-beam and X-ray parameters. The system includes a source radiation, such as a source of ultraviolet light, a projection mask which masks the illumination from the source. The illumination is then directed through a projection lens onto a semiconductor wafer mounted on an x-y stepping table. A standard digital data processor is provided to control the x-y drive mechanism for the stepping table. The computer also controls a Z drive mechanism for movement in a vertical direction. The semiconductor wafer contains a plurality of radiation detectors which are responsive to the radiation from the source.

Abstract: A method is provided for providing a polystyrene-tetrathiafulvalene (PSTTF)/deep-ultraviolet hydrid system which combines the advantages of E-beam or X-ray lithography systems with those of deep-UV conformable printing to produce low bias, high aspect ratio resist images over the topography of microelectronic devices.

Abstract: Semiconductor fabrication using optical projection apparatus is enhanced in an arrangement having means for producing exposures tailored to the patterns on the conventional photo-mask. A predetermined correction photo-mask capable of producing different exposure levels according to the original mask pattern is superimposed with the original mask on the semiconductor wafer by sequential double exposure using an additional mask change and alignment.A better arrangement provides two beams simultaneously illuminating the two masks; the two beams are recombined with a high quality beam splitter arrangement before reaching the imaging lens. The two masks only have to be aligned to each other once. Afterwards, the wafer is exposed regularly. Therefore, an uncorrected image has the lowest threshold for an isolated opening, medium threshold for equal lines and spaces, high threshold for an isolated opaque line. After the correction scheme, all thresholds are made equal.

Abstract: A photolithographic method wherein a mask is made by pattern exposing and developing a o-quinone diazide sensitized phenol-formaldehyde resist layer, the formed resist mask then being used directly as an exposure mask for a layer of deep ultraviolet (less than 3000A) sensitive resist such as an alkyl methacrylate resist.Since alkyl methacrylate resists are not sensitive to light above 3000A and phenol-formaldehyde resists are opaque to light below 3000A, phenol-formaldehyde resists may be used directly as photoexposure masks for alkyl methacrylate resists using any broad band exposure light source which includes deep ultraviolet. The direct use of a phenol-formaldehyde resist layer as an exposure mask for an alkyl methacrylate resist layer allows more flexible and practical use of resist exposure techniques, including fabrication of an etch resistant mask of high aspect ratio and high resolution without fabrication of an intermediate metallic mask from a material such as chromium.

Abstract: In the process of developing exposed photoresist on a substrate, the endpoint in developing away all of the exposed positive photoresist or any other positive resist is detected by exposing a wafer with a predetermined pattern including an optical grating or other special pattern formed in the photoresist upon a test area. In a system employing this concept, a beam is diffracted by the optics of the grating only at a first angle until the resist forming the grating is removed by development. Then a sensor is activated when an angle of reflection is unblocked when the grating disappears. The system is then turned off to stop development by the sensor in an automatic system or, by the operator in a manual system. A double exposure technique is employed to produce the grating or other special pattern.