Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: An edge finishing apparatus includes a surface, a fluid delivery device configured to deliver at least one magnetorheological polishing fluid (MPF) ribbon to the at least one well, at least one magnet placed adjacent to the surface to selectively apply a magnetic field in a vicinity of the surface, and at least one holder placed in opposing relation to the surface, the at least one holder being configured to support at least one article such that an edge of the at least one article can be selectively immersed in the MPF ribbon delivered to the at least one well.

Abstract: An edge finishing apparatus includes a surface, a fluid delivery device configured to deliver at least one magnetorheological polishing fluid (MPF) ribbon to the at least one well, at least one magnet placed adjacent to the surface to selectively apply a magnetic field in a vicinity of the surface, and at least one holder placed in opposing relation to the surface, the at least one holder being configured to support at least one article such that an edge of the at least one article can be selectively immersed in the MPF ribbon delivered to the at least one well.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is held at a bend radius from about 1 mm to about 20 mm for at least 60 minutes at about 25° C. and about 50% relative humidity. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, with the center of curvature on the side of the second primary surface so as to induce a bending stress ?B at the first primary surface, ?I+?B<0. Still further, the glass element has a puncture resistance of ?1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and/or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material.

Abstract: An edge finishing apparatus includes a surface, a fluid delivery device configured to deliver at least one magnetorheological polishing fluid (MPF) ribbon to the at least one well, at least one magnet placed adjacent to the surface to selectively apply a magnetic field in a vicinity of the surface, and at least one holder placed in opposing relation to the surface, the at least one holder being configured to support at least one article such that an edge of the at least one article can be selectively immersed in the MPF ribbon delivered to the at least one well.

Abstract: Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and/or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material.

Abstract: A top emission, organic light emitting diode display comprises an organic light emitting diode (OLED), a first substrate having an inner surface, and a second substrate having an inner surface, wherein the OLED is sandwiched between the first substrate and the second substrate. At least one of the first substrate and the second substrate includes a pocket formed in the inner surface thereof having a depth such that a distance between the inner surface of the first substrate and the inner surface of the second substrate sufficient to reduce or eliminate the formation of optical distortions such as Newton rings in the display. Other embodiments of the display comprise a frit located between the first and second substrates having a thickness such that the distance between the inner surfaces of the first and second substrates is great enough to prevent the formation of Newton rings.

Abstract: A long-life, high-brightness, moisture-resistant electroluminescent phosphor comprising a base phosphor having the general formula ZnS;Qu,Cl,Au and having a moisture-resistant coating thereon, said coating being selected from the group consisting of a metal nitrides or metal oxide/hydroxides.

Abstract: A process for improving the half-life of ZnS:Cu,Cl electroluminescent phosphor wherein the improvement comprises firing a previously first fired material comprised of ZnS:Cu,Cl with a quantity of MgSO4.7H2O to form a second fired material. The quantity is from 0.015 to 0.15 mole of MgSO4.7H2O/mole of ZnS.

Abstract: The half-life of coated electroluminescent phosphors is improved by annealing the coated phosphors in air for 30 minutes at 250° C.

Abstract: A process for improving the half-life of ZnS:Cu,Cl electroluminescent phosphor wherein the improvement comprises firing a previously first fired material comprised of ZnS:Cu,Cl with a quantity of MgSO4.7H2O to form a second fired material. The quantity is from 0.015 to 0.15 mole of MgSO4.7H2O/mole of ZnS.

Abstract: An electroluminescent phosphor with an increased efficiency is created by blending a chloride flux, a copper source and a zinc sulfide to form a mixture and then heating the mixture for a period of time, cooling the mixture, and washing it with de-ionized water. The mixture is dried and milled to form cubic ZnS from hexagonal ZnS, forming a beginning uncoated ZnS:Cu,Cl electroluminescent phosphor. This beginning phosphor is added to other materials, including Ga2O3, forming a second step material (SSM). The SSM is placed into a first vessel, such as a plastic bottle, blended, sifted and then placed in a second inert reaction vessel that is then heated for a period of time. After cooling, the fired SSM is washed with de-ionized water, washed with acetic acid, again washed with de-ionized water to remove residual acid, washed with KCN and again with de-ionized water to remove residual KCN. The fired and washed SSM is then dried, filtered and sifted, producing a new phosphor with an increased efficiency.

Abstract: A method of increasing the brightness of an electroluminescent phosphor comprises the steps of forming the phosphor as a base phosphor to have a given brightness; and annealing the base phosphor at a temperature and for a time sufficient to increase the given brightness of the base phosphor and form an annealed phosphor. Brightness can be increased from 8% to about 33% when measure against a control made by the same process but not annealed.