Abstract: Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature.

Abstract: A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range.

Abstract: A heating and cooling apparatus is provided which employs a series of thermally conductive plates thermally coupled to heating and cooling devices to heat or cool a mounting plate loaded with semiconductor devices. The mounting plate is assembled on a heating plate, which is then assembled on a cooling plate. The heating plate includes upper and lower plates with a heater therebetween which can heat the heating plate to a desired temperature, which in turn heats the mounting plate and the semiconductor devices. The cooling plate has ‘S’ shaped flow grooves formed throughout. When cooling fluid is flowed through the flow grooves, the cooling plate is cooled, which cools the heating plate, which in turn cools the mounting plate and the semiconductor devices.

Abstract: A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range.

Abstract: Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature.

Abstract: An apparatus for heating and cooling a semiconductor device in a handler for testing the semiconductor device is provided. The apparatus includes: a thermal conductive mounting plate having a plurality of seating recesses on which the semiconductor devices are mounted; a thermal conductive heating plate installed adjacent to a lower side of the mounting plate and having at least one heater installed therein, for transferring heat to the mounting plate; a thermal conductive cooling plate installed adjacent to a lower side of the heating plate on a main body of the handler and having a flow groove such that a cooling fluid fed from an external cooling fluid supply source flows and then is exhausted to an outside; a heating control means for controlling heat irradiated from the heater of the heating plate to control heating temperature of the mounting plate; and a cooling control means for controlling amount of the cooling fluid fed to the cooling plate to control cooling temperature of the mounting plate.