Patents by Inventor Byeong Kyun Choi
Byeong Kyun Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12016128Abstract: A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 ?m to 5 ?m.Type: GrantFiled: August 31, 2021Date of Patent: June 18, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Min Young Hwang, Byeong Kyun Choi, Jin Seok Lee, Moo Seong Kim
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Patent number: 11974388Abstract: A circuit board, according to an embodiment, comprises: a first insulating layer; a second insulating layer disposed on one surface of the first insulating layer; and a third insulating layer disposed on the other surface of the first insulating layer. A circuit pattern is disposed on at least one insulating layer from among the first to third insulating layers, at least one insulating layer from among the first to third insulating layers comprises glass fiber, at least one insulating layer from among the first to third insulating layers does not comprise glass fiber, and the thicknesses of the first to third insulating layers are different from each other.Type: GrantFiled: February 13, 2020Date of Patent: April 30, 2024Assignee: LG Innotek Co., Ltd.Inventors: Byeong Kyun Choi, Min Young Hwang, Hyun Gu Im
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Publication number: 20240043654Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler includes at least one concave portion provided on a surface, wherein a content of the filler has a range of 10 vol. % to 40 vol % of a total volume of the resin composition, and wherein a porosity corresponds to a volume occupied by the concave portion in a total volume of the filler and has a range of 20% to 35%.Type: ApplicationFiled: August 17, 2021Publication date: February 8, 2024Inventors: Byeong Kyun CHOI, Min Young HWANG, Moo Seong KIM, Jin Seok LEE
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Publication number: 20230317881Abstract: A light emitting element includes an n-type semiconductor, a p-type semiconductor, and an active layer between the n-type semiconductor and the p-type semiconductor, threading dislocations are formed in the n-type semiconductor, and openings are formed on a surface of the n-type semiconductor based on the threading dislocations.Type: ApplicationFiled: October 31, 2022Publication date: October 5, 2023Applicant: Samsung Display Co., LTD.Inventors: Byeong Kyun CHOI, Jong Moo HUH, Byoung Yong KIM
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Publication number: 20230238398Abstract: A display device, and a tile-shaped display device including the same are provided. The display device includes a transistor array layer on a first surface of a substrate, and a plurality of light emitting elements on the transistor array layer. The transistor array layer includes a plurality of pixel drivers and two or more gate drivers in a circuit area of a display area, a first gate voltage supply line around the circuit area, and two or more first gate voltage auxiliary lines connected between the first gate voltage supply line and each of the two or more gate drivers. One end of each of the two or more first gate voltage auxiliary lines is spaced from an edge of the substrate adjacent to the first gate voltage supply line than the first gate voltage supply line.Type: ApplicationFiled: January 23, 2023Publication date: July 27, 2023Inventors: Byeong Kyun CHOI, Byoung Yong KIM, Jae Phil LEE
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Publication number: 20230238373Abstract: A display device includes a substrate, a plurality of electrode pads including a first electrode pad and a common electrode pad on the substrate, a light emitting element including a first contact electrode on the first electrode pad and a second contact electrode on the common electrode pad, a conductive adhesive member including a plurality of conductive balls connecting the first electrode pad and the first contact electrode and connecting the common electrode pad and the second contact electrode, and a plurality of protrusions on the substrate and protruding in a thickness direction of the substrate. First protrusions from among the plurality of protrusions overlap the electrode pads in the thickness direction of the substrate.Type: ApplicationFiled: December 13, 2022Publication date: July 27, 2023Inventors: Nak Cho CHOI, Byeong Kyun CHOI, Jae Phil LEE, Sun PARK, Min Chul SHIN, Sang Woo AN
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Publication number: 20230066269Abstract: A circuit board according to an embodiment includes an insulating layer; and a via portion disposed in a via hole formed in the insulating layer; wherein the via portion includes: a first pad disposed on a lower surface of the insulating layer; a second pad disposed on an upper surface of the insulating layer; a third pad disposed in the via hole and disposed on the first pad; and a connection portion disposed in the via hole and disposed between the second pad and the third pad.Type: ApplicationFiled: January 13, 2021Publication date: March 2, 2023Inventors: Min Young HWANG, Hyun Gu IM, Byeong Kyun CHOI
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Patent number: 11528801Abstract: A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 ?m to 0.31 ?m.Type: GrantFiled: December 12, 2019Date of Patent: December 13, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Yong Suk Kim, Hyun Gu Im, Byeong Kyun Choi
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Publication number: 20220151068Abstract: A circuit board according to one embodiment comprises a first insulation layer, a circuit pattern on the first insulation layer, and a second insulation layer on the circuit pattern, wherein a heat transfer member is arranged inside the first insulation layer and/or the second insulation layer, and the heat transfer member is arranged while coming in contact with a side surface of the insulation layer.Type: ApplicationFiled: February 10, 2020Publication date: May 12, 2022Inventors: Min Young HWANG, Moo Seong KIM, Byeong Kyun CHOI
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Publication number: 20220132653Abstract: A circuit board, according to an embodiment, comprises: a first insulating layer; a second insulating layer disposed on one surface of the first insulating layer; and a third insulating layer disposed on the other surface of the first insulating layer. A circuit pattern is disposed on at least one insulating layer from among the first to third insulating layers, at least one insulating layer from among the first to third insulating layers comprises glass fiber, at least one insulating layer from among the first to third insulating layers does not comprise glass fiber, and the thicknesses of the first to third insulating layers are different from each other.Type: ApplicationFiled: February 13, 2020Publication date: April 28, 2022Inventors: Byeong Kyun CHOI, Min Young HWANG, Hyun Gu IM
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Publication number: 20220071016Abstract: A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 ?m to 5 ?m.Type: ApplicationFiled: August 31, 2021Publication date: March 3, 2022Inventors: Min Young HWANG, Byeong Kyun Choi, Jin Seok Lee, Moo Seong Kim
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Publication number: 20220061147Abstract: A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 ?m to 0.31 ?m.Type: ApplicationFiled: December 12, 2019Publication date: February 24, 2022Inventors: Yong Suk KIM, Hyun Gu IM, Byeong Kyun CHOI
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Patent number: 10784409Abstract: An embodiment provides a semiconductor element, which comprises: a plurality of semiconductor structures, each of which comprises a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and a first recess extending through the second conductive semiconductor layer and the active layer to a partial area of the first conductive semiconductor layer; a second recess disposed between the plurality of semiconductor structures; a first electrode disposed at the first recess and electrically connected to the first conductive semiconductor layer; a reflective layer disposed under the second conductive semiconductor layer; and a protrusion part disposed on the second recess and protruding higher than the upper surfaces of the semiconductor structures, wherein a surface, on which the first electrode contacts the first conductive semiconductor layer in the first recess, is 300Type: GrantFiled: November 10, 2017Date of Patent: September 22, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Jun Seok Seong, Byeong Kyun Choi, Ku Hyun
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Patent number: 10586828Abstract: A light emitting element of an embodiment may comprise: a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, and first and second electrodes placed on the first and second conductive semiconductor layers respectively, wherein the light emitting structure includes a first mesa region, the first conductive type semiconductor layer includes a second mesa region, and the first electrode includes: a first region which is a partial region of the upper surface of the second mesa region; a second region which is the side surface of the second mesa region; and a third region arranged to extend from the edge of the side surface of the second mesa region, wherein the first, second, and third regions are formed such that the thickness of the first region (d1), the second region (d2), and the third region (d3) have a ratio of d1:d2:d3=1:0.9˜1.1:1.Type: GrantFiled: December 30, 2015Date of Patent: March 10, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Su Hyoung Son, Keon Hwa Lee, Byeong Kyun Choi, Kwang Ki Choi
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Publication number: 20200066938Abstract: An embodiment provides a semiconductor element, which comprises: a plurality of semiconductor structures, each of which comprises a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and a first recess extending through the second conductive semiconductor layer and the active layer to a partial area of the first conductive semiconductor layer; a second recess disposed between the plurality of semiconductor structures; a first electrode disposed at the first recess and electrically connected to the first conductive semiconductor layer; a reflective layer disposed under the second conductive semiconductor layer; and a protrusion part disposed on the second recess and protruding higher than the upper surfaces of the semiconductor structures, wherein a surface, on which the first electrode contacts the first conductive semiconductor layer in the first recess, is 300Type: ApplicationFiled: November 10, 2017Publication date: February 27, 2020Inventors: Jun Seok SEONG, Byeong Kyun CHOI, Ku HYUN
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Patent number: 10186640Abstract: Provided in one embodiment is a light emitting diode comprising: a light emitting structure including a first conductive semiconductor layer, an active layer on top of the first conductive semiconductor layer, and a second conductive semiconductor layer on top of the active layer; a first electrode arranged on a portion of the first conductive semiconductor layer; an insulating layer, which is arranged on a portion of the first electrode, the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, and which has a DBR structure; and a second electrode arranged on the second conductive semiconductor layer, wherein the first electrode comes into contact with the insulating layer via a first surface and is exposed to the insulating layer via a second surface opposite the first surface.Type: GrantFiled: December 24, 2015Date of Patent: January 22, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Keon Hwa Lee, Byeong Kyun Choi
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Publication number: 20180090539Abstract: A light emitting element of an embodiment may comprise: a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, and first and second electrodes placed on the first and second conductive semiconductor layers respectively, wherein the light emitting structure includes a first mesa region, the first conductive type semiconductor layer includes a second mesa region, and the first electrode includes: a first region which is a partial region of the upper surface of the second mesa region; a second region which is the side surface of the second mesa region; and a third region arranged to extend from the edge of the side surface of the second mesa region, wherein the first, second, and third regions are formed such that the thickness of the first region (d1), the second region (d2), and the third region (d3) have a ratio of d1:d2:d3=1:0.9˜1.1:1.Type: ApplicationFiled: December 30, 2015Publication date: March 29, 2018Applicant: LG INNOTEK CO., LTD.Inventors: Su Hyoung SON, Keon Hwa LEE, Byeong Kyun CHOI, Kwang Ki CHOI
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Publication number: 20170338380Abstract: Provided in one embodiment is a light emitting diode comprising: a light emitting structure including a first conductive semiconductor layer, an active layer on top of the first conductive semiconductor layer, and a second conductive semiconductor layer on top of the active layer; a first electrode arranged on a portion of the first conductive semiconductor layer; an insulating layer, which is arranged on a portion of the first electrode, the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, and which has a DBR structure; and a second electrode arranged on the second conductive semiconductor layer, wherein the first electrode comes into contact with the insulating layer via a first surface and is exposed to the insulating layer via a second surface opposite the first surface.Type: ApplicationFiled: December 24, 2015Publication date: November 23, 2017Inventors: Keon Hwa LEE, Byeong Kyun CHOI
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Patent number: 9406844Abstract: Provided is a light emitting device. The light emitting device includes a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. A first electrode is connected to the first conductive type semiconductor layer and includes first pad, plurality of first bridge portions and plurality of first contact portions. A current spreading layer is on a top surface of the second conductive type semiconductor layer. An insulation layer is on an upper surface of the first conductive type semiconductor layer and a top surface of the current spreading layer. A second electrode is on a top surface of the current spreading layer. The plurality of first bridge portions are extended from the first pad at an acute angle to each other.Type: GrantFiled: October 21, 2014Date of Patent: August 2, 2016Assignee: LG Innotek Co., Ltd.Inventors: Byeong Kyun Choi, Sung Kyoon Kim, Woo Sik Lim, Sung Ho Choo
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Patent number: 9349919Abstract: Disclosed are a light emitting device. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode disposed in an opening portion of the light emitting structure and contacted with a portion of the first conductive type semiconductor layer, an insulating layer covering the first electrode, a second electrode disposed connected to the second conductive type semiconductor layer and first electrode layer is connected to the second conductive type semiconductor layer and the second electrode. The first electrode layer is disposed on a top surface of the second conductive type semiconductor layer and a top surface of the insulating layer. The second electrode is not vertically overlapped with the first electrode.Type: GrantFiled: December 30, 2013Date of Patent: May 24, 2016Assignee: LG Innotek Co., Ltd.Inventors: Woo Sik Lim, Sung Ho Choo, Byeong Kyun Choi