Patents by Inventor Byeong Park

Byeong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124495
    Abstract: The present disclosure provides a novel compound represented by the following Chemical Formula 1, and an organic light emitting device including the same: wherein R1, R2, and n1 are described herein.
    Type: Application
    Filed: December 3, 2021
    Publication date: April 18, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Byeong Yun Lim, Jaechol Lee, Yongwook Kim, Soyoung Yu, Shin Sung Kim, Young Kwang Kim, Hyungil Park
  • Patent number: 11955123
    Abstract: A speech recognition system includes: a speech processor configured to identify an intention of a user included in an utterance of the user; a controller configured to identify whether a function corresponding to the intention of the utterance is performable, and if the function corresponding to the intention of the utterance is not performable, generate spoken text for requesting an other speech recognition system to perform the function corresponding to the intention of the user; and an utterance generator configured to convert the spoken text into a speech signal of an inaudible frequency band.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: April 9, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Minjae Park, Sungwang Kim, Byeong Yeol Kim
  • Publication number: 20240101578
    Abstract: The present disclosure provides a novel compound represented by the following Chemical Formula 1, and an organic light emitting device including the same: wherein A1 to A4, X, Y, n1 and n2 are described herein.
    Type: Application
    Filed: March 8, 2022
    Publication date: March 28, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Byeong Yun Lim, Jaechol Lee, Yongwook Kim, Soyoung Yu, Shin Sung Kim, Young Kwang Kim, Hyungil Park
  • Patent number: 9752205
    Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: September 5, 2017
    Assignees: POSCO, RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY
    Inventors: Sang-Won Kim, Sang-Hoon Yoon, Seong Hoon Yi, Young-Geun Son, Eon-Byeong Park, Oh Joon Kwon, Sang-Wook Ha, Seung-Dueg Choi, Gab-Sik Byun
  • Publication number: 20160068923
    Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.
    Type: Application
    Filed: November 17, 2015
    Publication date: March 10, 2016
    Inventors: Sang-Won Kim, Sang-Hoon Yoon, Seong Hoon Yi, Young-Geun Son, Eon-Byeong Park, Oh Joon Kwon, Sang-Wook Ha, Seung-Dueg Choi, Gab-Sik Byun
  • Patent number: 9222157
    Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 29, 2015
    Assignees: POSCO, RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY
    Inventors: Sang-Won Kim, Gab-Sik Byun, Young-Geun Son, Eon-Byeong Park, Sang-Hoon Yoon, Sang-Wook Ha, Oh-Joon Kwon, Seung-Dueg Choi, Seong Hoon Yi
  • Patent number: 9204583
    Abstract: A cylindrical electromagnetic bandgap to reduce electromagnetic interference of a cable and a coaxial cable having the same includes a conductor patch having a curved surface to be spaced apart from the surface of the cylindrical cable to an outer side by a predetermined gap distance, and a via connecting the surface of the cylindrical cable to the conductor patch.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: December 1, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun Ho Park, Hark Byeong Park
  • Patent number: 9094240
    Abstract: Disclosed herein are a passive equalizer and a high-speed digital signal transmission system, including first and second impedances connected in series to a first transfer line, third and fourth impedances connected in series to a second transfer line, a first inductor connected in parallel between the first impedance and the second impedance, a second inductor connected in parallel between the third impedance and the fourth impedance, and a resistor connected in series between the first inductor and the second inductor.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: July 28, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eak Hwan Song, Young Kun Kwon, Won Seob Kim, Hark Byeong Park, Hyun Sik Yun, Eun Seok Hong, Chul Soon Hwang
  • Publication number: 20140314136
    Abstract: Disclosed herein are a passive equalizer and a high-speed digital signal transmission system, including first and second impedances connected in series to a first transfer line, third and fourth impedances connected in series to a second transfer line, a first inductor connected in parallel between the first impedance and the second impedance, a second inductor connected in parallel between the third impedance and the fourth impedance, and a resistor connected in series between the first inductor and the second inductor.
    Type: Application
    Filed: April 21, 2014
    Publication date: October 23, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eak Hwan SONG, Young Kun KWON, Won Seob KIM, Hark Byeong PARK, Hyun Sik YUN, Eun Seok HONG, Chul Soon HWANG
  • Publication number: 20130146185
    Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein a is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.
    Type: Application
    Filed: June 27, 2011
    Publication date: June 13, 2013
    Applicant: POSCO
    Inventors: Sang-Won Kim, Gab-Sik Byun, Young-Geun Son, Eon-Byeong Park, Sang-Hoon Yoon, Sang-Wook Ha, Oh-Joon Kwon, Seung-Dueg Choi, Seong Hoon Yi
  • Publication number: 20120312578
    Abstract: A cylindrical electromagnetic bandgap to reduce electromagnetic interference of a cable and a coaxial cable having the same includes a conductor patch having a curved surface to be spaced apart from the surface of the cylindrical cable to an outer side by a predetermined gap distance, and a via connecting the surface of the cylindrical cable to the conductor patch.
    Type: Application
    Filed: May 30, 2012
    Publication date: December 13, 2012
    Applicant: Samsung Electronics Co. Ltd.
    Inventors: Hyun Ho PARK, Hark Byeong Park
  • Patent number: 8194416
    Abstract: Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: June 5, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hark Byeong Park, Byong Su Seol, Hyung Geun Kim, Hyun Ho Park, Jong Sung Lee, Hyung Seok Lee, Young Jun Moon
  • Patent number: 7696933
    Abstract: A radio receiving apparatus deterioration of a receiving sensitivity of an antenna used in the radio receiving apparatus due to noise generated from a circuit board disposed within the radio receiving apparatus. The radio receiving apparatus includes a body, a printed circuit board provided within the body, an antenna provided at an area outside of the body and adapted to receive an external signal, and a noise attenuation member provided at the printed circuit board and adapted to attenuate noise generated from the printed circuit board, to prevent deterioration in the receiving sensitivity of the antenna.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: April 13, 2010
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Hark Byeong Park, Byong Su Seol, Huyn Ho Park
  • Publication number: 20090179712
    Abstract: An electric apparatus capable of stably transmitting signals in a high frequency band (high speed signals) by preventing distortion of a signal waveform through impedance control is disclosed. The electric apparatus includes a case having a signal line which transmits signals between electronic parts, a dielectric deposited on the case and the signal line, and a ground portion disposed on the dielectric.
    Type: Application
    Filed: September 30, 2008
    Publication date: July 16, 2009
    Applicant: Samsung Electronics Co.. Ltd.
    Inventors: Tae Sun Jang, Hark Byeong Park, Jong Sung Lee, Hyung Geun Kim
  • Publication number: 20090059498
    Abstract: An electronic appliance to achieve an increased rigidity thereof with a simplified manner without any change in design and configuration and a method for manufacturing the same. The electronic appliance includes a case defining the outer appearance of the electronic appliance, and a printed circuit board disposed in the case and having electronic elements mounted thereon. A resin is filled between the case and the printed circuit board.
    Type: Application
    Filed: June 9, 2008
    Publication date: March 5, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeo Woo Jeong, Tae Sang Park, Young Jun Moon, Hark Byeong Park
  • Patent number: 7492603
    Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: February 17, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byong-su Seol, Hark-byeong Park, Hyung-geun Kim
  • Publication number: 20080198567
    Abstract: Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.
    Type: Application
    Filed: January 7, 2008
    Publication date: August 21, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hark Byeong PARK, Byong Su Seol, Hyung Geun Kim, Hyun Ho Park, Jong Sung Lee, Hyung Seok Lee, Young Jun Moon
  • Publication number: 20080174513
    Abstract: A radio receiving apparatus deterioration of a receiving sensitivity of an antenna used in the radio receiving apparatus due to noise generated from a circuit board disposed within the radio receiving apparatus. The radio receiving apparatus includes a body, a printed circuit board provided within the body, an antenna provided at an area outside of the body and adapted to receive an external signal, and a noise attenuation member provided at the printed circuit board and adapted to attenuate noise generated from the printed circuit board, to prevent deterioration in the receiving sensitivity of the antenna.
    Type: Application
    Filed: May 10, 2007
    Publication date: July 24, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hark Byeong PARK, Byong Su SEOL, Huyn Ho PARK
  • Publication number: 20070125768
    Abstract: A heater unit is provided, the heater unit equipped with an induction heating coil and an electric heater selectively operated based on kind and state of a load of a cooking vessel placed on the heater unit. The kind is determined by an input current inputted when a load-type determination unit causes the induction heating coil to be operated and a resonance current flowing into the induction heating coil. The state is determined by a temperature change of the heater unit when a load-state determination unit allows the electric heater to generate heat, and the induction heating coil and the electric heater are selectively operated based on the determined kind and state of the load. Accordingly, a user needs not to scrupulously determine the kind of the cooking vessel and the electric cooker is not operated under a no-load state to prevent occurrence of safety accidents.
    Type: Application
    Filed: September 29, 2006
    Publication date: June 7, 2007
    Applicant: LG ELECTRONICS INC.
    Inventors: Eui KIM, Seung RYU, Doo OH, Byeong PARK
  • Publication number: 20060191908
    Abstract: Disclosed herein is an electric range. The electric range comprises a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device, a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside, and at least one heat spread clip to fix the semiconductor chip to the heat sink to conduct the heat of the semiconductor chip to the heat sink.
    Type: Application
    Filed: August 16, 2005
    Publication date: August 31, 2006
    Inventors: Byeong Park, Dong Kwag