Patents by Inventor Byeong Park
Byeong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240124495Abstract: The present disclosure provides a novel compound represented by the following Chemical Formula 1, and an organic light emitting device including the same: wherein R1, R2, and n1 are described herein.Type: ApplicationFiled: December 3, 2021Publication date: April 18, 2024Applicant: LG Chem, Ltd.Inventors: Byeong Yun Lim, Jaechol Lee, Yongwook Kim, Soyoung Yu, Shin Sung Kim, Young Kwang Kim, Hyungil Park
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Patent number: 11955123Abstract: A speech recognition system includes: a speech processor configured to identify an intention of a user included in an utterance of the user; a controller configured to identify whether a function corresponding to the intention of the utterance is performable, and if the function corresponding to the intention of the utterance is not performable, generate spoken text for requesting an other speech recognition system to perform the function corresponding to the intention of the user; and an utterance generator configured to convert the spoken text into a speech signal of an inaudible frequency band.Type: GrantFiled: December 1, 2021Date of Patent: April 9, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Minjae Park, Sungwang Kim, Byeong Yeol Kim
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Publication number: 20240101578Abstract: The present disclosure provides a novel compound represented by the following Chemical Formula 1, and an organic light emitting device including the same: wherein A1 to A4, X, Y, n1 and n2 are described herein.Type: ApplicationFiled: March 8, 2022Publication date: March 28, 2024Applicant: LG Chem, Ltd.Inventors: Byeong Yun Lim, Jaechol Lee, Yongwook Kim, Soyoung Yu, Shin Sung Kim, Young Kwang Kim, Hyungil Park
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Patent number: 9752205Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.Type: GrantFiled: November 17, 2015Date of Patent: September 5, 2017Assignees: POSCO, RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGYInventors: Sang-Won Kim, Sang-Hoon Yoon, Seong Hoon Yi, Young-Geun Son, Eon-Byeong Park, Oh Joon Kwon, Sang-Wook Ha, Seung-Dueg Choi, Gab-Sik Byun
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Publication number: 20160068923Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.Type: ApplicationFiled: November 17, 2015Publication date: March 10, 2016Inventors: Sang-Won Kim, Sang-Hoon Yoon, Seong Hoon Yi, Young-Geun Son, Eon-Byeong Park, Oh Joon Kwon, Sang-Wook Ha, Seung-Dueg Choi, Gab-Sik Byun
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Patent number: 9222157Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.Type: GrantFiled: June 27, 2011Date of Patent: December 29, 2015Assignees: POSCO, RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGYInventors: Sang-Won Kim, Gab-Sik Byun, Young-Geun Son, Eon-Byeong Park, Sang-Hoon Yoon, Sang-Wook Ha, Oh-Joon Kwon, Seung-Dueg Choi, Seong Hoon Yi
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Patent number: 9204583Abstract: A cylindrical electromagnetic bandgap to reduce electromagnetic interference of a cable and a coaxial cable having the same includes a conductor patch having a curved surface to be spaced apart from the surface of the cylindrical cable to an outer side by a predetermined gap distance, and a via connecting the surface of the cylindrical cable to the conductor patch.Type: GrantFiled: May 30, 2012Date of Patent: December 1, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyun Ho Park, Hark Byeong Park
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Patent number: 9094240Abstract: Disclosed herein are a passive equalizer and a high-speed digital signal transmission system, including first and second impedances connected in series to a first transfer line, third and fourth impedances connected in series to a second transfer line, a first inductor connected in parallel between the first impedance and the second impedance, a second inductor connected in parallel between the third impedance and the fourth impedance, and a resistor connected in series between the first inductor and the second inductor.Type: GrantFiled: April 21, 2014Date of Patent: July 28, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eak Hwan Song, Young Kun Kwon, Won Seob Kim, Hark Byeong Park, Hyun Sik Yun, Eun Seok Hong, Chul Soon Hwang
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Publication number: 20140314136Abstract: Disclosed herein are a passive equalizer and a high-speed digital signal transmission system, including first and second impedances connected in series to a first transfer line, third and fourth impedances connected in series to a second transfer line, a first inductor connected in parallel between the first impedance and the second impedance, a second inductor connected in parallel between the third impedance and the fourth impedance, and a resistor connected in series between the first inductor and the second inductor.Type: ApplicationFiled: April 21, 2014Publication date: October 23, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eak Hwan SONG, Young Kun KWON, Won Seob KIM, Hark Byeong PARK, Hyun Sik YUN, Eun Seok HONG, Chul Soon HWANG
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Publication number: 20130146185Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein a is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.Type: ApplicationFiled: June 27, 2011Publication date: June 13, 2013Applicant: POSCOInventors: Sang-Won Kim, Gab-Sik Byun, Young-Geun Son, Eon-Byeong Park, Sang-Hoon Yoon, Sang-Wook Ha, Oh-Joon Kwon, Seung-Dueg Choi, Seong Hoon Yi
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Publication number: 20120312578Abstract: A cylindrical electromagnetic bandgap to reduce electromagnetic interference of a cable and a coaxial cable having the same includes a conductor patch having a curved surface to be spaced apart from the surface of the cylindrical cable to an outer side by a predetermined gap distance, and a via connecting the surface of the cylindrical cable to the conductor patch.Type: ApplicationFiled: May 30, 2012Publication date: December 13, 2012Applicant: Samsung Electronics Co. Ltd.Inventors: Hyun Ho PARK, Hark Byeong Park
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Patent number: 8194416Abstract: Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.Type: GrantFiled: January 7, 2008Date of Patent: June 5, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Hark Byeong Park, Byong Su Seol, Hyung Geun Kim, Hyun Ho Park, Jong Sung Lee, Hyung Seok Lee, Young Jun Moon
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Patent number: 7696933Abstract: A radio receiving apparatus deterioration of a receiving sensitivity of an antenna used in the radio receiving apparatus due to noise generated from a circuit board disposed within the radio receiving apparatus. The radio receiving apparatus includes a body, a printed circuit board provided within the body, an antenna provided at an area outside of the body and adapted to receive an external signal, and a noise attenuation member provided at the printed circuit board and adapted to attenuate noise generated from the printed circuit board, to prevent deterioration in the receiving sensitivity of the antenna.Type: GrantFiled: May 10, 2007Date of Patent: April 13, 2010Assignee: Samsung Electronics Co., LtdInventors: Hark Byeong Park, Byong Su Seol, Huyn Ho Park
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Publication number: 20090179712Abstract: An electric apparatus capable of stably transmitting signals in a high frequency band (high speed signals) by preventing distortion of a signal waveform through impedance control is disclosed. The electric apparatus includes a case having a signal line which transmits signals between electronic parts, a dielectric deposited on the case and the signal line, and a ground portion disposed on the dielectric.Type: ApplicationFiled: September 30, 2008Publication date: July 16, 2009Applicant: Samsung Electronics Co.. Ltd.Inventors: Tae Sun Jang, Hark Byeong Park, Jong Sung Lee, Hyung Geun Kim
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Publication number: 20090059498Abstract: An electronic appliance to achieve an increased rigidity thereof with a simplified manner without any change in design and configuration and a method for manufacturing the same. The electronic appliance includes a case defining the outer appearance of the electronic appliance, and a printed circuit board disposed in the case and having electronic elements mounted thereon. A resin is filled between the case and the printed circuit board.Type: ApplicationFiled: June 9, 2008Publication date: March 5, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jeo Woo Jeong, Tae Sang Park, Young Jun Moon, Hark Byeong Park
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Patent number: 7492603Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.Type: GrantFiled: October 5, 2005Date of Patent: February 17, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Byong-su Seol, Hark-byeong Park, Hyung-geun Kim
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Publication number: 20080198567Abstract: Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.Type: ApplicationFiled: January 7, 2008Publication date: August 21, 2008Applicant: Samsung Electronics Co., Ltd.Inventors: Hark Byeong PARK, Byong Su Seol, Hyung Geun Kim, Hyun Ho Park, Jong Sung Lee, Hyung Seok Lee, Young Jun Moon
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Publication number: 20080174513Abstract: A radio receiving apparatus deterioration of a receiving sensitivity of an antenna used in the radio receiving apparatus due to noise generated from a circuit board disposed within the radio receiving apparatus. The radio receiving apparatus includes a body, a printed circuit board provided within the body, an antenna provided at an area outside of the body and adapted to receive an external signal, and a noise attenuation member provided at the printed circuit board and adapted to attenuate noise generated from the printed circuit board, to prevent deterioration in the receiving sensitivity of the antenna.Type: ApplicationFiled: May 10, 2007Publication date: July 24, 2008Applicant: Samsung Electronics Co., Ltd.Inventors: Hark Byeong PARK, Byong Su SEOL, Huyn Ho PARK
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Publication number: 20070125768Abstract: A heater unit is provided, the heater unit equipped with an induction heating coil and an electric heater selectively operated based on kind and state of a load of a cooking vessel placed on the heater unit. The kind is determined by an input current inputted when a load-type determination unit causes the induction heating coil to be operated and a resonance current flowing into the induction heating coil. The state is determined by a temperature change of the heater unit when a load-state determination unit allows the electric heater to generate heat, and the induction heating coil and the electric heater are selectively operated based on the determined kind and state of the load. Accordingly, a user needs not to scrupulously determine the kind of the cooking vessel and the electric cooker is not operated under a no-load state to prevent occurrence of safety accidents.Type: ApplicationFiled: September 29, 2006Publication date: June 7, 2007Applicant: LG ELECTRONICS INC.Inventors: Eui KIM, Seung RYU, Doo OH, Byeong PARK
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Publication number: 20060191908Abstract: Disclosed herein is an electric range. The electric range comprises a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device, a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside, and at least one heat spread clip to fix the semiconductor chip to the heat sink to conduct the heat of the semiconductor chip to the heat sink.Type: ApplicationFiled: August 16, 2005Publication date: August 31, 2006Inventors: Byeong Park, Dong Kwag