Patents by Inventor Byeongbae Lee

Byeongbae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240061458
    Abstract: A system-on-chip according to an embodiment includes a core including a header switch circuit configured to transmit a power supply voltage applied to a first power rail as a supply voltage to a second power rail and a logic circuit configured to operate based on the supply voltage from the second power rail, and a low-dropout (LDO) regulator configured to regulate a magnitude of first current output to the second power rail based on a change in the supply voltage, wherein the LDO regulator is further configured to control on/off of a plurality of first header switches included in the header switch circuit based on an amount of the change in the supply voltage.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 22, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seki KIM, Shangho KIM, Yongjin LEE, Hyongmin LEE, Dongha LEE, Byeongbae LEE, Sungyong LEE
  • Patent number: 11846958
    Abstract: A system-on-chip according to an embodiment includes a core including a header switch circuit configured to transmit a power supply voltage applied to a first power rail as a supply voltage to a second power rail and a logic circuit configured to operate based on the supply voltage from the second power rail, and a low-dropout (LDO) regulator configured to regulate a magnitude of first current output to the second power rail based on a change in the supply voltage, wherein the LDO regulator is further configured to control on/off of a plurality of first header switches included in the header switch circuit based on an amount of the change in the supply voltage.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: December 19, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seki Kim, Sangho Kim, Yongjin Lee, Hyongmin Lee, Dongha Lee, Byeongbae Lee, Sungyong Lee
  • Publication number: 20220404853
    Abstract: A system-on-chip according to an embodiment includes a core including a header switch circuit configured to transmit a power supply voltage applied to a first power rail as a supply voltage to a second power rail and a logic circuit configured to operate based on the supply voltage from the second power rail, and a low-dropout (LDO) regulator configured to regulate a magnitude of first current output to the second power rail based on a change in the supply voltage, wherein the LDO regulator is further configured to control on/off of a plurality of first header switches included in the header switch circuit based on an amount of the change in the supply voltage.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 22, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD,
    Inventors: Seki Kim, Sangho Kim, Yongjin Lee, Hyongmin Lee, Dongha Lee, Byeongbae Lee, Sungyong Lee