Patents by Inventor Byeong-Ho Cho
Byeong-Ho Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12015048Abstract: A display device includes a first substrate including a display area, a non-display area, and a plurality of pixel circuit units in the display area and the non-display area, a plurality of light emitting elements on the first substrate in the display area, the plurality of light emitting elements being electrically connected to the pixel circuit units, a hole mask layer on the first substrate and including a plurality of holes corresponding to the light emitting elements, a second substrate on the hole mask layer and including a plurality of open holes corresponding to the plurality of holes, and a plurality of light exit patterns in the plurality of the open holes of the second substrate corresponding to the plurality of holes, wherein each of the light exit patterns includes a first part in one of the plurality of open holes.Type: GrantFiled: January 6, 2022Date of Patent: June 18, 2024Assignee: Samsung Display Co., Ltd.Inventors: Joo Woan Cho, Dae Ho Song, Tae Hee Lee, Hyung Il Jeon, Byeong Hwa Choi
-
Publication number: 20240184119Abstract: A wearable device includes: a main frame configured to be mounted on a user's body; an image display module on the main frame and configured to display an image; a lens frame on an image display surface of the image display module, the lens frame being configured to refract image display light emitted from the image display module; a multi-channel lens forming an emission path of the image display light refracted by the lens frame for each of a plurality of channels; and an eyeball protection module on the main frame and configured to spray air, moisture, or a tear solution to the user's left and right eyes.Type: ApplicationFiled: August 10, 2023Publication date: June 6, 2024Inventors: Tae Hee LEE, Kyung Ho KIM, Young Seok SEO, Joo Woan CHO, Byeong Hwa CHOI
-
Patent number: 11999879Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at ?20° C. of about 50 ?m to about 100 ?m and a gel fraction of about 50% to about 75%.Type: GrantFiled: October 12, 2020Date of Patent: June 4, 2024Assignees: Samsung SDI Co., Ltd., Samsung Electronics Co., Ltd.Inventors: Ik Hwan Cho, Ji Ho Kim, Jee Hee Kim, Ji Won Kang, Byeong Do Kwak, Yong Tae Kim, Il Jin Kim, Sung Hyun Mun, Hyung Rang Moon, Seon Hee Shin, Gwang Hwan Lee, Woo Jin Lee, Jae Hyun Han
-
Publication number: 20240151361Abstract: A hydrogen supply method includes a two-side heat exchange mode in which both introducing a second fluid into a hydrogen storage part after the second fluid exchanges heat with a first fluid in a second heat exchanger in a state in which a compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in a thermal device are performed. The method also includes a one-side heat exchange mode in which one of introducing the second fluid into the hydrogen storage part after the second fluid exchanges heat with the first fluid in the second heat exchanger in a state in which the compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in the thermal device is performed.Type: ApplicationFiled: August 30, 2023Publication date: May 9, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Yeon Ho Kim, Hoon Mo Park, Kyung Moon Lee, Dong Hoon Nam, Ji Hye Park, Young Jin Cho, Jea Wan Kim, Byeong Soo Shin, Ji Hoon Lee, Ho Young Jeong, Suk Hoon Hong, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Ho Chan An
-
Publication number: 20240153513Abstract: A complex number quantization-based audio signal encoding method may comprise: estimating a scale factor for each subband of an input audio signal; performing complex magnitude scaling for each subband based on the scale factor; and performing polar quantization on a complex frequency coefficient for each subband, wherein the performing the polar quantization for each subband comprises applying two or more different magnitude quantization techniques based on the magnitude of the complex frequency coefficient scaled for each subband.Type: ApplicationFiled: November 6, 2023Publication date: May 9, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Byeong Ho CHO, Seung Kwon BEACK, Jong Mo SUNG, Tae Jin LEE, Woo Taek LIM, In Seon JANG
-
Publication number: 20240120324Abstract: An apparatus for fabricating a display panel, including a film fixing module configured to fix a stretched film on which a plurality of light emitting elements are arranged, a film pressurizing module configured to pressurize the stretched film, a first thickness detection module configured to detect, at each pressurization step, a modulus of elasticity and a change in thickness of the stretched film that is pressurized and stretched by the film pressurizing module, a second thickness detection module configured to detect, at each pressurization step, a change in thickness of an adhesive applied in a front direction of the stretched film, an image detection module configured to photograph the plurality of light emitting elements arranged on the stretched film for each pressurization step and to detect a change in arrangement information of the light emitting elements, and a main processor configured to database feature change information.Type: ApplicationFiled: September 6, 2023Publication date: April 11, 2024Inventors: Tae Hee LEE, Kyung Ho KIM, Young Seok SEO, Joo Woan CHO, Byeong Hwa CHO
-
Publication number: 20240120214Abstract: An apparatus for fabricating a display panel, the apparatus including: a loading module configured to accommodate a large-area fabricating substrate, the loading module being configured to adjust an inclination of the large-area fabricating substrate from a rear surface of the large-area fabricating substrate and to press the large-area fabricating substrate; and an element transfer module configured to transfer a plurality of light emitting elements or an integrated circuit onto the large-area fabricating substrate and configured to bond and press a wafer on which the plurality of light emitting elements or the at least one integrated circuit is located onto the large-area fabricating substrate.Type: ApplicationFiled: September 18, 2023Publication date: April 11, 2024Inventors: Tae Hee LEE, Kyung Ho KIM, Young Seok SEO, Joo Woan CHO, Byeong Hwa CHOI
-
Patent number: 11881227Abstract: A method, executed by a processor for compressing an audio signal in multiple layers, may comprise: (a) restoring, in a highest layer, an input audio signal as a first signal; (b) restoring, in at least one intermediate layer, a signal obtained by subtracting an upsampled signal, which is obtained by upsampling the audio signal restored in the highest layer or an immediately previous intermediate layer, from the input audio signal as a second signal; and (c) restoring, in a lowest layer, a signal obtained by subtracting an upsampled signal, which is obtained by upsampling the audio signal restored in an intermediate layer immediately before the lowest layer, from the input audio signal as a third signal, wherein the first signal, the second signal, and the third signal are combined to output a final restoration audio signal.Type: GrantFiled: January 13, 2023Date of Patent: January 23, 2024Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESERCH INSTITUTE, INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: In Seon Jang, Seung Kwon Beack, Jong Mo Sung, Tae Jin Lee, Woo Taek Lim, Byeong Ho Cho, Hong Goo Kang, Ji Hyun Lee, Chan Woo Lee, Hyung Seob Lim
-
Publication number: 20230298603Abstract: A method for encoding an input signal using N flow blocks (N is a natural number greater than or equal to 2) and (N?1) split block(s), which is performed by a processor, may comprise: transmitting, by a k-th flow block (k is a natural number greater than or equal to 1 and less than or equal to N?1) among the N flow blocks, a k-th transformation signal obtained by transforming a received signal into a latent representation to a k-th split block among the (N?1) split block(s); splitting, by the k-th split block, the k-th transformation signal by a predetermined ratio, into a first split signal and a second split signal; transmitting, by the k-th split block, the first split signal to a (k+1)-th flow block; and quantizing a signal transformed by an N-th flow block and the second split signals using a quantization block.Type: ApplicationFiled: January 4, 2023Publication date: September 21, 2023Inventors: In Seon JANG, Seung Kwon BEACK, Jong Mo SUNG, Tae Jin LEE, Woo Taek LIM, Byeong Ho CHO
-
Publication number: 20230267940Abstract: A method, executed by a processor for compressing an audio signal in multiple layers, may comprise: (a) restoring, in a highest layer, an input audio signal as a first signal; (b) restoring, in at least one intermediate layer, a signal obtained by subtracting an upsampled signal, which is obtained by upsampling the audio signal restored in the highest layer or an immediately previous intermediate layer, from the input audio signal as a second signal; and (c) restoring, in a lowest layer, a signal obtained by subtracting an upsampled signal, which is obtained by upsampling the audio signal restored in an intermediate layer immediately before the lowest layer, from the input audio signal as a third signal, wherein the first signal, the second signal, and the third signal are combined to output a final restoration audio signal.Type: ApplicationFiled: January 13, 2023Publication date: August 24, 2023Applicants: Electronics and Telecommunications Research Institute, Industry-Academic Cooperation Foundation, Yonsei UniversityInventors: In Seon JANG, Seung Kwon BEACK, Jong Mo SUNG, Tae Jin LEE, Woo Taek LIM, Byeong Ho CHO, Hong Goo KANG, Ji Hyun LEE, Chan Woo LEE, Hyung Seob LIM
-
Publication number: 20230267950Abstract: A generative adversarial network-based audio signal generation model for generating a high quality audio signal may comprise: a generator generating an audio signal with an external input; a harmonic-percussive separation model separating the generated audio signal into a harmonic component signal and a percussive component signal; and at least one discriminator evaluating whether each of the harmonic component signal and the percussive component signal is real or fake.Type: ApplicationFiled: January 13, 2023Publication date: August 24, 2023Applicants: Electronics and Telecommunications Research Institute, Industry-Academic Cooperation Foundation, Yonsei UniversityInventors: In Seon JANG, Seung Kwon BEACK, Jong Mo SUNG, Tae Jin LEE, Woo Taek LIM, Byeong Ho CHO, Hong Goo KANG, Ji Hyun LEE, Chan Woo LEE, Hyung Seob LIM
-
Patent number: 8288242Abstract: Methods are disclosed for fabricating an overlay vernier key. A method includes forming a pattern layer and an insulating layer over a semiconductor substrate. The insulating layer is etched to form insulating layer patterns to partially expose the pattern layer. Spacers are formed on sidewalls of the insulating layer patterns. The insulating layer patterns are removed while leaving the spacers to obtain a spacer-shaped etch mask. The pattern layer is etched using the spacer-shaped etch mask to form vernier patterns. At least one of the vernier patterns has a hollow shape.Type: GrantFiled: August 16, 2011Date of Patent: October 16, 2012Assignee: Hynix Semiconductor Inc.Inventors: Byeong Ho Cho, Sung Woo Ko
-
Publication number: 20110300713Abstract: Methods are disclosed for fabricating an overlay vernier key. A method includes forming a pattern layer and an insulating layer over a semiconductor substrate. The insulating layer is etched to form insulating layer patterns to partially expose the pattern layer. Spacers are formed on sidewalls of the insulating layer patterns. The insulating layer patterns are removed while leaving the spacers to obtain a spacer-shaped etch mask. The pattern layer is etched using the spacer-shaped etch mask to form vernier patterns. At least one of the vernier patterns has a hollow shape.Type: ApplicationFiled: August 16, 2011Publication date: December 8, 2011Applicant: Hynix Semiconductor Inc.Inventors: Byeong Ho CHO, Sung Woo KO
-
Patent number: 8045139Abstract: An exposure apparatus of a semiconductor device may include an exposure light source; an asymmetric adjustment filter for asymmetrically adjusting intensity of a light which passes through the exposure light source; a photomask for passing the light of which intensity is adjusted by the asymmetric adjustment filter; a projection lens for projecting the light passing through the photomask; and a wafer stage for mounting a wafer on which an image is formed by the light from the projection lens.Type: GrantFiled: December 13, 2007Date of Patent: October 25, 2011Assignee: Hynix Semiconductor Inc.Inventors: Byeong Ho Cho, Dong Sook Chang
-
Patent number: 7999399Abstract: An overlay vernier key includes a semiconductor substrate on which a cell region and a scribe lane region are defined, and a plurality of vernier patterns which are formed in the scribe lane region of the semiconductor substrate and arranged in a polygonal shape. Each of the vernier patterns has a hollow polygonal shape.Type: GrantFiled: December 29, 2006Date of Patent: August 16, 2011Assignee: Hynix Semiconductor Inc.Inventors: Byeong Ho Cho, Sung Woo Ko
-
Publication number: 20090002657Abstract: An exposure apparatus of a semiconductor device may include an exposure light source; an asymmetric adjustment filter for asymmetrically adjusting intensity of a light which passes through the exposure light source; a photomask for passing the light of which intensity is adjusted by the asymmetric adjustment filter; a projection lens for projecting the light passing through the photomask; and a wafer stage for mounting a wafer on which an image is formed by the light from the projection lens.Type: ApplicationFiled: December 13, 2007Publication date: January 1, 2009Applicant: HYNIX SEMICONDUCTOR INC.Inventors: Byeong Ho Cho, Dong Sook Chang
-
Publication number: 20080003705Abstract: An overlay vernier key includes a semiconductor substrate on which a cell region and a scribe lane region are defined, and a plurality of vernier patterns which are formed in the scribe lane region of the semiconductor substrate and arranged in a polygonal shape. Each of the vernier patterns has a hollow polygonal shape.Type: ApplicationFiled: December 29, 2006Publication date: January 3, 2008Applicant: Hynix Semiconductor Inc.Inventors: Byeong Ho Cho, Sung Woo Ko
-
Publication number: 20070292776Abstract: A substrate includes an overlay vernier key structure that includes an outer pattern formed over one layer over a semiconductor substrate, as a reference for an overlay measurement, and an inner pattern comprising a cluster of vernier patterns formed over another layer.Type: ApplicationFiled: June 6, 2007Publication date: December 20, 2007Applicant: Hynix Semiconductor Inc.Inventors: Byeong Ho Cho, Yeong Bae Ahn
-
Patent number: 5294695Abstract: The present invention relates to a process for preparing a polyethylene naphthalate possessed with high viscosity, characterized by sloving of various problems of the prior art by controlling the rate of the polycondensation reaction.Particularly, the present invention provides a process for preparing polyethylene naphthalate from an esterification reaction product of naphtalene dicarboxylic acid or an alkyl ester thereof and a diol, which comprises polycondensing the esterification reaction product in the presence of a polycondensation catalyst in two steps wherein the first step is carried out at a pressure ranging from 500 to 30 torr and the second step is carried out at a pressure ranging from 10 to 0.1 torr with controlling the reaction rate such that the differential increase of the intrinsic viscosity of the resultant polymer can satisfy the following equations:IV(t.sub.1)-IV(t.sub.0)<0.4 dl/g (1)IV(t.sub.2)-IV(t.sub.0)>0.3 dl/g (2)wherein: IV(t.sub.Type: GrantFiled: March 15, 1993Date of Patent: March 15, 1994Assignee: SKC LimitedInventors: Kwan-Kyung Lee, Byeong-Ho Cho, Yong-Won Kim
-
Patent number: 5288781Abstract: The present invention relates to a biaxially oriented polyester film comprising a metallic alkylbenzene sulfonate derivative of formula(I), polyethylene glycol and, optionally, bis(4-.beta.-hydroxyalkoxyphenyl) sulfones of formula(II), which has improved antistatic property, clarity, mechanical properties and heat resistance: ##STR1## wherein: R represents an optionally substituted C.sub.8-25 alkyl group;M represents an alkali or alkali earth metal;m is an integer of 100 or fewer; andn is an integer from 1 to 10.Type: GrantFiled: October 19, 1992Date of Patent: February 22, 1994Assignee: SKC LimitedInventors: Kwang-Jin Song, Byeong-Ho Cho, Yong-Won Kim