Abstract: There is provided a package substrate including: a substrate on which a circuit layer and an insulating layer are stacked; a metal post provided in an outside region of at least any one of an upper surface and a lower surface of the substrate; an electronic component mounted in a cavity formed by the metal post; and a metal lid bonded to an upper portion of the metal post.

Abstract: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.

Abstract: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.

Abstract: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate.

Abstract: Disclosed herein is a furnace, including: a body having a space formed therein; a plurality of thermocouples disposed in the body and vertically movably coupled with the body; a plurality of heating elements dispose in the body; and a control unit that receives temperature data from the thermocouples to control temperature of the heating elements, whereby the furnace can measure and control the temperature for each portion of the internal space to form uniform temperature distribution, in particular, make temperature distribution of the heat applied to the fired matter uniform to obtain high-quality fired matter.

Abstract: Disclosed are a probe substrate and a probe card using the same. The probe substrate includes a ceramic stack structure stacked with a plurality of layers; vias disposed in the ceramic stack structure to perform inner-layer connection, and pads electrically connected to the vias; a contact opening disposed at the ceramic stack structure, and partially exposing the pads; and contact pads disposed at side walls of the contact opening, electrically connected to the pads, and electrically connected to pogo pins.

Abstract: The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

Abstract: There is provided a method of manufacturing a ceramic substrate for a probe card and a ceramic substrate for a probe card. The method includes preparing a ceramic substrate having a via electrode provided therein; filling a void formed between the ceramic substrate and the via electrode with a filling material including thermosetting resin; and curing the filling material. Since the void formed between the ceramic substrate and the via electrode is removed, fixation strength between the via electrode and a probe tip can be increased and a defect such as a hollow at the periphery of the via electrode can be prevented.

Abstract: A ceramic firing furnace is provided. A uniform gas atmosphere is formed in the ceramic firing furnace to thus minimize a defective ceramic substrate when the ceramic substrate is fired. The ceramic firing furnace includes: a case having an internal space in which a shaped body is disposed; a heating element disposed in the interior of the case and radiating heat; and a plurality of air supply units fastened through the case such that the plurality of air supply units are rotatable by an external force, and supplying a gas to the internal space of the case.

Abstract: Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets.

Abstract: Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.

Abstract: There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided.

Abstract: There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.

Abstract: The present invention relates to a ceramic substrate and a method of manufacturing the same. The ceramic substrate includes: a ceramic base; an electrode pattern formed on at least one surface of the ceramic base at predetermined internal and external depths; and electrode material filled in the inside of the electrode pattern. The method of manufacturing the ceramic substrate includes: coating first electrode material on at least one surface of a ceramic base; forming a surface layer built-in electrode pattern by pressurizing the coated first electrode material; primarily firing the ceramic base on which the surface layer built-in electrode pattern is formed; coating second electrode material on the surface layer built-in electrode pattern; and secondarily firing the ceramic base on which the second electrode material is coated.

Abstract: The present invention relates to a multilayer ceramic substrate including: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias provided in respective ceramic layers, the ceramic stacked structure having surface reforming layers 111a formed by removal of glass component on the surfaces of upper and lower parts of the ceramic layers; and contact pads formed on a top surface and a bottom surface of the ceramic stacked structure so as to be electrically connected to the vias.

Abstract: The present invention relates to a multilayer ceramic board and manufacturing method thereof. The multilayer ceramic board includes: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias; diffused reflection preventing patterns which expose the vias provided on each of the uppermost ceramic layer and the lowermost ceramic layer, and are disposed on each of a top surface and a bottom surface of the ceramic stacked structure; and contact pads which are electrically connected to the vias exposed by the diffused reflection preventing patterns.

Abstract: The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

Abstract: Disclosed are a probe substrate and a probe card using the same. The probe substrate includes a ceramic stack structure stacked with a plurality of layers; vias disposed in the ceramic stack structure to perform inner-layer connection, and pads electrically connected to the vias; a contact opening disposed at the ceramic stack structure, and partially exposing the pads; and contact pads disposed at side walls of the contact opening, electrically connected to the pads, and electrically connected to pogo pins.

Abstract: There is provided a method of manufacturing a multilayer ceramic substrate, the method including: providing a non-sintered multilayer ceramic substrate having a plurality of low temperature sintering green sheets laminated therein; disposing a hard-to-sinter constraining green sheet on at least one of top and bottom surfaces of the non-sintered multilayer ceramic substrate; sintering the non-sintered multilayer ceramic substrate having the hard-to-sinter constraining layer disposed thereon; immersing the sintered multilayer ceramic substrate into an acidic solution; and activating a contact between the hard-to-sinter constraining layer and the acidic solution such that the hard-to-sinter constraining layer is removed.

Abstract: Provided is a method of fabricating a probe pin. In the method, a concave region for a probe pin is formed on a mold substrate. The surface roughness of the concave region is reduced to smooth the surface of the concave region. A release layer is formed on the surface of the concave region of the mold substrate. A plating process is performed to form a probe pin corresponding to the concave region. After the performing of the plating process, the mold substrate having the probe pin is disposed on a circuit substrate and the probe pin is connected to a desired portion of the circuit substrate. Thereafter, the mold substrate is separated from the probe pin in such a way that the mold substrate remains unchanged. Also, the separated mold substrate may be reused.