Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.

Abstract: The present invention relates to a connector which is disposed outside a case, the connector comprising: a terminal protruding at one end thereof into the case and protruding at the other end thereof out of the case; an inner housing coupled to the terminal so as to allow the terminal to protrude at the one end and the other end thereof; a pad disposed on one surface of the inner housing; and a housing completely surrounding the inner housing and the pad, wherein the housing comprises: a protrusion portion protruding from one surface of the case; and a mounting portion having a terminal groove in which the other protruding end of the terminal is placed.

Abstract: The present invention relates to a connector which is disposed outside a case, the connector comprising: a terminal protruding at one end thereof into the case and protruding at the other end thereof out of the case; an inner housing coupled to the terminal so as to allow the terminal to protrude at the one end and the other end thereof; a pad disposed on one surface of the inner housing; and a housing completely surrounding the inner housing and the pad, wherein the housing comprises: a protrusion portion protruding from one surface of the case; and a mounting portion having a terminal groove in which the other protruding end of the terminal is placed.

Abstract: A power semiconductor module is disclosed, comprising: a substrate mounted with a power semiconductor device and formed with a pattern; and an integrated terminal unit integrally assembled with a power terminal for applying power to the substrate and a body in which a signal terminal for inputting a signal to or outputting the signal from the substrate is made of an insulated resin material, wherein the integrated terminal unit can be mounted to the substrate to allow the power terminal and the signal terminal to be simultaneously connected to the substrate.

Abstract: A power semiconductor module is disclosed, comprising: a substrate mounted with a power semiconductor device and formed with a pattern; and an integrated terminal unit integrally assembled with a power terminal for applying power to the substrate and a body in which a signal terminal for inputting a signal to or outputting the signal from the substrate is made of an insulated resin material, wherein the integrated terminal unit can be mounted to the substrate to allow the power terminal and the signal terminal to be simultaneously connected to the substrate.

Abstract: A printed circuit board for high speed processing devices such as RAMBUS is disclosed. Adhesive means are interposed between a plurality of both-face copper clad laminates, and each of the adhesive means consists of a clad laminate and prepreg layers formed on both faces of the clad laminate. The sum total of the thicknesses of the clad laminates and the prepreg layers is smaller than that of the conventional printed circuit board. Therefore, when carrying out a pressing to attach the copper foils, the thickness deviations are decreased compared with the conventional case, and therefore, the occurrence of impedance defects can be prevented.

Abstract: Disclosed are a conversion coating composition for use in the surface treatment of a PCB and a conversion coating method using the same. The composition comprises 0.1-30 vol % of sulfuric acid; 0.1-15 vol % of hydrogen peroxide; 0.01-10 wt % of an organic acid; 0.1-30 wt % of a nitrogen compound; 0.01-10 wt % of an organic silicate and/or organic titanate; and 0.1-20 wt % of a film forming auxiliary, 0.1-30 wt % of an etching rate controller, 0.1-20 wt % of a reaction promoter and/or 0.1-20 g/l of a stabilizer. This composition is applied to a PCB at 10-60° C. for 1-10 min. The conversion coating film is superb in adhesive strength, acid resistance, and adhesion and can be formed with ease.