Patents by Inventor Byong Ho Kim

Byong Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120262
    Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
  • Publication number: 20100264008
    Abstract: The present invention provides a standby power cut-off switch which is directly installed in electric products such as TV sets, audio systems, computers, etc., so that even when a power plug is connected to an electrical outlet, supply of an external power to the electric products through the plug is completely interrupted (i.e.
    Type: Application
    Filed: November 18, 2008
    Publication date: October 21, 2010
    Inventor: Byong Ho Kim