Patents by Inventor Byoung-Rim Seo
Byoung-Rim Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9837361Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.Type: GrantFiled: October 5, 2015Date of Patent: December 5, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Byoung-rim Seo, Woon-bae Kim, Young-doo Jung
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Patent number: 9793309Abstract: Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.Type: GrantFiled: January 26, 2015Date of Patent: October 17, 2017Assignees: SAMSUNG ELECTRONICS CO., LTD., FUREX CO., LTD.Inventors: Byoung-rim Seo, Yoon-young Choi, Kyoung-sei Choi, Chang-soo Jin, Seung-kon Mok, Tae-weon Suh, Pyoung-wan Kim
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Publication number: 20160111376Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.Type: ApplicationFiled: October 5, 2015Publication date: April 21, 2016Inventors: Byoung-rim SEO, Woon-bae KIM, Young-doo JUNG
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Publication number: 20150340397Abstract: Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.Type: ApplicationFiled: January 26, 2015Publication date: November 26, 2015Applicant: FUREX CO., LTD.Inventors: Byoung-rim SEO, Yoon-young CHOI, Kyoung-sei CHOI, Chang-soo JIN, Seung-kon MOK, Tae-weon SUH, Pyoung-wan KIM
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Patent number: 8981514Abstract: A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.Type: GrantFiled: September 12, 2012Date of Patent: March 17, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Han-Sung Ryu, Byoung-Rim Seo, In-Won O
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Patent number: 8927316Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.Type: GrantFiled: September 3, 2013Date of Patent: January 6, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong, Han-Sung Ryu
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Patent number: 8902356Abstract: An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip.Type: GrantFiled: March 16, 2011Date of Patent: December 2, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Byoung-Rim Seo, Beoung-Ouk Min, Tae-Je Cho, Yung-Cheol Kong, Dong-Min Kim, Ji-Woong Park
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Publication number: 20140073079Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.Type: ApplicationFiled: September 3, 2013Publication date: March 13, 2014Inventors: Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong, Han-Sung Ryu
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Patent number: 8547471Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.Type: GrantFiled: March 10, 2011Date of Patent: October 1, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong, Han-Sung Ryu
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Publication number: 20130181314Abstract: A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.Type: ApplicationFiled: September 12, 2012Publication date: July 18, 2013Inventors: Han-Sung RYU, Byoung-Rim SEO, In-Won O
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Patent number: 8139145Abstract: Provided is a camera module providing EMS shielding, so that electromagnetic waves generated in the camera module are prevented from radiating to the outside and external electromagnetic waves or noise are prevented from flowing into the camera module. The camera module includes: a lens unit comprising at least one lens; an image sensor package including an image sensor chip having an image area where an image is formed in response to light passing through the lens unit; a housing surrounding the lens unit and the image sensor package, wherein the housing is electrically connected to the image sensor package and is formed of a conductive material; and a connection terminal disposed below the image sensor package and electrically connecting the image sensor package and a main board of an electronic device including the camera module.Type: GrantFiled: October 31, 2008Date of Patent: March 20, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Han-Sung Ryu, Byoung-Rim Seo, Yung-Cheol Kong
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Publication number: 20110285889Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.Type: ApplicationFiled: March 10, 2011Publication date: November 24, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong, Han-Sung Ryu
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Publication number: 20110267535Abstract: An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip.Type: ApplicationFiled: March 16, 2011Publication date: November 3, 2011Inventors: Byoung-Rim Seo, Beoung -Ouk Min, Tae-Je Cho, Yung-Cheol Kong, Dong-Min Kim, Ji-Woong Park
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Patent number: 7863702Abstract: An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.Type: GrantFiled: June 10, 2005Date of Patent: January 4, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Byoung-Rim Seo, Jae-Cheon Do, Yung-Cheol Kong, Seok-Won Lee
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Publication number: 20090115891Abstract: Provided is a camera module providing EMS shielding, so that electromagnetic waves generated in the camera module are prevented from radiating to the outside and external electromagnetic waves or noise are prevented from flowing into the camera module. The camera module includes: a lens unit comprising at least one lens; an image sensor package including an image sensor chip having an image area where an image is formed in response to light passing through the lens unit; a housing surrounding the lens unit and the image sensor package, wherein the housing is electrically connected to the image sensor package and is formed of a conductive material; and a connection terminal disposed below the image sensor package and electrically connecting the image sensor package and a main board of an electronic device including the camera module.Type: ApplicationFiled: October 31, 2008Publication date: May 7, 2009Applicant: Samsung Electronics Co., Ltd.Inventors: Han-Sung RYU, Byoung-Rim SEO, Yung-Cheol KONG
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Patent number: 7494292Abstract: An image sensor module structure includes an image sensor package, a housing, and an underfiller. The image sensor package includes a substrate having interconnection pads formed on an outermost edge. The housing includes a filter projecting from a bottom surface of a housing body. The projecting filter is attached on an image sensor chip using various adhesive patterns. Further, the underfiller is formed in a space between the housing body and the image sensor package.Type: GrantFiled: May 11, 2005Date of Patent: February 24, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Yung-Cheol Kong, Byoung-Rim Seo, Jae-Cheon Do
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Patent number: 7484901Abstract: The invention involves an image sensor camera module and a method of fabricating the image sensor camera module. The image sensor camera module uses a single-body type lens holder defined by a hollow cylindrical body having a shoulder protruding radially inwardly from an inner surface thereof. First and second lenses therein are spaced apart by a first spacer and a filter therein is spaced from the second lens by a second spacer. An image sensor is adhered to a lower rim of the body, and the filter is adhered to an upper rim thereof. All optical elements within the lens holder thus are affixed in fixed relative position compatible with a predefined focal length and axis. Moreover, the adhesively sealed interior of the body of the image sensor camera module prevents particulate contamination.Type: GrantFiled: July 7, 2005Date of Patent: February 3, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Byoung-Rim Seo, Jae-Cheon Doh, Yung-Cheol Kong, Seok-Won Lee
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Publication number: 20060028573Abstract: The invention involves an image sensor camera module and a method of fabricating the image sensor camera module. The image sensor camera module uses a single-body type lens holder defined by a hollow cylindrical body having a shoulder protruding radially inwardly from an inner surface thereof. First and second lenses therein are spaced apart by a first spacer and a filter therein is spaced from the second lens by a second spacer. An image sensor is adhered to a lower rim of the body, and the filter is adhered to an upper rim thereof. All optical elements within the lens holder thus are affixed in fixed relative position compatible with a predefined focal length and axis. Moreover, the adhesively sealed interior of the body of the image sensor camera module prevents particulate contamination.Type: ApplicationFiled: July 7, 2005Publication date: February 9, 2006Inventors: Byoung-Rim Seo, Jae-Cheon Doh, Yung-Cheol Kong, Seok-Won Lee
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Publication number: 20060006486Abstract: An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.Type: ApplicationFiled: June 10, 2005Publication date: January 12, 2006Inventors: Byoung-Rim Seo, Jae-Cheon Do, Yung-Cheol Kong, Seok-Won Lee
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Publication number: 20050285016Abstract: An image sensor module structure includes an image sensor package, a housing, and an underfiller. The image sensor package includes a substrate having interconnection pads formed on an outermost edge. The housing includes a filter projecting from a bottom surface of a housing body. The projecting filter is attached on an image sensor chip using various adhesive patterns. Further, the underfiller is formed in a space between the housing body and the image sensor package.Type: ApplicationFiled: May 11, 2005Publication date: December 29, 2005Inventors: Yung-Cheol Kong, Byoung-Rim Seo, Jae-Cheon Do