Patents by Inventor Byoungwook Jo

Byoungwook Jo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal-clad laminate
    Patent number: 8318315
    Abstract: The present invention relates to a flexible metal-clad laminate for a printed circuit board and a method of manufacturing the same. The flexible metal-clad laminate includes: a first polyimide layer that is disposed on one surface of the metal-clad and has thermal expansion coefficient of 20 ppm/K or less; and a second polyimide layer that is disposed on one surface of the first polyimide layer and has thermal expansion coefficient of 20 ppm/K or more, wherein a difference between the thermal expansion coefficients of the first and second polyimide layers is within 5 ppm/K and a glass transition temperature Tg of resin of the first polyimide layer is 300° C.<Tg<350° C., which is lower than a maximum curing temperature.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: November 27, 2012
    Assignee: SK Innovation Co., Ltd.
    Inventors: Hong Yoo, Daenyoun Kim, Cheolho Kim, Byoungwook Jo
  • METAL-CLAD LAMINATE
    Publication number: 20100255324
    Abstract: The present invention relates to a flexible metal-clad laminate for a printed circuit board and a method of manufacturing the same. The flexible metal-clad laminate includes: a first polyimide layer that is disposed on one surface of the metal-clad and has thermal expansion coefficient of 20 ppm/K or less; and a second polyimide layer that is disposed on one surface of the first polyimide layer and has thermal expansion coefficient of 20 ppm/K or more, wherein a difference between the thermal expansion coefficients of the first and second polyimide layers is within 5 ppm/K and a glass transition temperature Tg of resin of the first polyimide layer is 300° C.<Tg<350° C., which is lower than a maximum curing temperature.
    Type: Application
    Filed: December 8, 2008
    Publication date: October 7, 2010
    Applicant: SK ENERGY CO., LTD.
    Inventors: Hong Yoo, Daenyoun Kim, Cheolho Kim, Byoungwook Jo