Abstract: In the case of a gas in which several gases are mixed, a type and concentration of the gas may be incorrectly measured when measured using only an optical band-pass filter. The invention of the present application is directed to providing a technology in which a plurality of broadband band-pass filters having overlapping regions are provided to calculate a magnitude of absorption for each wavelength band for light passing through each broadband band-pass filter, thereby identifying the presence of a gas of interest and the presence of a gas other than the gas of interest.

Abstract: A roof airbag for a vehicle includes: an airbag cushion located at a roof panel of the vehicle and configured to be unfolded from a first side portion to a second side portion of the roof panel during an operation of the airbag cushion; a first seam portion extended in a direction intersected with an unfolded direction of the airbag cushion and allowing upper and lower surfaces of the airbag cushion to be in contact with each other; and an inflator coupled to the first side portion of the roof panel, and connected to the airbag cushion and configured to inject gas into the airbag cushion so as to allow the airbag cushion to be unfolded from the first side portion to the second side portion of the roof panel.

Abstract: A frame structure for a vehicle includes: an inner panel connected to a side member and defining an inner side of a rear part of the side member; an outer panel connected to a rear side of the side member and coupled to an outer side of the inner panel defining a closed cross-section together with the inner panel and defining an outer side of the rear part of the side member; an opening portion formed below the inner and outer panels partially opening the closed cross-section so that a front end of a rear suspension arm can be inserted into the opening portion; and a reinforcing member disposed in the opening portion defining the closed cross-section together with the outer panel and the inner panel and configured to close an internal space in the outer and inner panels.

Abstract: A frame structure for a purpose built vehicle (PBV) includes: two main side members extending while gradually rising toward a front of the PBV and extending in a front/rear direction to be disposed on either side of the PBV; two auxiliary side members respectively extending in a front/rear direction to be disposed on a lower side of the two main side members; a front cross member connecting the two auxiliary side members in a lateral direction of the PBV; and a plurality of vertical members respectively connecting the main side members and the auxiliary side members in a vertical direction.

Abstract: A frame for a purpose-built vehicle (PBV) includes: a front part frame positioned at a front side of a vehicle; a rear part frame positioned at a rear side of the vehicle; and a center part frame. The center part frame has a rectangular planar shape and is coupled between the front part frame and the rear part frame.

Abstract: An airbag maintains deployment performance of an airbag cushion installed in a structure for dividing an occupant compartment space. The airbag includes an airbag cushion that includes a plurality of deployment areas and a spacing part that is disposed at a position adjacent to the plurality of deployment areas and separates the plurality of deployment area from one another.

Abstract: The present invention relates to a method for preparing an alkali metal ion conductive chalcogenide-based solid electrolyte, a solid electrolyte prepared thereby, and an all-solid-state battery comprising the same.

Abstract: Provided are a hyperparameter optimizer and method for optimizing hyperparameters and a spiking neural network processing unit. The optimizer includes a statistical analyzer configured to receive training data and perform statistical analysis on the training data, an objective function generator configured to generate hyperparameter-specific objective functions by using a statistical analysis value of the statistical analyzer, and an optimal hyperparameter selector configured to select optimal hyperparameters according to certain rules on the basis of the hyperparameter-specific objective functions.

Abstract: A method for producing CAR-M1 macrophages expressing a chimeric antigen receptor in vitro and in vivo includes using a conjugate of a non-viral gene delivery system and a chimeric antigen receptor gene. The CAR-M1 macrophages are produced in vivo by delivering genes encoding a chimeric antigen receptor and IFN-?, specifically to macrophages in the body, and thus does not require culturing and preparing an in-vitro cellular therapeutic agent, thus reducing the manufacturing costs of therapeutic agents. The CAR-M1 macrophages are a safer therapy since a non-viral vector is used, as compared to the production of CAR-M1 macrophages by gene delivery using a viral vector, and are a novel therapeutic candidate having the advantage of high anticancer efficiency for solid cancers, due to CAR-M1 macrophages in which intrinsic properties of macrophages infiltrating solid cancers and cancer cell phagocytosis are improved.

Abstract: A semiconductor package may include a lower redistribution layer including a lower wiring and a lower via, an embedded region on the lower redistribution layer, a core layer on the lower redistribution layer and including a core via, and an under bump structure including an under bump pad on a lower surface of the lower redistribution layer and an under bump via connecting the lower wiring and the under bump pad, the under bump pad may overlap the under bump via, the lower via, and the core via in a plan view, and the under bump via may be spaced apart from at least one of the lower via and the core via in the plan view.

Abstract: A lens includes a lens unit; an intermediate layer configured to cover a surface portion of the lens unit; and a water-repellent layer, configured to cover a surface portion of the intermediate layer, including a base layer and an ultraviolet (UV) absorber disposed in the base layer.

Abstract: A vehicle parking method in a smart parking system is provided. The vehicle parking method includes measuring, by parked vehicles, inter-vehicle distance values by using sensors embedded therein, receiving, by a parking target vehicle, the inter-vehicle distance values from the parked vehicles by using vehicle-to-vehicle (V2V) communication, selecting one distance value from among the inter-vehicle distance values, and determining the selected distance value as a parking space, transmitting, by the parking target vehicle, a movement request message to two parked vehicles configuring the parking space by using the V2V communication, moving, by the two parked vehicles, based on the movement request message and extending the parking space to an available parking space, and performing, by the parking target vehicle, an automatic parking process for parking in the available parking space.

Abstract: A method of manufacturing a stacked structure includes forming a first metal buffer layer including crystal grains on a base substrate, forming a second metal buffer material layer on the first metal buffer layer, and crystallizing the second metal buffer material layer to form a second metal buffer layer, wherein the second metal buffer material layer includes crystal grains, and a density of the crystal grains of the second metal buffer material layer is lower than a density of the crystal grains of the first metal buffer layer.

Abstract: Provided is a method of automatically combining a farm vehicle with a work machine including confirming a current position of the work machine, moving a farm vehicle into a range having a predetermined radius around the current position, and controlling the farm vehicle, on the basis of a current position and direction of a first coupling unit included in the work machine, so that the first coupling unit and a second coupling unit included in the farm vehicle are coupled to each other.

Abstract: A method of manufacturing a semiconductor package is provided and includes forming a protective layer on a passivation layer and a connection pad of a semiconductor chip exposed by a first opening of the passivation layer, forming an insulating layer on the protective layer, forming a via hole penetrating the insulating layer to expose the protective layer, forming a second opening by removing a portion of the protective layer through the via hole, and forming a connection via filling the via hole and the second opening and a redistribution layer on the connection via. The second opening and the via hole are connected to have a stepped portion. The first opening has a width narrower closer to the connection pad, and the second opening has a width wider closer to the connection pad.

Abstract: A method of manufacturing a semiconductor package is provided and includes forming a protective layer on a passivation layer and a connection pad of a semiconductor chip exposed by a first opening of the passivation layer, forming an insulating layer on the protective layer, forming a via hole penetrating the insulating layer to expose the protective layer, forming a second opening by removing a portion of the protective layer through the via hole, and forming a connection via filling the via hole and the second opening and a redistribution layer on the connection via. The second opening and the via hole are connected to have a stepped portion. The first opening has a width narrower closer to the connection pad, and the second opening has a width wider closer to the connection pad.

Abstract: The present invention relates to novel heterocyclic compounds useful in preparing drugs for the prevention or treatment of diseases associated with STAT3 protein. Specifically, these drugs are useful in the prevention or treatment of solid tumors, blood cancers, radiation or drug-resistant cancers, metastatic cancers, inflammatory diseases, immune system diseases, diabetes, macular degeneration, papillomavirus infections and tuberculosis.

Abstract: A semiconductor package includes: a semiconductor chip including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening; an encapsulant covering at least a portion of the semiconductor chip; and the connection structure including an insulating layer having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening. The second opening and the via hole are connected to have a stepped portion.

Abstract: A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.

Abstract: A semiconductor device includes a plurality of memory chips arranged in a line on a substrate, and a bus connected to the plurality of memory chips and configured to sequentially supply an electrical signal to the plurality of memory chips in accordance with a fly-by topology. An order in which the electrical signal is supplied to the plurality of memory chips is different from an order in which the plurality of memory chips is arranged in the line on the substrate.