Patents by Inventor Byung Hoon Ahn
Byung Hoon Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240149109Abstract: A knee joint rehabilitation apparatus for a wheelchair includes a rehabilitation apparatus frame having a height corresponding to a length of each of legs of a patient sitting on the wheelchair; an upper leg support disposed at an upper end of the rehabilitation apparatus frame and supporting upper legs of the patient thereon while the patient is sitting on the wheelchair; a lower leg support pivotably connected to the upper leg support, wherein the lower legs of the patient are seated and supported on the lower leg support; and an exercise control unit disposed on the rehabilitation apparatus frame and configured to allow the lower leg support to pivot around a connection portion between the lower leg support and the upper leg support such that the patient performs rehabilitation exercise of the knee joint thereof while sitting on the wheelchair.Type: ApplicationFiled: January 10, 2022Publication date: May 9, 2024Applicant: HEXARHUMANCARE CO., LTDInventors: Chang Soo HAN, Ho Jun KIM, Su Hyu PARK, Young Hoon JI, Jeong Ho CHO, Byung Gab RYU, Jeong Gyu PARK, Dong Eun CHOI, Cheol Woong AHN
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Publication number: 20240014111Abstract: Disclosed are a fan-out packaging device and a method of manufacturing the fan-out packaging device, and more particularly a fan-out packaging device using a bridge, the fan-out packaging device including a bridge formed at one side of a fan-out package having two or more dies integrated therein, at least one trace formed at the bridge, and a connection terminal formed at an end of the trace, the connection terminal being in contact with a contact terminal of the fan-out package, wherein the different dies integrated in the fan-out package are electrically connected to each other via the bridge.Type: ApplicationFiled: March 15, 2023Publication date: January 11, 2024Inventors: Byung Joon HAN, Byung Hoon AHN
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Publication number: 20220386607Abstract: The present invention relates to a novel nicotinamide compound, a method for preparing the same, and a herbicide comprising the compound. The compound of the present invention is useful as a herbicide for foliar treatment or soil treatment because it has high safety for wheat or corn and has excellent herbicidal activity against grassy weeds, sedge weeds or broadleaf weeds.Type: ApplicationFiled: October 21, 2020Publication date: December 8, 2022Inventors: Young Kwan KO, Eun Ae KIM, Ill Young LEE, Hee Nam LIM, Jung Sub CHOI, Jee Hee SUH, Nack Jeong KIM, Dong Wan KOO, Hyun Jin KIM, Gyu Hwan YON, Jae Deok KIM, Seungae OH, So-Young LEE, Chan Yong PARK, Yun Kyoung HWANG, Byung Hoon AHN, Ah Reum KIM, Hye Ji HAN, Sungjun PARK, Junhyuk CHOI, Jisoo LIM, Mi Sook HONG
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Patent number: 9362210Abstract: Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.Type: GrantFiled: February 10, 2013Date of Patent: June 7, 2016Assignee: Amkor Technology, Inc.Inventors: Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi, Won Chul Do
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Patent number: 8536688Abstract: An integrated circuit leadframe and a fabrication method for fabricating the integrated circuit leadframe include forming a leadframe having leads around a die pad that has a peripheral die pad rim. A discrete, alternately staggered surface configuration is formed in the die pad rim. The discrete, alternately staggered surface configuration creates space in the die pad for connecting and separating ground bond wire-bonds and down bond wire-bonds, and provides for locking encapsulant firmly to the die pad.Type: GrantFiled: December 8, 2004Date of Patent: September 17, 2013Assignee: Stats Chippac Ltd.Inventors: Byung Hoon Ahn, Pandi Chelvam Marimuthu
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Publication number: 20130144543Abstract: A method for detecting breakage of a diesel particulate filter (DPF) for detecting a tiny breakage of the DPF may include obtaining a learned value of a flow resistance in the DPF when a regeneration of the DPF is terminated, calculating a predicted value of the flow resistance, determining whether the learned value is within a permissible error range of the predicted value, and determining that the DPF is broken if the learned value is not within the permissible error range. The method may further include storing an arithmetic average of the learned value according to a mileage of a vehicle and transforming a relation between the mileage and the learned value to a polynomial expression.Type: ApplicationFiled: July 19, 2012Publication date: June 6, 2013Applicant: Hyundai Motor CompanyInventor: Byung Hoon AHN
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Patent number: 8410585Abstract: Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.Type: GrantFiled: March 10, 2006Date of Patent: April 2, 2013Assignee: Amkor Technology, Inc.Inventors: Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi, Won Chul Do
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Patent number: 7960816Abstract: A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.Type: GrantFiled: December 23, 2005Date of Patent: June 14, 2011Assignee: ST Assembly Test Services Ltd.Inventors: Seng Guan Chow, Il Kwon Shim, Ming Ying, Byung Hoon Ahn
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Patent number: 7833840Abstract: An integrated circuit package system and method of manufacture therefor includes providing a substrate with a beveled cavity, attaching a down-set conductive die pad with tapered sidewalls for matching with the beveled cavity in the substrate and having the down-set below a lower surface of the substrate, and attaching an integrated circuit over the down-set conductive die pad and electrically connected thereto.Type: GrantFiled: August 3, 2006Date of Patent: November 16, 2010Assignee: Stats Chippac Ltd.Inventors: Byung Hoon Ahn, OhSug Kim
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Publication number: 20080032456Abstract: An integrated circuit package system includes a substrate, a down-set conductive die pad on the substrate, and an integrated circuit over the down-set conductive die pad.Type: ApplicationFiled: August 3, 2006Publication date: February 7, 2008Applicant: STATS CHIPPAC LTD.Inventors: Byung Hoon Ahn, OhSug Kim
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Publication number: 20070148821Abstract: A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the first die. A second die is attached to the heat sink. The second die is electrically connected to the substrate, and the first die, the heat sink, and the second die are encapsulated.Type: ApplicationFiled: March 7, 2007Publication date: June 28, 2007Inventors: Byung Tai Do, Byung Hoon Ahn
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Patent number: 7205651Abstract: A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the first die. A second die is attached to the heat sink. The second die is electrically connected to the substrate, and the first die, the heat sink, and the second die are encapsulated.Type: GrantFiled: April 16, 2004Date of Patent: April 17, 2007Assignee: ST Assembly Test Services Ltd.Inventors: Byung Tai Do, Byung Hoon Ahn
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Patent number: 7135760Abstract: A leadframe for a semiconductor die includes signal leads, ground leads, and a die support holder for supporting the semiconductor die. The die support holder has opposite surfaces and side edges therebetween. The opposite die support holder surfaces are smaller in transverse extent than the semiconductor die for supporting the die on one of the opposite die support holder surfaces such that the die extends beyond the side edges of the die support holder.Type: GrantFiled: May 23, 2003Date of Patent: November 14, 2006Assignee: ST Assembly Test Services Ltd.Inventors: Byung Joon Han, Byung Hoon Ahn
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Publication number: 20060197198Abstract: A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.Type: ApplicationFiled: December 23, 2005Publication date: September 7, 2006Applicant: ST ASSEMBLY TEST SERVICES LTD.Inventors: Seng Guan Chow, Il Kwon Shim, Ming Ying, Byung Hoon Ahn
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Patent number: 7091596Abstract: Semiconductor packages provide a leadframe for packages that are singulated with respective predetermined package body sizes. Individual mold caps are formed on the leadframe with mold cap dimensions that are larger than the respective predetermined package body sizes. The mold caps and leadframe are singulated to the respective predetermined package body sizes.Type: GrantFiled: November 18, 2004Date of Patent: August 15, 2006Assignee: St Assembly Test Services Ltd.Inventors: Byung Joon Han, Byung Hoon Ahn
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Patent number: 7064420Abstract: A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at least two different layers. At least one force release and stress relief structure is incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.Type: GrantFiled: May 23, 2003Date of Patent: June 20, 2006Assignee: St Assembly Test Services Ltd.Inventors: Byung Joon Han, Byung Hoon Ahn, Zheng Zheng
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Patent number: 7042068Abstract: Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.Type: GrantFiled: April 27, 2001Date of Patent: May 9, 2006Assignee: Amkor Technology, Inc.Inventors: Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi, Won Chul Do
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Patent number: 7005325Abstract: A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.Type: GrantFiled: February 5, 2004Date of Patent: February 28, 2006Assignee: St Assembly Test Services Ltd.Inventors: Seng Guan Chow, Il Kwon Shim, Ming Ying, Byung Hoon Ahn
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Patent number: 6858470Abstract: A method for fabricating semiconductor packages provides a leadframe for packages that are to be singulated with respective predetermined package body sizes. Individual mold caps are formed on the leadframe with mold cap dimensions that are larger than the respective predetermined package body sizes. The mold caps and leadframe are sawed to singulate packages therefrom. The sawing reduces the dimensions of the mold caps to the respective predetermined package body sizes.Type: GrantFiled: October 8, 2003Date of Patent: February 22, 2005Assignee: ST Assembly Test Services Ltd.Inventors: Byung Joon Han, Byung Hoon Ahn
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Publication number: 20040061205Abstract: A leadframe for a semiconductor die includes signal leads, ground leads, and a die support holder for supporting the semiconductor die. The die support holder has opposite surfaces and side edges therebetween. The opposite die support holder surfaces are smaller in transverse extent than the semiconductor die for supporting the die on one of the opposite die support holder surfaces such that the die extends beyond the side edges of the die support holder.Type: ApplicationFiled: May 23, 2003Publication date: April 1, 2004Applicant: ST ASSEMBLY TEST SERVICES LTD.Inventors: Byung Joon Han, Byung Hoon Ahn