Patents by Inventor Byung Hun Kwak

Byung Hun Kwak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHOD FOR FORMING DEVICE ISOLATION FILM OF SEMICONDUCTOR DEVICE
    Publication number: 20080246149
    Abstract: A method for manufacturing a semiconductor device comprises growing a carbon nano tube (CNT) in a contact hole to form a contact plug, thereby preventing diffusion of a tungsten layer. The method does not require forming a titanium nitride (TiN) film deposited to improve an adhesive strength. The CNT has an excellent electric conductivity and a high mechanical strength to improve characteristics of the device.
    Type: Application
    Filed: November 27, 2007
    Publication date: October 9, 2008
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Byung Hun Kwak, Chi Hwan Jang