Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A multilayer ceramic capacitor may include: a ceramic body; first and second external electrodes; first and second internal electrodes connected to the first and second external electrodes, respectively; first floating electrodes having both end portions overlapped with portions of the first and second internal electrodes, respectively; and at least one second floating electrode shifted with respect to the first floating electrodes in a length direction of the ceramic body. The lengths of portions of the first and second floating electrodes overlapped with the portions of the first internal electrodes may be different from those of portions of the first and second floating electrodes overlapped with the portions of the second internal electrodes.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second external electrodes; first and second internal electrodes formed to be spaced apart from each other; and a first floating electrode disposed alternately with the first and second internal electrodes in the ceramic body in a thickness direction and having both end portions thereof overlapped with the first and second internal electrodes, respectively, wherein the first floating electrode is disposed so that a length of portion of the first internal electrode overlapped with one end portion of the first floating electrode and a length of portion of the second internal electrode overlapped with the other end portion of the first floating electrode in the ceramic body are different.

Abstract: There are provided a multilayer ceramic electronic component that does not require a heat treatment under a reduction atmosphere, and a manufacturing method thereof, wherein a conductive oxide is used as a material of internal and external electrodes and conductive layers having elasticity are formed on the external electrodes. In the case of the multilayer ceramic electronic component, a firing process may be performed under an air atmosphere, such that a manufacturing process may be simplified and manufacturing costs may be reduced.

Abstract: A multilayer ceramic capacitor may include: a ceramic body; first and second external electrodes; first and second internal electrodes; third and fourth internal electrodes being adjacent to the first and second internal electrodes in a thickness direction of the ceramic body, respectively; and first floating electrodes misaligned with the third and fourth internal electrodes in the thickness direction of the ceramic body within the ceramic body and having both end portions overlapped with portions of the third and fourth internal electrodes, respectively. When a distance between the first internal electrode and the third internal electrode or between the second internal electrode and the fourth internal electrode is a and a distance between the third or fourth internal electrode and the first floating electrode is b, b>a may be satisfied.

Abstract: A multilayer ceramic capacitor may include: a ceramic body; first and second external electrodes; first and second internal electrodes connected to the first and second external electrodes, respectively; first floating electrodes having both end portions overlapped with portions of the first and second internal electrodes, respectively; and at least one second floating electrode shifted with respect to the first floating electrodes in a length direction of the ceramic body. The lengths of portions of the first and second floating electrodes overlapped with the portions of the first internal electrodes may be different from those of portions of the first and second floating electrodes overlapped with the portions of the second internal electrodes.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second external electrodes; first and second internal electrodes formed to be spaced apart from each other; and a first floating electrode disposed alternately with the first and second internal electrodes in the ceramic body in a thickness direction and having both end portions thereof overlapped with the first and second internal electrodes, respectively, wherein the first floating electrode is disposed so that a length of portion of the first internal electrode overlapped with one end portion of the first floating electrode and a length of portion of the second internal electrode overlapped with the other end portion of the first floating electrode in the ceramic body are different.

Abstract: There is provided a high voltage and high capacitance multilayer ceramic electronic component having enhanced reliability, including: a ceramic body; a first layer including conductive patterns; and a second layer including a floating pattern, wherein the sum of the number of the first and second layers is 100 or more, the ceramic body has first and second external electrodes formed on outer surfaces thereof, and a ratio of a length of the floating pattern to a length of the ceramic body is 0.7 to 0.9, and a ratio of a length of the overlapped portion to the length of the floating pattern is 0.5 to 0.95, in a cross section taken in a length direction in which the first and second external electrodes are connected to and extended from the ceramic body and a stacking direction of the first and second layers.

Abstract: There is provided a multilayered ceramic electronic component including: a ceramic main body having a dielectric layer, the ceramic main body having a length of 1.79 mm or less and a width of 1.09 mm or less; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic main body; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode, wherein, when it is defined that the shortest length of at least one of the first and second external electrodes, formed in the lengthwise direction from both end portions of the ceramic main body is A, and the longest length thereof is BW, a relational expression of 0.5?A/BW<1.0 may be satisfied.

Abstract: There is provided a high voltage and high capacitance multilayer ceramic electronic component having enhanced reliability, including: a ceramic body; a first layer including conductive patterns; and a second layer including a floating pattern, wherein the sum of the number of the first and second layers is 100 or more, the ceramic body has first and second external electrodes formed on outer surfaces thereof, and a ratio of a length of the floating pattern to a length of the ceramic body is 0.7 to 0.9, and a ratio of a length of the overlapped portion to the length of the floating pattern is 0.5 to 0.95, in a cross section taken in a length direction in which the first and second external electrodes are connected to and extended from the ceramic body and a stacking direction of the first and second layers.

Abstract: There is provided a multilayered ceramic electronic component including: a ceramic main body having a dielectric layer, the ceramic main body having a length of 1.79 mm or less and a width of 1.09 mm or less; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic main body; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode, wherein, when it is defined that the shortest length of at least one of the first and second external electrodes, formed in the lengthwise direction from both end portions of the ceramic main body is A, and the longest length thereof is BW, a relational expression of 0.5?A/BW<1.0 may be satisfied.

Abstract: There is provided a multi-layered ceramic electronic component including: a ceramic main body including a dielectric layer; and inner electrode layers disposed to face each other, with the dielectric layer interposed therebetween, in the ceramic main body, wherein when an average thickness of the dielectric layer is defined as td, the average thickness td is td?15 ?m, and the number of dielectric grains per 10 ?m within the dielectric layer is 15 or greater. Since a uniform, thick dielectric layer can be obtained with fine dielectric powder, a high voltage multi-layered ceramic electronic component having excellent withstand voltage characteristics can be implemented.