Abstract: There are provided a multilayer ceramic electronic component and a manufacturing method thereof, such that a high capacitance multilayer ceramic electronic component having excellent reliability through the suppression of crack generation due to a step portion and an increase in an overlapped area may be provided.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately formed on the plurality of dielectric layers and including first and second lead-out parts having an overlap area exposed to one surface of the ceramic body, respectively; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out parts, respectively; and a first insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out parts, wherein the first and second lead-out parts are formed to have concave-convex portions alternating with each other in the overlap area therebetween.

Abstract: Provided are a light emitting device package and a method of fabricating the same. The package includes a package body including a lead frame, a light emitting device mounted on the package body, a bonding wire configured to electrically connect an electrode formed on a top surface of the light emitting device with the lead frame, a phosphor sheet attached on the light emitting device, and a phosphor molding portion to cover the light emitting device and the phosphor sheet.

Abstract: A multilayer ceramic capacitor includes a ceramic body; first and second internal electrodes including first and second body parts overlapped with each other and first and second lead-out parts having an overlap region and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body; and an insulating layer formed on one surface of the ceramic body, wherein first and second connection surfaces extended from end portions of the first and second body parts to end portions of the first and second lead-out parts are inclined, and when half of length of the internal electrode is defined as A and length from a center of the ceramic body to a starting point of the connection surface is defined as B, B/A satisfies 0.03?B/A?0.90.

Abstract: There is provided a multilayered ceramic capacitor including: a ceramic body; a plurality of first and second internal electrodes having first and second lead-out portions overlapped with each other, respectively, and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out portions, respectively; and an insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out portions, wherein the first lead-out portion has a first overlap increase part of which a forward edge has an inclined surface, and the second lead-out portion has a second overlap increase part of which a forward edge has an inclined surface.

Abstract: There are provided a multilayer ceramic electronic component and a manufacturing method thereof, such that a high capacitance multilayer ceramic electronic component having excellent reliability through the suppression of crack generation due to a step portion and an increase in an overlapped area may be provided.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately formed on the plurality of dielectric layers and including first and second lead-out parts having an overlap area exposed to one surface of the ceramic body, respectively; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out parts, respectively; and a first insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out parts, wherein the first and second lead-out parts are formed to have concave-convex portions alternating with each other in the overlap area therebetween.

Abstract: There is provided a multilayered ceramic capacitor including: a ceramic body; a plurality of first and second internal electrodes having first and second lead-out portions overlapped with each other, respectively, and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out portions, respectively; and an insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out portions, wherein the first lead-out portion has a first overlap increase part of which a forward edge has an inclined surface, and the second lead-out portion has a second overlap increase part of which a forward edge has an inclined surface.

Abstract: A multilayer ceramic capacitor includes a ceramic body; first and second internal electrodes including first and second body parts overlapped with each other and first and second lead-out parts having an overlap region and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body; and an insulating layer formed on one surface of the ceramic body, wherein first and second connection surfaces extended from end portions of the first and second body parts to end portions of the first and second lead-out parts are inclined, and when half of length of the internal electrode is defined as A and length from a center of the ceramic body to a starting point of the connection surface is defined as B, B/A satisfies 0.03?B/A?0.90.

Abstract: There is provided a multi-layered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first internal electrode having an overlapping region to form a capacitance formation part and exposed to the first and second side surfaces, and including a first lead-out part; a second internal electrode alternately multi-layered with the first internal electrode to be exposed to the first and second side surfaces, and insulated from the first internal electrode, and including the second lead-out part; first and second external electrodes; and insulation layers formed on the first and second side surfaces, the first and second lead-out parts being regions in which the first and second internal electrodes are not overlapped with each other.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body; and first and second external electrodes formed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein, when the dielectric layer is divided into three areas in a thickness direction of the ceramic body, an average size of dielectric grains in a middle area is different from that of dielectric grains in upper and lower areas, and when T1 denotes a thickness of the dielectric layer, T2 denotes a thickness of the middle area, and T3 and T4 denote thicknesses of the upper and lower areas adjacent to the first and second internal electrodes, T2?0.45T1 and T3+T4?0.55T1 are satisfied.

Abstract: There is provided a method of manufacturing ceramic electronic components having excellent reliability. According to the present invention, pre-burning out is additionally performed prior to burning out. According to the present invention, the occurrence of cracks can be prevented and the ceramic electronic components having excellent reliability can be obtained.