Abstract: Methods of manufacturing a semiconductor chip are provided. The methods may include providing a semiconductor substrate including integrated circuit regions and a cut region. The cut region may be between the integrated circuit regions. The methods may also include forming a modified layer by emitting a laser beam into the semiconductor substrate along the cut region, polishing an inactive surface of the semiconductor substrate to propagate a crack from the modified layer, and separating the integrated circuit regions along the crack. The cut region may include a plurality of multilayer metal patterns on an active surface of the semiconductor substrate, which is opposite to the inactive surface of the semiconductor substrate. The plurality of multilayer metal patterns may form a pyramid structure when viewed in cross section.

Abstract: A vehicle cargo loading system may include a cargo loading portion for loading cargo therein, wherein the cargo loading portion is divided into predetermined zones, a loading state sensor for sensing a loading state of the cargo for each zone, a loading state display for outputting different colors for the zones based on the loading state of the loaded cargo, a user interface for displaying a loading location or the loading state of the cargo, wherein the user interface is installed on an external door glass of the vehicle, and a cargo loading controller that determines whether the cargo loaded in the zone satisfies a preset reference loading state condition, and outputs a wanting signal when the cargo does not satisfy the reference loading state condition.

Abstract: A seat track device of a vehicle is proposed. The seat track device is configured to enable an electric rail module to be attached to and detached from a manual seat track to easily perform the conversion from the manual seat track to an electric seat track. The seat track device includes a seat track including a lower rail and an upper rail that slides along the lower rail, and a power rail module including a module bracket that is removably coupled to both of the upper rail and a seat, the power rail module being configured to transmit power of a drive part to the module bracket so as to allow the upper rail to slide along the lower rail in an electric manner together with the seat.

Abstract: A system for controlling an internal temperature of a vehicle when an engine is turned off includes a temperature sensor configured to measure an internal temperature (Ti) of a vehicle; a first blower configured to discharge cooled air when an electric power is supplied to the first blower; a battery; and a control unit electrically connected to the temperature sensor and the first blower and configured to receive the internal temperature (Ti) of the vehicle from the temperature sensor, and to operate the first blower, in which the control unit electrically connected to the battery is configured to control an electric power of the battery to be applied to the first blower when the internal temperature (Ti) of the vehicle is equal to or greater than a predetermined reference temperature (Tr) in a state where an engine of the vehicle is turned off.

Abstract: An air suspension apparatus for vehicle seats includes an air shutter connected to a supply port of a control valve configured to supply air so as to adjust the opening degree of an inner air channel through which air supplied to the control valve passes.

Abstract: An air suspension apparatus for vehicle seats includes an air shutter connected to a supply port of a control valve configured to supply air so as to adjust the opening degree of an inner air channel through which air supplied to the control valve passes.

Abstract: A vehicle cargo loading system may include a cargo loading portion for loading cargo therein, wherein the cargo loading portion is divided into predetermined zones, a loading state sensor for sensing a loading state of the cargo for each zone, a loading state display for outputting different colors for the zones based on the loading state of the loaded cargo, a user interface for displaying a loading location or the loading state of the cargo, wherein the user interface is installed on an external door glass of the vehicle, and a cargo loading controller that determines whether the cargo loaded in the zone satisfies a preset reference loading state condition, and outputs a wanting signal when the cargo does not satisfy the reference loading state condition.

Abstract: A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.

Abstract: A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.

Abstract: Disclosed herein is a delivery apparatus for delivering a self-expanding stent to a target position along the inside of a microcatheter, the delivery apparatus including an outer tube configured to communicate with the microcatheter, a shaft part configured to pass through the microcatheter while moving forwards and backwards in the outer tube and including a distal marker and a proximal marker to specify a position of the stent at the target position, and an elastic coating part formed on the outer surface of the shaft part between the distal marker and the proximal marker.

Abstract: An articulator including: a lower member in which an attachment plate and a body can be firmly and easily attached and detached by fitting a rear coupling part to a housing part without using a plaster, the attachment plate can be easily separated by first fixing pins protruding downward from the body, and the attachment plate and an oral model can be accurately cut by cutting marks, tooth center marks, and a round groove on the attachment plate and tooth center marks on the body; and an upper member where an impression of counter-teeth corresponding to the oral model attached to the lower member, in which the lower and upper members are rotatably connected by connecting mechanisms. Accordingly, the manufacturing process can be simplified, the actual motion of jawbones can be achieved, and the height between the upper member and the lower member can be ensured by a support unit.

Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

Abstract: The present invention has been made in an effort to provide a method of manufacturing a coreless substrate that forms an opening by patterning a dry film for forming the opening onto one surface of a carrier, separating the carrier from the substrate, and removing only the dry film for forming the opening. In the present invention, since the pad can be exposed by removing only the dry film for forming the opening, a process time for forming the opening can be reduced and since a process is simple, a cost is saved.

Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

Abstract: The present invention relates to a method for producing a recombinant, spider toxin peptide and analgesic compositions containing said peptide. More specifically, the present invention relates to a method in which the gene for GsMTx4 is subcloned into a vector, so that it is linked to a secretion signal sequence of the alpha factor and under the control of methanol-inducible alcohol oxidase (AOX) promoter to construct a recombinant yeast expression plasmid. Yeast cells are transformed with this plasmid to produce the GsMTx4 peptide and analgesic compositions containing said peptide. The recombinant yeast expression system of the present invention affords a more stable method for producing GsMTx4 than its natural route. Thus the GsMTx4 peptide and its derivatives produced by the method of this invention can be used in the cure of related diseases such as heart failure as the peptide specifically inhibits mechanosensitive ion channels.

Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.