Patents by Inventor Byung Ok Kim, legal representative

Byung Ok Kim, legal representative has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system with internal stacking module adhesive
    Patent number: 8026582
    Abstract: An integrated circuit package system comprising: providing a substrate; forming a base assembled package over the substrate; forming a top package over the base assemble package; and applying a top package stacking material for stand-off or insulation to the base assembled package and the top package.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: September 27, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Myung Kil Lee, Jae Chang Kim, Byung Ok Kim, legal representative, Koo Hong Lee