Patents by Inventor Byung-Yeol Kim
Byung-Yeol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11924399Abstract: A stereoscopic display device including a barrier panel is provided. When a viewing distance of a viewer is out of the proper range, the stereoscopic display device may shift the blocking regions and the transmitting regions of the barrier panel. The stereoscopic display device may maintain the ratio of channels located within a barrier blocking region and a barrier transmitting region of the barrier panel by using the channels disposed within trigger regions of the barrier panel. Thus, the stereoscopic display device may provide a stereoscopic image of good quality to the viewer located at a region being out of the proper range.Type: GrantFiled: April 3, 2020Date of Patent: March 5, 2024Assignee: LG Display Co., Ltd.Inventors: You-Yong Jin, Hoon Kang, Byung-Joo Lee, Bu-Yeol Lee, Wook Jeon, Hee-Jin Im, Yong-Ku Lee, Ju-Hoon Jang, Dong-Yeon Kim, Woon-Chan Moon
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Patent number: 11844173Abstract: The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.Type: GrantFiled: September 20, 2021Date of Patent: December 12, 2023Assignee: GIGALANE CO., LTD.Inventors: Byung-hoon Jo, Ik-soo Kim, Byung-yeol Kim, Hee-seok Jung
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Publication number: 20230397326Abstract: The present invention provides a flexible printed circuit board comprising: a first power line formed on one surface of a first dielectric layer; and a second power line formed on one surface of a second dielectric layer spaced apart from the first dielectric layer on a bottom surface of the first dielectric layer. There is an overlapping area in which the first power line and the second power line overlap, the first power line and the second power line are connected at a first end of the overlapping area through a via hole, and the first power line and the second power line are connected at a second end of the overlapping area through another via hole.Type: ApplicationFiled: November 25, 2021Publication date: December 7, 2023Inventors: Byung Hoon JO, Ik Soo KIM, Byung Yeol KIM, Hee Seok JUNG
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Patent number: 11489241Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.Type: GrantFiled: July 18, 2019Date of Patent: November 1, 2022Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
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Patent number: 11452200Abstract: An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.Type: GrantFiled: November 20, 2019Date of Patent: September 20, 2022Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Byung Yeol Kim, Ik Soo Kim, Hee Seok Jung
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Publication number: 20220183143Abstract: The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.Type: ApplicationFiled: September 20, 2021Publication date: June 9, 2022Inventors: Byung-hoon JO, Ik-soo KIM, Byung-yeol KIM, Hee-seok JUNG
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Publication number: 20220151064Abstract: A flexible circuit board comprises: a first dielectric which has a first signal line in contact with an upper surface or lower surface thereof, has a greater width than the first signal line, and extends along an extension direction of the first signal line; a second dielectric which is located below the first dielectric, has a second signal line in contact with the upper or lower surface thereof, has a greater width than the second signal line, and extends along an extension direction of the second signal line; a vertical section in which the first signal line and the second signal line are located on a same vertical line and the first signal line and the second signal line extend in parallel; and a horizontal section in which the position of the first signal line or the second signal line is changed through a via hole.Type: ApplicationFiled: March 31, 2020Publication date: May 12, 2022Inventors: Sang Pil KIM, Ik Soo KIM, Byung Yeol KIM, Hee Seok JUNG
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Publication number: 20220110212Abstract: A flexible circuit board according to an embodiment includes a first signal line extending on a first plane, a first dielectric extending in an extension direction of the first signal line while being in contact with the first signal line, a second signal line extending on a second plane parallel with the first plane, and a second dielectric extending in an extension direction of the second signal line while being in contact with the second signal line. The first signal line includes a first part overlapped with the second signal line and a second part not overlapped with the second signal line when viewed in a normal direction of the first plane, and the second signal line includes a first part overlapped with the first signal line and a second part not overlapped with the first signal line when viewed in the normal direction.Type: ApplicationFiled: March 4, 2020Publication date: April 7, 2022Inventors: Sang Pil KIM, Ik Soo KIM, Byung Yeol KIM, Hee Seok JUNG
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Patent number: 11272611Abstract: A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.Type: GrantFiled: November 7, 2019Date of Patent: March 8, 2022Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Byung Yeol Kim, Ik Soo Kim, Hee Seok Jung
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Publication number: 20210360780Abstract: A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.Type: ApplicationFiled: November 7, 2019Publication date: November 18, 2021Inventors: Sang Pil KIM, Byung Yeol KIM, Ik Soo KIM, Hee Seok JUNG
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Publication number: 20210360773Abstract: An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.Type: ApplicationFiled: November 20, 2019Publication date: November 18, 2021Inventors: Sang Pil KIM, Byung Yeol KIM, Ik Soo KIM, Hee Seok JUNG
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Publication number: 20210242554Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.Type: ApplicationFiled: July 18, 2019Publication date: August 5, 2021Inventors: Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Byung Yeol KIM, Hee seok JUNG
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Patent number: 10681803Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.Type: GrantFiled: December 19, 2018Date of Patent: June 9, 2020Assignee: GIGALANE CO., LTD.Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
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Patent number: 10624209Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.Type: GrantFiled: February 6, 2017Date of Patent: April 14, 2020Assignee: GIGALANE CO., LTD.Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
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Patent number: 10512158Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.Type: GrantFiled: December 19, 2018Date of Patent: December 17, 2019Assignee: GigaLane Co., Ltd.Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
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Patent number: 10477690Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.Type: GrantFiled: February 8, 2017Date of Patent: November 12, 2019Assignee: GIGALANE CO., LTD.Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
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Patent number: 10448499Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.Type: GrantFiled: December 19, 2018Date of Patent: October 15, 2019Assignee: GigaLane Co., Ltd.Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
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Patent number: 10440816Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.Type: GrantFiled: May 29, 2019Date of Patent: October 8, 2019Assignee: GigaLane Co., Ltd.Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
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Patent number: 10440815Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.Type: GrantFiled: May 29, 2019Date of Patent: October 8, 2019Assignee: GigaLane Co., Ltd.Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
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Patent number: D886073Type: GrantFiled: July 6, 2018Date of Patent: June 2, 2020Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Ik Soo Kim, Byung Yeol Kim, Byung Hoon Jo, Hee seok Jung