Abstract: A single layer copper foil tape is provided having a center core and connected lead beams. Etched apertures are formed to separate adjacent lead beams and to form relatively high strength foil straps connecting edge portions of the foil tape and the center core. Score lines may be etched at the ends of each of the lead beams to form breakaway links at such ends. The inner ends of the lead beams are then bonded to a semiconductor die at its contact pad or bumps and the resultant subassembly aligned with inner ends of the fingers of a metal lead frame array or other set of external leads such as a pin grid array and the outer ends of the lead beams bonded to such fingers. At this point, all of the remaining portions of the foil tape are peeled or pulled off the assembly, the lead beams being separated at their breakaway links, leaving only the lead beams connecting the die and set of external leads intact.