Abstract: The invention relates to an electronic module (30) intended to be held in place on a carrier (1) by a holding means (4), the electronic module (30) consisting of a plurality of layers, comprising a first carrier layer (10) carrying one or more contacts (11), a first face (10b) of the carrier layer (10) is in contact with a first face (12a; 53a) of a substrate (12; 53) and comprising a face of the substrate (12b; 53b) carrying one or more antennas (13; 50, 51), the antenna(s) (13; 50, 51) being connected to an integrated circuit (14) via feeder links (15).

Abstract: An insert for a chip card includes a body provided with a cavity in which is inserted an electronic module provided with a microelectronic chip connected to an inductive or capacitive coupling. The body has a stack of layers at least a first layer of which comprises a first booster antenna and a second layer of which comprises a second booster antenna, the various booster antennas being coupled together inductively and/or capacitively, and at least one of the booster antennas being coupled inductively and/or capacitively with the coupling of the module. The body furthermore comprises at least one metal plate disposed between two layers of ferrite, the first and second booster antennae and the metallic plate being arranged in such a way that at least one of the two booster antennas and the electronic module remain coupled together inductively and/or capacitively, despite the presence of the metal plate.

Abstract: An insert for a chip card includes a body provided with a cavity in which is inserted an electronic module provided with a microelectronic chip connected to an inductive or capacitive coupling. The body has a stack of layers at least a first layer of which comprises a first booster antenna and a second layer of which comprises a second booster antenna, the various booster antennas being coupled together inductively and/or capacitively, and at least one of the booster antennas being coupled inductively and/or capacitively with the coupling of the module. The body furthermore comprises at least one metal plate disposed between two layers of ferrite, the first and second booster antennae and the metallic plate being arranged in such a way that at least one of the two booster antennas and the electronic module remain coupled together inductively and/or capacitively, despite the presence of the metal plate.