Patents by Inventor C. Douglas
C. Douglas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8419897Abstract: A method for producing crude tall oil from black liquor soap while removing calcium carbonate and lignates is disclosed. Black liquor soap is first combined with an alkaline ash medium having a lower concentration of lignates and inorganic solids than the black liquor soap, to form washed tall oil soap, fortified brine, lignates, and calcium carbonate. The washed tall oil soap is then separated from the fortified brine, lignates, and calcium carbonate, by centrifugation, decantation, filtration, settling, or a combination of these techniques. Acidification of the washed tall oil soap gives crude tall oil and a spent acid mixture. The crude tall oil is separated from the spent acid. The spent acid is made alkaline, and at least a portion of it is returned for use as alkaline wash medium. The method avoids accumulation of calcium sulfate in acidulation units.Type: GrantFiled: November 22, 2011Date of Patent: April 16, 2013Assignee: Arizona Chemical Company, LLCInventors: Robert E. Bowles, C. Douglas Foran, Joseph H. Griffin, F. Edwin Swann
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Patent number: 8390109Abstract: In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.Type: GrantFiled: February 17, 2011Date of Patent: March 5, 2013Assignee: Oracle America, Inc.Inventors: Darko R. Popovic, Matthew D. Giere, Bruce M. Guenin, Theresa Y. Sze, Ivan Shubin, John A. Harada, David C. Douglas, Jing Shi
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Publication number: 20130054474Abstract: Methods are described for performing a timely authorization of digital credential data delivered from a mobile device that is without access to a local persistently stored permanent cryptographic key; through an interrogation with a point-of-sale that behaves according to the direction of a card specification; wherein the card specification expects the mobile device to create a cryptogram that is calculated, at least in part, using the permanent cryptographic key and, at least in part, from unpredictable data delivered from the point-of-sale to the mobile device during the interrogation.Type: ApplicationFiled: August 30, 2012Publication date: February 28, 2013Inventor: C. Douglas YEAGER
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Publication number: 20130041659Abstract: Described herein is a speech enhancement method using microphone arrays and a new iterative technique for enhancing noisy speech signals under low signal-to-noise-ratio (SNR) environments. Included is the processing of observed noisy speech both in the spatial- and the temporal-domains to enhance the desired signal component speech and an iterative technique to compute the generalized eigenvectors of the multichannel data derived from the microphone array. The entire processing is done on the spatio-temporal correlation coefficient sequence of the observed data in order to avoid large matrix-vector multiplications. Also described is a speech enhancement system having two stages. In the first stage, the noise component of the observed signal is whitened, and in the second stage a spatio-temporal power method is used to extract the most dominant speech component. In both the stages, the filters are adapted using the multichannel spatio-temporal correlation coefficients of the data.Type: ApplicationFiled: September 28, 2012Publication date: February 14, 2013Inventors: Scott C. DOUGLAS, Malay Gupta
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Patent number: 8373280Abstract: An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of semiconductor dies that are arranged in a stack in a vertical direction, which are offset from each other in a horizontal direction to define a stepped terraced at one side of the vertical stack. Moreover, the chip package may be assembled using the assembly component. In particular, the assembly component may include a housing having another stepped terrace. This other stepped terrace may include a sequence of steps in the vertical direction, which are offset from each other in the horizontal direction. Furthermore, the housing may be configured to mate with the set of semiconductor dies such that the set of semiconductor dies are arranged in the stack in the vertical direction. For example, the other stepped terrace may approximately be a mirror image of the stepped terrace.Type: GrantFiled: September 1, 2010Date of Patent: February 12, 2013Assignee: Oracle America, Inc.Inventors: John A. Harada, Robert J. Drost, David C. Douglas
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Patent number: 8374854Abstract: The present invention describes a speech enhancement method using microphone arrays and a new iterative technique for enhancing noisy speech signals under low signal-to-noise-ratio (SNR) environments. A first embodiment involves the processing of the observed noisy speech both in the spatial- and the temporal-domains to enhance the desired signal component speech and an iterative technique to compute the generalized eigenvectors of the multichannel data derived from the microphone array. The entire processing is done on the spatio-temporal correlation coefficient sequence of the observed data in order to avoid large matrix-vector multiplications. A further embodiment relates to a speech enhancement system that is composed of two stages. In the first stage, the noise component of the observed signal is whitened, and in the second stage a spatio-temporal power method is used to extract the most dominant speech component.Type: GrantFiled: March 27, 2009Date of Patent: February 12, 2013Assignee: Southern Methodist UniversityInventors: Scott C. Douglas, Malay Gupta
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Publication number: 20120317628Abstract: Methods and apparatuses are disclosed for creating a software based secure element reader and a digital credential data delivery system for point-of-sale (POS) locations that do not have a secure element reader. Methods and apparatuses are described for creating a remotely hosted repository of secure elements that may be selected and connected to a mobile or a stationary device. Near-field communication (NFC) capabilities may be utilized to interrogate a selected secure element by a RFID POS reader through the mobile NFC device over a data connection between that mobile NFC device and the remote hosted secure element.Type: ApplicationFiled: June 8, 2012Publication date: December 13, 2012Inventor: C. Douglas Yeager
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Patent number: 8327263Abstract: A method and system for retrieving and maintaining presentation data in a presentation cache is provided. In a preferred embodiment, a presentation cache object provides a presentation cache with multiple cache entries. Each entry contains an indication of the format of the presentation data and the presentation data stored in that particular format. In addition, other information, such as the advisees of advisory connections for notification of cache updates, can be maintained. The presentation cache object responds to requests for retrieving source object data by returning presentation data cached within the presentation cache when it is available. In addition, the presentation cache object determines when it should delegate requests to the source object and when it can satisfy them on its own. The presentation cache object can return presentation data to a requesting client program even if the server program implementing the source object is unavailable or not running.Type: GrantFiled: May 24, 2005Date of Patent: December 4, 2012Assignee: Microsoft CorporationInventors: Robert G. Atkinson, Antony S. Williams, Craig H. Wittenberg, Srinivasa R. Koppolu, C. Douglas Hodges
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Patent number: 8321309Abstract: A method and system for streamlined payroll set up and compliant paycheck generation whereby a computing system implemented payroll system is provided that maintains a payroll record for each employee. In one embodiment, data indicating the minimum information required by the law to generate a compliant paycheck is obtained. When a user begins the process of generating a paycheck for a given employee, the given employee's payroll record data is analyzed and compared with the data indicating the minimum information to determine if the given employee's payroll record data includes all of the minimum information. If the given employee's payroll record data includes the minimum information, then the given employee's payroll record is marked as having the compliant paycheck data and the requested paycheck is generated.Type: GrantFiled: July 27, 2009Date of Patent: November 27, 2012Assignee: Intuit Inc.Inventors: Amit Rameshchandra Jain, Timothy Hobson, Elizabeth C. Douglas, Nigel Tremar Menendez
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Patent number: 8290319Abstract: A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a stepped terrace. A high-bandwidth ramp component, which is positioned approximately parallel to the stepped terrace, is mechanically coupled to the semiconductor dies. Furthermore, the ramp component includes an optical waveguide that conveys the optical signal, and an optical coupling component that optically couples the optical signal to one of the semiconductor dies, thereby facilitating high-bandwidth communication of the optical signal between the semiconductor die and the ramp component.Type: GrantFiled: August 25, 2010Date of Patent: October 16, 2012Assignee: Oracle America, Inc.Inventors: John A. Harada, David C. Douglas, Robert J. Drost
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Patent number: 8283766Abstract: A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, is electrically and mechanically coupled to the exposed pads. For example, the ramp component may be coupled to the semiconductor dies using: solder, microsprings and/or an anisotropic conducting film. Furthermore, each of the semiconductor dies includes a static bend so that an end segment of each of the semiconductor dies is parallel to the direction and is mechanically coupled to the ramp component. These end segments may facilitate high-bandwidth communication of signals between the chips and the ramp component, for example, via proximity communication.Type: GrantFiled: September 2, 2010Date of Patent: October 9, 2012Assignee: Oracle America, IncInventors: John A. Harada, David C. Douglas, Robert J. Drost
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Patent number: 8280765Abstract: A computer implemented method for maximizing publisher revenue for online advertising is provided. The computer implemented method includes determining a ratio of guaranteed ad impressions to expected remaining ad impressions. If the ratio is less than a threshold, the method includes, identifying a minimum bid value, the minimum bid value based on the ratio; comparing the minimum bid value to a received bid value for an ad impression; allocating the ad impression to an owner of the received bid when the received bid value is greater than or equal to the minimum bid value; and displaying an ad of the owner of the received bid. If the ratio is greater than the threshold, the method includes, allocating the ad impression to an owner of the guaranteed ad impressions. In one embodiment, the method operations are stored on a computer readable storage medium.Type: GrantFiled: December 1, 2009Date of Patent: October 2, 2012Assignee: Yieldex, Inc.Inventors: Tom Shields, C. Douglas Cosman, Craig Miller, John Barr
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Publication number: 20120211878Abstract: In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.Type: ApplicationFiled: February 17, 2011Publication date: August 23, 2012Applicant: ORACLE INTERNATIONAL CORPORATIONInventors: Darko R. Popovic, Matthew D. Giere, Bruce M. Guenin, Theresa Y. Sze, Ivan Shubin, John A. Harada, David C. Douglas, Jing Shi
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Publication number: 20120173432Abstract: Self-authorizing tokens are disclosed. Typical embodiments employ a secure element and a secure element interrogator. Such tokens may be used for authorization of financial payments and other secure transactions. In some embodiments the secure element is provisioned with information about a particular payment card holder account. A secure element reader interrogates the smart element and derives information needed to authorize a transaction. In some embodiments the secure element and the secure element interrogator communicate using communications formatted according to ISO 7816-4.Type: ApplicationFiled: February 23, 2012Publication date: July 5, 2012Inventor: C. Douglas Yeager
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Publication number: 20120123087Abstract: A method for producing crude tall oil from black liquor soap while removing calcium carbonate and lignates is disclosed. Black liquor soap is first combined with an alkaline ash medium having a lower concentration of lignates and inorganic solids than the black liquor soap, to form washed tall oil soap, fortified brine, lignates, and calcium carbonate. The washed tall oil soap is then separated from the fortified brine, lignates, and calcium carbonate, by centrifugation, decantation, filtration, settling, or a combination of these techniques. Acidification of the washed tall oil soap gives crude tall oil and a spent acid mixture. The crude tall oil is separated from the spent acid. The spent acid is made alkaline, and at least a portion of it is returned for use as alkaline wash medium. The method avoids accumulation of calcium sulfate in acidulation units.Type: ApplicationFiled: November 22, 2011Publication date: May 17, 2012Applicant: ARIZONA CHEMICAL COMPANY, LLCInventors: Robert E. BOWLES, C. Douglas Foran, Joseph H. GRIFFIN, F. Edwin SWANN
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Patent number: 8151345Abstract: Self-authorizing cards and cellular network adapters for authorization of financially payments and other secure transactions. In some embodiments a smart card is provided with a connector for a USB port on a computer terminal such as a personal computer (PC). Embodiments are also provided for mobile phones, personal digital assistants (PDAs), and similar devices. The self-authorizing devices typically include a secure element that has been previously provisioned with information about a particular card holder account. A secure element reader interrogates the smart element and derives information needed to authorize the transaction. A communications controller transmits the information to a host device, such as a PC, PDA, or a mobile phone.Type: GrantFiled: January 24, 2008Date of Patent: April 3, 2012Inventor: C. Douglas Yeager
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Publication number: 20120056327Abstract: A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, is electrically and mechanically coupled to the exposed pads. For example, the ramp component may be coupled to the semiconductor dies using: solder, microsprings and/or an anisotropic conducting film. Furthermore, each of the semiconductor dies includes a static bend so that an end segment of each of the semiconductor dies is parallel to the direction and is mechanically coupled to the ramp component. These end segments may facilitate high-bandwidth communication of signals between the chips and the ramp component, for example, via proximity communication.Type: ApplicationFiled: September 2, 2010Publication date: March 8, 2012Applicant: ORACLE INTERNATIONAL CORPORATIONInventors: John A. Harada, David C. Douglas, Robert J. Drost
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Publication number: 20120049376Abstract: An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of semiconductor dies that are arranged in a stack in a vertical direction, which are offset from each other in a horizontal direction to define a stepped terraced at one side of the vertical stack. Moreover, the chip package may be assembled using the assembly component. In particular, the assembly component may include a housing having another stepped terrace. This other stepped terrace may include a sequence of steps in the vertical direction, which are offset from each other in the horizontal direction. Furthermore, the housing may be configured to mate with the set of semiconductor dies such that the set of semiconductor dies are arranged in the stack in the vertical direction. For example, the other stepped terrace may approximately be a mirror image of the stepped terrace.Type: ApplicationFiled: September 1, 2010Publication date: March 1, 2012Applicant: ORACLE INTERNATIONAL CORPORATIONInventors: John A. Harada, Robert J. Drost, David C. Douglas
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Publication number: 20120051695Abstract: A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a stepped terrace. A high-bandwidth ramp component, which is positioned approximately parallel to the stepped terrace, is mechanically coupled to the semiconductor dies. Furthermore, the ramp component includes an optical waveguide that conveys the optical signal, and an optical coupling component that optically couples the optical signal to one of the semiconductor dies, thereby facilitating high-bandwidth communication of the optical signal between the semiconductor die and the ramp component.Type: ApplicationFiled: August 25, 2010Publication date: March 1, 2012Applicant: ORACLE INTERNATIONAL CORPORATIONInventors: John A. Harada, David C. Douglas, Robert J. Drost
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Publication number: 20120050668Abstract: In one embodiment, an eyewear for a user includes an eyewear frame, electrical circuitry at least partially in the eyewear frame, and a touch sensitive input surface on the eyewear frame configured to provide an input to the electrical circuitry to perform a function via touching the touch sensitive input surface. In another embodiment, the eyewear includes a switch with at least two operational states. The operational states of the switch can be configured to be changed by sliding a finger across the touch sensitive input surface of the frame.Type: ApplicationFiled: November 7, 2011Publication date: March 1, 2012Inventors: Thomas A. Howell, David Chao, C. Douglas Thomas, Peter P. Tong