Abstract: An image sensor includes a substrate having a first region and a second region. The image sensor further includes a dielectric layer over the substrate. The image sensor further includes a conductive layer over the dielectric layer, wherein in the first region the conductive layer has a grid shape and in the second region a portion of the conductive layer is concave toward the substrate. The image sensor further includes a protective layer, wherein the protective layer is over the conductive layer in the first region, and over a top surface and along sidewalls of the conductive layer in the second region.

Abstract: An image sensor includes a substrate having a first region and a second region. The image sensor further includes a dielectric layer over the substrate. The image sensor further includes a conductive layer over the dielectric layer, wherein in the first region the conductive layer has a grid shape and in the second region a portion of the conductive layer is concave toward the substrate. The image sensor further includes a protective layer, wherein the protective layer is over the conductive layer in the first region, and over a top surface and along sidewalls of the conductive layer in the second region.

Abstract: A method of fabricating an image sensor includes depositing a first dielectric layer over a substrate, removing a portion of the first dielectric layer from the substrate to form a trench, depositing a conductive layer over the first dielectric layer and in the trench, forming a protective layer lining a top surface of the conductive layer and sidewalls and a bottom surface of the groove in the conductive layer, and removing a portion of the conductive layer to form a grid structure. A groove corresponding to the trench is formed in the conductive layer.

Abstract: A method of fabricating an image sensor includes depositing a first dielectric layer over a substrate, removing a portion of the first dielectric layer from the substrate to form a trench, depositing a conductive layer over the first dielectric layer and in the trench, forming a protective layer lining a top surface of the conductive layer and sidewalls and a bottom surface of the groove in the conductive layer, and removing a portion of the conductive layer to form a grid structure. A groove corresponding to the trench is formed in the conductive layer.

Abstract: An electrochemical sensor embedded RFID system that uses electrochemical sensor embedded RFID tags, RFID readers, intelligent-agent-based software, wireless and landline communication networks, and Internet, Intranet, Extranet links for continually identifying, sensing, aggregating, monitoring, tracking and networking of multiple clusters of metal objects. The electrochemical sensor embedded RFID system comprises a plurality of electrochemical sensor embedded RFID tag apparatus for identifying, sensing and measuring metal object's corrosion conditions, and a plurality of RFID reader apparatus which containing system software that uses an active, real-time concurrent method to process metal object's corrosion, conditions along with location information to be transmitted to a cloud-based remote monitoring station.

Abstract: A Real-Time Group Intelligence Creation System 100 comprising of Group Intelligence Creation Controller 200, Facilitator Expert System 300, Adaptive Group Intelligence Mining Engine 400, Intelligent Web Communicator 500, Idea and Solution Source Data Server 600, and Classification, Extraction, Thinking Pattern and Hint Data Server 700. The System extends traditional computational grid to include idea creations and problem solving generations to form a collaborative thinking grid that is made up of mass volume of participants using either mobile device or stationary device, and is without the need of face-to-face interaction. The System uses both shallow knowledge and deep knowledge mining agents to mine unstructured ideas and solutions in real-time for unifying multiple topics and generating classifications, extractions, thinking patterns and hints. This information are provided to participants during creation processes in order to simulate and accelerate participants' thinking further.

Abstract: A Real-Time Group Intelligence Creation System 100 comprising of Group Intelligence Creation Controller 200, Facilitator Expert System 300, Adaptive Group Intelligence Mining Engine 400, Intelligent Web Communicator 500, Idea and Solution Source Data Server 600, and Classification, Extraction, Thinking Pattern and Hint Data Server 700. The System extends traditional computational grid to include idea creations and problem solving generations to form a collaborative thinking grid that is made up of mass volume of participants using either mobile device or stationary device, and is without the need of face-to-face interaction. The System uses both shallow knowledge and deep knowledge mining agents to mine unstructured ideas and solutions in real-time for unifying multiple topics and generating classifications, extractions, thinking patterns and hints. This information are provided to participants during creation processes in order to simulate and accelerate participants' thinking further.

Abstract: Green light emitting diodes (LED) of gallium arsenide (GaAs) are series-connected. The series connection has a small transmission attenuation and a wide bandwidth. The GaAs LED has a big forward bias and so neither extra driving current nor complex resonant-cavity epitaxy layer is needed. Hence, the present invention has a high velocity, a high efficiency and a high power while an uneven current distribution is avoided.

Abstract: A signal line connector for electrically connecting two signal lines is provided. The signal line connector includes a base, a conductive element, and two pressing elements. The base has two sockets, allowing terminals of the signal lines to be inserted into the base. The conductive element is embedded in the base, and two ends of the conductive element are respectively corresponding to the sockets. The two pressing elements are movably disposed in the base, and are respectively corresponding to the sockets. The pressing elements press against the terminals of the signal lines to the conductive element at a clamping position, so as to electrically connect the signal lines to the conductive element. Or, the pressing elements separate the terminals of the two signal lines from the conductive element at a release position.

Abstract: Methods of removing alkyl alkanesulfonate esters from aqueous or anhydrous compositions are provided. The invention provides methods for the conversion of alkyl alkanesulfonate esters of the formula RSO3R? to the corresponding acids of the formula RSO3H. The alkyl alkanesulfonate esters are present in an organic medium, which may contain significant amounts of water or which may be anhydrous or substantially anhydrous. In some embodiments, the invention provides methods for purifying aqueous or anhydrous alkanesulfonic acids by removing alkyl alkanesulfonate esters.

Abstract: A wireless communication and global location enabled intelligent health monitoring system comprising of a plurality of wireless medical sensor apparatus that include an active sensor, a transducer, a digital-to analog converter, a frequency synthesis, a plurality of bandpass filter, a plurality of linear power amplifier, a signal mixer, a packaged antenna, a thin-film battery, for measuring patient vital signs on different parts of patient body, and a main processing unit apparatus that contains a system software including intelligent controller which uses active, real-time monitoring method to measure and process vital signs and location information for providing alert on location and transmitting emergency request to remote patient monitoring station for immediate assistance. Intelligent controller and all application tasks of said system software are running under separate parallel execution threads.

Abstract: A wireless winch control system having a wireless remote transmitter for transmitting AM/PWM modulated signals. A processor in the wireless remote transmitter periodically transmits control signals while a forward or reverse button remains pushed. Once the button is released, a Stop command is automatically transmitted to the receiver. A receiver mounted for control of the winch receives the signals, demodulates the same and controls the winch motor in a reliable manner.

Abstract: A Wireless Communication and Global Location Enabled Intelligent Health Monitoring System comprising of a plurality of Wireless Medical Sensor Apparatus 300 for measuring a patient's vital signs on different parts of a patient's body, and a Main Processing Unit Apparatus 100 containing System Software 500 that uses an active, real-time monitoring method to process a patient's vital signs and location information for providing an alert on location and transmitting an emergency request to a remote patient monitoring station for immediate assistance. The key component of Main Processing Unit Apparatus 100 is Main Microcontroller 110 which is connected to Global Position System Module 120, Long-Range Two Way Wireless Communication Module 130, Short-Range RF Receiver 140, System Main Memory 150, Flash Memory 160, Panic Button 180, On/Off Button 190, Alert Beeper 195 and Removable/Rechargeable Battery 170.

Abstract: A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board.

Abstract: A System Apparatus of Programmable Logic Controller (PLC) 100 containing System Software of Embedded Intelligent Web Server 200 uses a service-based application method to administrate and manage of control and system related services for controlling machines, equipment and manufacturing processes globally. The main component of System Apparatus of Programmable Logic Controller 100 is Central Processing Unit 110 which is connected to an Apparatus Memory 120, a Wireline Connection Port 140, a Wireless Transceiver Port 150, a plurality of Input Interface Module 160, and a plurality of Output Interface Module 170. Input Interface Module 160 is connected to a plurality of Field Input Device 180, and Output Interface Module 170 is connected to a plurality of Field Output Device 190. System Apparatus of Programmable Logic Controller 100 is also connected by a Power Supply 130 for power source.

Abstract: A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained.

Abstract: A package structure of an integrated circuit is used for electrically connecting to a printed circuit board includes a substrate, an integrated circuit, a plurality of wires, two molded resins. The substrate has a lower surface formed with signal input terminals and signal output terminals, which are to be connected to the signal input terminals. The signal output terminals are electrically connected to the printed circuit board. The integrated circuit has a lower surface for mounting the integrated circuit to the upper surface of the substrate. The two sides on the lower surface of the integrated circuit formed with a plurality of bonding pads. While the integrated circuit mounted to the substrate, the bonding pads are exposed to the outside. The plurality of wires are electrically connected the bonding pads to the substrate. Thus, the signals from the integrated circuit can be transmitted to the substrate.

Abstract: A package structure of an image sensor for electrically connecting to a printed circuit board includes a transparent layer and an image sensing chip. A plurality of signal input terminals and signal output terminals are formed on the transparent layer. The signal output terminals are used for electrically connecting the transparent layer to the printed circuit board. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads and is electrically connected to the transparent layer by way of flip chip bonding. The bonding pads are electrically connected to the signal input terminals of the transparent layer. The image sensing chip receives image signals via the transparent layer, converts the image signals into electrical signals, and transmits the electrical signals from the signal output terminals of the transparent layer to the printed circuit board.

Abstract: A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board.

Abstract: The present invention discloses a via plug formed in a zig-zag bordered opening in a semiconductor structure wherein the film stress in a barrier/glue layer TiN can be significantly reduced to eliminate the occurrence of volcano defect in which delamination or peeling of the TiN layer from the contact opening occurs. The via plug can be formed in a process by providing a mask that has a desirable zig-zag pattern during a photomasking step performed on the semiconductor device.