Abstract: A pharmaceutical composition of omeprazole for oral administration is described which consists essentially of: (a) a pellet comprising an inert core component, a therapeutically effective amount of omeprazole, a surface active agent, a filler, a pharmaceutically acceptable alkaline agent and a binder; and (b) a single layer of coating on said pellet which comprises a layer of an enteric coating agent.

Abstract: A pharmaceutical composition of omeprazole for oral administration is described which consists essentially of:

Abstract: A controlled release tablet is disclosed which comprises: (a) a homogeneous compressed core which comprises: (i) a medicament which is very slightly soluble to practically insoluble in water at 25° C.; (ii) a water soluble osmotic compound (iii) one or more osmotic polymers; and (b) a membrane coating which completely covers said core tablet which comprises a mixture of a: (i) a water insoluble pharmaceutically acceptable polymer; and (ii) a pH dependent polymer such as an enteric coating polymer, the weight ratio of the pH dependent polymer to the water insoluble pharmaceutically acceptable polymer being 0.1:1 to 0.75:1.

Abstract: A structure of stacked integrated circuits for mounting on a circuit board includes a substrate, a lower integrated circuit, a plurality of wirings, a plurality of metallic balls, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals and a second surface formed with signal output terminals for electrically connecting to the circuit board. The lower integrated circuit has a first surface adhered to the first surface of the substrate and a second surface formed with a plurality of bonding pads. Each of the wirings has a first end and a second end away from the first end. The first ends are electrically connected to the bonding pads of the lower integrated circuit. The second ends are electrically connected to the signal input terminals on the first surface of the substrate. The plurality of metallic balls are formed on the second surface of the lower integrated circuit.

Abstract: A stacked structure of integrated circuits for electrically connecting to a circuit board includes a substrate, a lower integrated circuit, a plurality of wirings, and an upper integrated circuit. The lower integrated circuit has a lower surface and an upper surface. The lower surface is adhered onto the first surface of the substrate. A plurality of bonding pads are formed on the upper surface. The wirings each has a first end and a second end. The first ends of the wirings are electrically connected to the bonding pads of the lower integrated circuit. The second ends of the wirings are electrically connected to the signal input terminals of the substrate. The upper integrated circuit has a lower surface and an upper surface. Two recesses are formed at two sides of the lower surface. The upper integrated circuit is adhered to the upper surface of the lower integrated circuit so as to stack above the lower integrated circuit.

Abstract: A structure of stacked integrated circuits arranged on a circuit board includes a substrate, a lower integrated circuit, a plurality of wirings, a passivation layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals for electrically connecting to the circuit board. The lower integrated circuit has a first surface and a second surface. The first surface of the lower integrated circuit is adhered onto the first surface of the substrate. The second surface of the lower integrated circuit is formed with a plurality of bonding pads. The wirings each includes a first end and a second end opposite to the first end. The first ends of the wirings are electrically connected to the bonding pads of the lower integrated circuit, and the second ends of the wirings are electrically connected to the signal input terminals of the substrate, respectively.

Abstract: A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of signal input terminals. The second surface is formed with a plurality of signal output terminals for electrically connecting to the circuit board. The integrated circuit has a lower surface and an upper surface. Recesses are formed at two sides of the lower surface, and a plurality of bonding pads are formed on the upper surface. The adhesive layer is used for adhering the lower surface of the integrated circuit to the first surface of the substrate. The wirings are electrically connecting to the bonding pads of the integrated circuit and to the signal input terminals of the substrate. The glue layer is used for sealing the plurality of wirings and the integrated circuits.

Abstract: An integrated circuit structure having an adhesive agent for adhering to a substrate includes a first surface and a second surface opposite to the first surface. The first surface is formed with a plurality of bonding pads for electrically connecting to the substrate and transmitting signals from the integrated circuit to the substrate. An adhesive agent, which is non-adhesive at the room temperature, is applied onto the second surface. The adhesive agent becomes adhesive under pressing/heating so as to adhere onto the substrate. According to the structure, the problems caused by the overflowed glue can be avoided, the manufacturing processes can be facilitated, and the yield can be improved.

Abstract: A pharmaceutical composition of omeprazole for oral administration is described which consists essentially of:(a) a pellet comprising an inert core component, a therapeutically effective amount of omeprazole, a surface active agent, a filler, a pharmaceutically acceptable alkaline agent and a binder; and(b) a single layer of coating on said pellet which comprises a layer of an enteric coating agent.

Abstract: A pharmaceutical composition of omeprazole for oral administration is described which consists essentially of:(a) a pellet comprising an inert core component, a therapeutically effective amount of omeprazole, a surface active agent, a filler, a pharmaceutically acceptable alkaline agent and a binder; and(b) a single layer of coating on said pellet which comprises a layer of an enteric coating agent.

Abstract: A controlled release dosage form which comprises:(a) a homogeneous compressed core which comprises a compressed granulation of:(i) particles of a calcium channel blocker compound coated with an enteric polymer that are dispersed onto a solid pharmaceutical filler; and(b) a continuous compressed outer layer around said homogeneous compressed core which comprises a compressed granulation of:(i) one or more pharmaceutically acceptable polymers which form a hydrogel in which calcium channel blocker compound is dispersed.

Abstract: A controlled release nifedipine tablet which comprises:(a) a homogeneous compressed core which comprises:(i) a medicament;(ii) a water soluble osmotic compound(iii) one or more osmotic polymers; and(b) a membrane coating which completely covers said core tablet which comprises a mixture of:(i) a water insoluble pharmaceutically acceptable polymer; and(ii) an enteric polymer.

Abstract: A plunger (22), used in a standard mold, has a vent seal device (23) and spring (24) that evacuates air through an exhaust port 26a, and channels 26 and 26b from the mold prior to moving the mold compound into the runner 27.

Abstract: A plunger (22), used in a standard mold, has a movable piston (23) and spring (24) that reduce the cull space when piston (23) is pressed downward into the cull mold compound.

Abstract: Gepirone compositions having extended release properties contain a gepirone salt, a cellulosic polymer matrix and suitable quantities of pharmaceutical excipients. Dosage forms based thereon require 18 to 24 hours for release of 90 to 95% of gepirone.