Abstract: The present invention provides a semiconductor device packaging assembly and method for manufacturing the assembly. Preferably, the method of the present invention is used to assemble a plurality of semiconductor chips, such that the throughput of assembly can be enhanced. The method comprises the steps of: providing a bottom frame matrix including a plurality of bottom frame units, each of which unit comprises a bottom supporting portion and a bottom frame portion; providing a bridge frame including a plurality of bridge frame units, each of which unit comprises a bridge frame portion and a plurality of conducting bars; placing each of the semiconductor chips on each of the bottom supporting portions, respectively, and bonding each bottom frame unit and each bridge frame unit together, wherein, the conducting bars extending from each bridge frame portion toward corresponding chips are electrically coupled to bonding areas of the corresponding chips.

Abstract: The present invention provides a semiconductor device packaging assembly and method for manufacturing the assembly. Preferably, the method of the present invention is used to assemble a plurality of semiconductor chips, such that the throughput of assembly can be enhanced. The method comprises the steps of: providing a bottom frame matrix including a plurality of bottom frame units, each of which unit comprises a bottom supporting portion and a bottom frame portion; providing a bridge frame including a plurality of bridge frame units, each of which unit comprises a bridge frame portion and a plurality of conducting bars; placing each of the semiconductor chips on each of the bottom supporting portions, respectively; and bonding each bottom frame unit and each bridge frame unit together, wherein, the conducting bars extending from each bridge frame portion toward corresponding chips are electrically coupled to bonding areas of the corresponding chips.

Abstract: A surface mounted diode comprises a pair of slugs pointed toward each other with a die disposed therebetween, at least one of the slugs being truncated cone shape, and a pair of solder wafers being disposed between the die and each slug to form an electrical connection therebetween. Each slug has a terminal formed at the tail thereof. The largest diameter of the truncated cone shape slug is approximately the same as or greater than the diagonal of the die. The function of the truncated shape of the slug is to protect the die from damage during handling and during curing of the encapsulating resin which occurs during the manufacturing process of the surface mounted diode.