Abstract: An assembly for use in a water cooler designed to hold an inverted water bottle, wherein the assembly includes a reservoir having a cylindrically extending side wall, a shoulder located in the side wall, and a bottom having at least one opening therethrough. The assembly also includes a bottle receiver located at least partially within the reservoir and having a mounting flange, a side wall extending down from the mounting flange to support a water bottle, and an opening at the bottom end of the side wall. A separator body is also provided that has a base extending at least partially over the shoulder on the reservoir, and a probe extending generally perpendicular from the base for engaging a cap of a water bottle. The separator body may include a tube extending down from the base, a bottom portion of which is lockingly engaged with a tube extending from the bottom of the reservoir.

Abstract: The present invention discloses a method of modifying a production forecast in a fabrication facility using an optimal dynamic recovery trend parameter by performing the steps of: determining a plurality of PODs; determining a total accuracy of a plurality of recovery trend parameters used to predict each POD; performing a regression analysis on a generated recovery trend parameter accuracy graph; and determining an optimal recovery trend using an associated recovery trend accuracy curve.

Abstract: This present discloses a method for making a concave bottom oxide within a trench, the steps comprising: providing a semiconductor substrate; forming an insulating layer on the semiconductor substrate; defining the insulating layer to form an opening exposing the surface of the semiconductor substrate; dry-etching the exposed semiconductor substrate within the opening by using the first insulating layer as an etching mask to form a trench; depositing a first oxide layer conformably over the insulating layer, the side-walls and the bottom of the trench; depositing a second oxide layer on the first oxide layer and filling-up the trench surrounded by the first oxide layer; annealing to densify the first and second oxide layers; etching-back the first and second oxide layer to remove the portion overlying the first insulating layer, and forming a spacer consisting of the residual first oxide layer on the side-walls of the trench, and a concave bottom oxide consisting of the first and second oxide layers on the bo

Abstract: A method for determining a crack limit of a target film deposited on a wafer in production after a post annealing procedure is disclosed. The crack limit is determined by adopting and adjusting the thermal shrinkage rates of a plurality of target films deposited on bare wafers and annealed. The test results on bare wafers can be applied to the production wafers to prevent from film cracking and/or inspect instrumental conditions.

Abstract: A method for preventing a target film deposited on a wafer in production from cracking after a post annealing procedure is disclosed. The method is performed by previously determining a crack limit before the target film is deposited on the wafer in production. The crack limit is determined by adopting and adjusting the thermal shrinkage rates of a plurality of target films deposited on bare wafers and annealed. After the crack limit is determined, a system-adjusting step and a reconfirmation step are performed, if necessary, to make sure the system conditions determined by the test results on bare wafers are suitably applied to the production wafers to prevent from film cracking. Moreover, the instrumental conditions can be inspected and tuned accordingly.

Abstract: A foldable device for keeping and displaying a shearing tool comprises a transparent top piece, a transparent bottom piece, and a connection piece located between the top piece and the bottom piece. The top piece is provided with a recessed receiving slot having a predetermined shape for holding the blades and the pivoting portion of the shearing tool such that the shearing tool can be tested without being removed from the device.