Patents by Inventor Calvin R. Augason

Calvin R. Augason has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Load lock chamber designs for high-throughput processing system
    Patent number: 9022715
    Abstract: Methods and apparatus for transferring one or more substrates from a first pressure environment to a second pressure environment is provided. In one embodiment, a load lock chamber is provided. The load lock chamber comprises a first circular housing, and a second circular housing disposed within and movable relative to the first circular housing, one of the first circular housing or the second circular housing comprising a plurality of discrete regions, wherein at least a portion of the plurality of discrete regions are in selective fluid communication with one of at least two vacuum pumps based on the angular position of the second circular housing relative to the first circular housing.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: May 5, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Alexander S. Polyak, James L'Heureux, Christopher T. Lane, Susanne Schlaefer, Juergen Henrich, Josef Thomas Hoog, Calvin R. Augason
  • LOAD LOCK CHAMBER DESIGNS FOR HIGH-THROUGHPUT PROCESSING SYSTEM
    Publication number: 20140079514
    Abstract: Methods and apparatus for transferring one or more substrates from a first pressure environment to a second pressure environment is provided. In one embodiment, a load lock chamber is provided. The load lock chamber comprises a first circular housing, and a second circular housing disposed within and movable relative to the first circular housing, one of the first circular housing or the second circular housing comprising a plurality of discrete regions, wherein at least a portion of the plurality of discrete regions are in selective fluid communication with one of at least two vacuum pumps based on the angular position of the second circular housing relative to the first circular housing.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 20, 2014
    Inventors: Alexander S. POLYAK, James L'HEUREUX, Christopher T. LANE, Susanne SCHLAEFER, Juergen HENRICH, Josef Thomas HOOG, Calvin R. AUGASON
  • Apparatus for improved remote microwave plasma source for use with substrate processing systems
    Publication number: 20010042513
    Abstract: An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
    Type: Application
    Filed: July 27, 2001
    Publication date: November 22, 2001
    Inventors: Chien-Teh Kao, Kenneth Tsai, Quyen Pham, Ronald L. Rose, Calvin R. Augason, Joseph Yudovsky
  • Method for improved remote microwave plasma source for use with substrate processing system
    Patent number: 6271148
    Abstract: An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
    Type: Grant
    Filed: October 13, 1999
    Date of Patent: August 7, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Chien-Teh Kao, Kenneth Tsai, Quyen Pham, Ronald L. Rose, Calvin R. Augason, Joseph Yudovsky
  • Apparatus for improved remote microwave plasma source for use with substrate processing systems
    Patent number: 6026762
    Abstract: An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
    Type: Grant
    Filed: April 23, 1997
    Date of Patent: February 22, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Chien-Teh Kao, Kenneth Tsai, Quyen Pham, Ronald L. Rose, Calvin R. Augason, Joseph Yudovsky