Patents by Inventor Cam Nguyen Ronald Ngo

Cam Nguyen Ronald Ngo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for supporting semiconductor devices during testing
    Patent number: 7486092
    Abstract: An apparatus supports, during a testing operation, a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus includes a main body and a leadframe support member, and the leadframe support is formed with at least one groove for receiving semiconductor devices such that in use leads extending from the semiconductor devices lie on a surface of the support member.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: February 3, 2009
    Assignee: ASM Assembly Automation Limited
    Inventors: Ching Man Tsui, Lap Kei Chow, Hui Fai Ho, Cam Nguyen Ronald Ngo
  • Apparatus and method for testing semiconductor devices
    Publication number: 20040195665
    Abstract: The present invention provides apparatus for supporting during a testing operation a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus comprises a main body and a leadframe support member, and the leadframe support member is formed with at least one groove for receiving semiconductor devices such that in use leads extending from said devices lie on a surface of said support member.
    Type: Application
    Filed: April 22, 2004
    Publication date: October 7, 2004
    Applicant: ASM ASSEMBLY AUTOMATION LIMITED
    Inventors: Ching Man Tsui, Lap Kei Chow, Hui Fai Ho, Cam Nguyen Ronald Ngo
  • Apparatus and method for testing semiconductor devices
    Publication number: 20020196043
    Abstract: The present invention provides apparatus for supporting during a testing operation a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus comprises a main body and a leadframe support member, and the leadframe support member is formed with at least one groove for receiving semiconductor devices such that in use leads extending from said devices lie on a surface of said support member.
    Type: Application
    Filed: June 26, 2001
    Publication date: December 26, 2002
    Inventors: Ching Man Tsui, Lap Kei Chow, Hui Fai Ho, Cam Nguyen Ronald Ngo