Patents by Inventor Camille Kokozaki

Camille Kokozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-package slot array
    Patent number: 7968989
    Abstract: A multi-package module that includes a multi-layer interconnect structure, a housing structure attached to the multi-layer interconnect structure, and a plurality of integrated circuit packages inserted into slots in the housing structure, and placed into contact with the multi-layer interconnect structure. The integrated circuit packages can be removed from the slots in the housing structure, thereby enabling testing and/or replacement of the integrated circuit packages.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: June 28, 2011
    Assignee: Integrated Device Technology, inc
    Inventors: Camille Kokozaki, Jitesh Shah
  • Multi-Package Ball Grid Array
    Publication number: 20090321905
    Abstract: A multi-package module that includes a multi-layer interconnect structure, a housing structure attached to the multi-layer interconnect structure, and a plurality of integrated circuit packages inserted into slots in the housing structure, and placed into contact with the multi-layer interconnect structure. The integrated circuit packages can be removed from the slots in the housing structure, thereby enabling testing and/or replacement of the integrated circuit packages.
    Type: Application
    Filed: June 27, 2008
    Publication date: December 31, 2009
    Applicant: Integrated Device Technology, Inc.
    Inventors: Camille Kokozaki, Jitesh Shah