Abstract: A charging device has a first printed circuit board (PCB) having a top metal layer and a bottom metal layer, where a first plurality of charging cells is provided on the top metal layer of the first PCB and a second plurality of charging cells is provided on the bottom metal layer of the first PCB. The charging device may have a second PCB having a top metal layer and a bottom metal layer, where a third plurality of charging cells is provided on the top metal layer of the second PCB and a fourth plurality of charging cells is provided on the bottom metal layer of the second PCB. An adhesive layer may join the first and second PCBs. One or more interconnects may be provided between the bottom metal layer of the first PCB and the top metal layer of the second PCB.

Abstract: Systems, methods and apparatus for wireless charging are disclosed. A test apparatus has a receiving head configured to provide a measurement signal representative of electromagnetic flux received from one or more transmitting coils of a wireless charging surface, a numerically-controlled stage configured to position the receiving head at a selected point in three-dimensional space above wireless charging surface, and a processor configured to cause the numerically-controlled stage to position the receiving head at the selected point in three-dimensional space, and use the measurement signal to determine magnitude of the electromagnetic flux or power received from the wireless charging surface proximate to the selected point in three-dimensional space.

Abstract: A charging device has a first printed circuit board (PCB) having a top metal layer and a bottom metal layer, where a first plurality of charging cells is provided on the top metal layer of the first PCB and a second plurality of charging cells is provided on the bottom metal layer of the first PCB. The charging device may have a second PCB having a top metal layer and a bottom metal layer, where a third plurality of charging cells is provided on the top metal layer of the second PCB and a fourth plurality of charging cells is provided on the bottom metal layer of the second PCB. An adhesive layer may join the first and second PCBs. One or more interconnects may be provided between the bottom metal layer of the first PCB and the top metal layer of the second PCB.

Abstract: Systems, methods and apparatus for wireless charging are disclosed. A test apparatus has a receiving head configured to provide a measurement signal representative of electromagnetic flux received from one or more transmitting coils of a wireless charging surface, a numerically-controlled stage configured to position the receiving head at a selected point in three-dimensional space above wireless charging surface, and a processor configured to cause the numerically-controlled stage to position the receiving head at the selected point in three-dimensional space, and use the measurement signal to determine magnitude of the electromagnetic flux or power received from the wireless charging surface proximate to the selected point in three-dimensional space.

Abstract: A charging stand placeable on a charging surface has a receiver circuit in a base configured to receive power from a wireless charging device through a receiving coil in the base. A support of the charging stand has a transmitting coil configured to transmit power to a chargeable device mounted on the support, and a power transfer circuit receives an induced current from the receiving coil in the base and provides a charging current to the transmitting coil. An energy storage device is configured to receive the induced current or a rectified current. A transmitter circuit is configured to provide the charging current to the transmitting coil. A sensor is configured to detect whether the chargeable device is mounted on the support, and a controller may be configured to power-down the power transfer circuit when chargeable device is not mounted on the support.

Abstract: A charging device has a first printed circuit board (PCB) having a top metal layer and a bottom metal layer, where a first plurality of charging cells is provided on the top metal layer of the first PCB and a second plurality of charging cells is provided on the bottom metal layer of the first PCB. The charging device may have a second PCB having a top metal layer and a bottom metal layer, where a third plurality of charging cells is provided on the top metal layer of the second PCB and a fourth plurality of charging cells is provided on the bottom metal layer of the second PCB. An adhesive layer may join the first and second PCBs. One or more interconnects may be provided between the bottom metal layer of the first PCB and the top metal layer of the second PCB.

Abstract: Some embodiments include a system to control when electricity is provided to an inductive load. Other embodiments of related systems and methods are also disclosed.