Patents by Inventor Candace A. Sullivan
Candace A. Sullivan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8835289Abstract: A wafer and a fabrication method include a base structure including a substrate for fabricating semiconductor devices. The base structure includes a front side where the semiconductor devices are formed and a back side opposite the front side. An integrated layer is formed in the back side of the base structure including impurities configured to alter etch selectivity relative to the base structure such that the integrated layer is selectively removable from the base structure to remove defects incurred during fabrication of the semiconductor devices.Type: GrantFiled: June 12, 2013Date of Patent: September 16, 2014Assignee: International Business Machines CorporationInventors: Jennifer C. Clark, Emily R. Kinser, Ian D. Melville, Candace A. Sullivan
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Patent number: 8629063Abstract: A method includes forming a cavity in a substrate, depositing a layer of conductive material in the cavity and over exposed portions of the substrate, removing portions of the conductive material to expose portions of the substrate using a planarizing process, and removing residual portions of the conductive material disposed on the substrate using a reactive ion etch (RIE) process.Type: GrantFiled: June 8, 2011Date of Patent: January 14, 2014Assignee: International Business Machines CorporationInventors: Danielle L. DeGraw, Candace A. Sullivan
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Publication number: 20130273743Abstract: A wafer and a fabrication method include a base structure including a substrate for fabricating semiconductor devices. The base structure includes a front side where the semiconductor devices are formed and a back side opposite the front side. An integrated layer is formed in the back side of the base structure including impurities configured to alter etch selectivity relative to the base structure such that the integrated layer is selectively removable from the base structure to remove defects incurred during fabrication of the semiconductor devices.Type: ApplicationFiled: June 12, 2013Publication date: October 17, 2013Inventors: Jennifer C. Clark, Emily R. Kinser, Ian D. Melville, Candace A. Sullivan
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Patent number: 8486814Abstract: A wafer and a fabrication method include a base structure including a substrate for fabricating semiconductor devices. The base structure includes a front side where the semiconductor devices are formed and a back side opposite the front side. An integrated layer is formed in the back side of the base structure including impurities configured to alter etch selectivity relative to the base structure such that the integrated layer is selectively removable from the base structure to remove defects incurred during fabrication of the semiconductor devices.Type: GrantFiled: July 21, 2011Date of Patent: July 16, 2013Assignee: International Business Machines CorporationInventors: Jennifer C. Clark, Emily R. Kinser, Ian D. Melville, Candace A. Sullivan
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Publication number: 20130020682Abstract: A wafer and a fabrication method include a base structure including a substrate for fabricating semiconductor devices. The base structure includes a front side where the semiconductor devices are formed and a back side opposite the front side. An integrated layer is formed in the back side of the base structure including impurities configured to alter etch selectivity relative to the base structure such that the integrated layer is selectively removable from the base structure to remove defects incurred during fabrication of the semiconductor devices.Type: ApplicationFiled: July 21, 2011Publication date: January 24, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jennifer C. Clark, Emily R. Kinser, Ian D. Melville, Candace A. Sullivan
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Publication number: 20120313250Abstract: A method includes forming a cavity in a substrate, depositing a layer of conductive material in the cavity and over exposed portions of the substrate, removing portions of the conductive material to expose portions of the substrate using a planarizing process, and removing residual portions of the conductive material disposed on the substrate using a reactive ion etch (RIE) process.Type: ApplicationFiled: June 8, 2011Publication date: December 13, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Danielle L. DeGraw, Candace A. Sullivan
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Patent number: 6351871Abstract: This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.Type: GrantFiled: June 17, 1999Date of Patent: March 5, 2002Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, John T. Butler, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, James N. Humenik, John U. Knickerbocker, Daniel S. Mackin, Glenn A. Pomerantz, David E. Speed, Candace A. Sullivan, Bruce E. Tripp, James C. Utter
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Patent number: 6280527Abstract: This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.Type: GrantFiled: June 12, 1998Date of Patent: August 28, 2001Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, John T. Butler, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, James N. Humenik, John U. Knickerbocker, Daniel S. Mackin, Glenn A. Pomerantz, David E. Speed, Candace A. Sullivan, Bruce E. Tripp, James C. Utter
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Patent number: 6177184Abstract: An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.Type: GrantFiled: August 13, 1998Date of Patent: January 23, 2001Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael A. Cohn, Michael E. Cropp, Candace A. Sullivan, Robert J. Sullivan, Andrew H. Vogel
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Patent number: 6032683Abstract: A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.Type: GrantFiled: February 26, 1999Date of Patent: March 7, 2000Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, John U. Knickerbocker, David C. Long, Daniel S. Mackin, Glenn A. Pomerantz, Krishna G. Sachdev, David E. Speed, Candace A. Sullivan, Robert J. Sullivan, Bruce E. Tripp, James C. Utter
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Patent number: 5916374Abstract: A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.Type: GrantFiled: February 9, 1998Date of Patent: June 29, 1999Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, John U. Knickerbocker, David C. Long, Daniel S. Mackin, Glenn A. Pomerantz, Krishna G. Sachdev, David E. Speed, Candace A. Sullivan, Robert J. Sullivan, Bruce E. Tripp, James C. Utter
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Patent number: 5866470Abstract: A process for making multiple microelectronic ceramic substrates uses an interface layer between stacked layers of green sheets that are laminated with the interface layer, then fired to produce the ceramic substrates. The interface layer acts to protect the substrates, and to hold them together before firing, then thermally degrades at a desired point in the firing cycle to separate the individual substrates. The invention also includes the ceramic substrates produced by the method.Type: GrantFiled: October 8, 1996Date of Patent: February 2, 1999Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael A. Cohn, John J. Garant, Abubaker S. Shagan, Candace A. Sullivan, Robert J. Sullivan, Andrew H. Vogel
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Patent number: 5800761Abstract: An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.Type: GrantFiled: October 8, 1996Date of Patent: September 1, 1998Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael A. Cohn, Michael E. Cropp, Candace A. Sullivan, Robert J. Sullivan, Andrew H. Vogel
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Patent number: 5635000Abstract: The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.Type: GrantFiled: December 22, 1995Date of Patent: June 3, 1997Assignee: International Business Machines CorporationInventors: Jon A. Casey, Cynthia J. Calli, Darren T. Cook, David B. Goland, John U. Knickerbocker, Mark J. LaPlante, David C. Long, Daniel S. Mackin, Kathleen M. McGuire, Keith C. O'Neil, Kevin M. Prettyman, Michael T. Puchalski, Joseph C. Saltarelli, Candace A. Sullivan