Patents by Inventor Canyuan ZHANG
Canyuan ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990577Abstract: A light-emitting device includes a lead frame having a first surface on which a patterned conductive layer is provided, and a light-emitting element. The light-emitting element includes an insulating substrate formed on the first surface, a plurality of light-emitting units formed on the insulating substrate, at least one first electrode, at least one second electrode and at least a pair of bonding wires. The first and second electrodes are respectively placed in electrical connection with a first one and a second one of the light-emitting units, and are disposed outward of the light-emitting units. Each of the pair of bonding wires is disposed to electrically connect a respective one of the first and second electrodes to the patterned conductive layer.Type: GrantFiled: September 2, 2021Date of Patent: May 21, 2024Assignee: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD.Inventors: Shaohua Huang, Xiaoqiang Zeng, Jianfeng Yang, Canyuan Zhang
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Publication number: 20240021755Abstract: A display panel, a manufacturing method thereof and a display device are provided. The method includes: forming a display panel including light emitting elements, the plurality of light emitting elements includes first color light emitting elements and second color light emitting elements. The method includes at least one of: transferring the first color light emitting elements and the second color light emitting elements by different transfer methods, growing the first color light emitting elements and the second color light emitting elements by different growth substrate patterns, or making the first color light emitting elements and the second color light emitting elements with different surface microstructures facing a light emitting surface of the display panel.Type: ApplicationFiled: September 27, 2023Publication date: January 18, 2024Applicant: TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.Inventors: Jingtao GUO, Canyuan ZHANG, Qiang GU, Bo ZHOU
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Publication number: 20230402442Abstract: A display panel includes a backplate, a eutectic bonding layer and an auxiliary layer that are located at a side of the backplate, and a plurality of light-emitting element bodies. The auxiliary layer includes a plurality of first members and a second member. At least one first member of the plurality of first members surrounds one part of the eutectic bonding layer, and the second member surrounds the plurality of first members. Each of the plurality of light-emitting element bodies is located at a side of the eutectic bonding layer and is connected to one part of the eutectic bonding layer.Type: ApplicationFiled: August 25, 2023Publication date: December 14, 2023Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.Inventor: Canyuan ZHANG
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Patent number: 11776942Abstract: A method for manufacturing a display panel includes providing a backplate, forming bonding parts on backplate, forming an auxiliary layer on backplate, releasing light-emitting elements onto the auxiliary layer such that electrodes of the light-emitting elements are in contact with the first parts to form an intermediate backplate, arranging the intermediate backplate under first predetermined condition under which a fluidity of the first part is greater than that of the second part, and bonding the electrodes and the bonding parts to form an eutectic bonding layer, and arranging the intermediate backplate under second predetermined condition such that the first and second parts form solid-state first and second members. The backplate includes first and second regions. The bonding parts are located in the first regions. The auxiliary layer covers the backplate and the bonding parts. The auxiliary layer includes first and second parts respectively located in the first and second regions.Type: GrantFiled: December 19, 2022Date of Patent: October 3, 2023Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.Inventor: Canyuan Zhang
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Publication number: 20230117132Abstract: A method for manufacturing a display panel includes providing a backplate, forming bonding parts on backplate, forming an auxiliary layer on backplate, releasing light-emitting elements onto the auxiliary layer such that electrodes of the light-emitting elements are in contact with the first parts to form an intermediate backplate, arranging the intermediate backplate under first predetermined condition under which a fluidity of the first part is greater than that of the second part, and bonding the electrodes and the bonding parts to form an eutectic bonding layer, and arranging the intermediate backplate under second predetermined condition such that the first and second parts form solid-state first and second members. The backplate includes first and second regions. The bonding parts are located in the first regions. The auxiliary layer covers the backplate and the bonding parts. The auxiliary layer includes first and second parts respectively located in the first and second regions.Type: ApplicationFiled: December 19, 2022Publication date: April 20, 2023Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.Inventor: Canyuan ZHANG
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Patent number: 11309297Abstract: A light-emitting diode (LED) chip includes a semiconductor epitaxial structure, an insulating substrate, a first metal layer, and a second metal layer. The semiconductor epitaxial structure includes a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a light-emitting layer interposed between the first semiconductor epitaxial layer and the second semiconductor epitaxial layer. The insulating substrate has two opposite surfaces, and the first and second metal layers are respectively disposed on the two surfaces of the insulating substrate. An LED device and an LED lamp including the LED chip are also disclosed.Type: GrantFiled: August 17, 2020Date of Patent: April 19, 2022Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Xiaoqiang Zeng, Shaohua Huang, Jianfeng Yang, Canyuan Zhang
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Publication number: 20220005993Abstract: A light-emitting device includes a lead frame having a first surface on which a patterned conductive layer is provided, and a light-emitting element. The light-emitting element includes an insulating substrate formed on the first surface, a plurality of light-emitting units formed on the insulating substrate, at least one first electrode, at least one second electrode and at least a pair of bonding wires. The first and second electrodes are respectively placed in electrical connection with a first one and a second one of the light-emitting units, and are disposed outward of the light-emitting units. Each of the pair of bonding wires is disposed to electrically connect a respective one of the first and second electrodes to the patterned conductive layer.Type: ApplicationFiled: September 2, 2021Publication date: January 6, 2022Inventors: SHAOHUA HUANG, XIAOQIANG ZENG, JIANFENG YANG, CANYUAN ZHANG
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Publication number: 20210226088Abstract: Disclosed is a light-emitting diode chip. A first electrode and a second electrode of the light-emitting diode chip face towards a front side. A back side of a first conduction layer is directly connected to a front side of a base. A portion of the first conduction layer is at least exposed from the front side to be used for the arrangement of the first electrode. A portion of a second conduction layer is at least exposed from the front side to be used for the arrangement of the second electrode. The exposed first conduction layer and the exposed second conduction layer are of equal height. An insulating layer extending from a recess covers a back side of the second conductive layer.Type: ApplicationFiled: April 8, 2021Publication date: July 22, 2021Inventors: Canyuan ZHANG, Shaohua HUANG, Xiaoqiang ZENG, Chen-ke HSU
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Publication number: 20210226089Abstract: A light emitting device includes at least one light emitting unit that includes an insulating layer, a first electrically conductive layer, and a semiconductor layer structure having at least one recess. The first electrically conductive layer and the insulating layer extend into the recess. A contact area between a conductive protrusion portion of the first electrically conductive layer and a first-type semiconductor layer of the semiconductor layer structure is larger than 1.5% of an area of a bottom surface of the first-type semiconductor layer. A method for producing the light emitting device is also disclosed.Type: ApplicationFiled: April 8, 2021Publication date: July 22, 2021Inventors: SHAOHUA HUANG, XIAOQIANG ZENG, CANYUAN ZHANG, JIANFENG YANG
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Publication number: 20200381412Abstract: A light-emitting diode (LED) chip includes a semiconductor epitaxial structure, an insulating substrate, a first metal layer, and a second metal layer. The semiconductor epitaxial structure includes a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a light-emitting layer interposed between the first semiconductor epitaxial layer and the second semiconductor epitaxial layer. The insulating substrate has two opposite surfaces, and the first and second metal layers are respectively disposed on the two surfaces of the insulating substrate. An LED device and an LED lamp including the LED chip are also disclosed.Type: ApplicationFiled: August 17, 2020Publication date: December 3, 2020Inventors: Xiaoqiang ZENG, Shaohua HUANG, Jianfeng YANG, Canyuan ZHANG