Patents by Inventor Canyuan ZHANG

Canyuan ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990577
    Abstract: A light-emitting device includes a lead frame having a first surface on which a patterned conductive layer is provided, and a light-emitting element. The light-emitting element includes an insulating substrate formed on the first surface, a plurality of light-emitting units formed on the insulating substrate, at least one first electrode, at least one second electrode and at least a pair of bonding wires. The first and second electrodes are respectively placed in electrical connection with a first one and a second one of the light-emitting units, and are disposed outward of the light-emitting units. Each of the pair of bonding wires is disposed to electrically connect a respective one of the first and second electrodes to the patterned conductive layer.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: May 21, 2024
    Assignee: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Shaohua Huang, Xiaoqiang Zeng, Jianfeng Yang, Canyuan Zhang
  • Publication number: 20240021755
    Abstract: A display panel, a manufacturing method thereof and a display device are provided. The method includes: forming a display panel including light emitting elements, the plurality of light emitting elements includes first color light emitting elements and second color light emitting elements. The method includes at least one of: transferring the first color light emitting elements and the second color light emitting elements by different transfer methods, growing the first color light emitting elements and the second color light emitting elements by different growth substrate patterns, or making the first color light emitting elements and the second color light emitting elements with different surface microstructures facing a light emitting surface of the display panel.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Applicant: TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
    Inventors: Jingtao GUO, Canyuan ZHANG, Qiang GU, Bo ZHOU
  • Publication number: 20230402442
    Abstract: A display panel includes a backplate, a eutectic bonding layer and an auxiliary layer that are located at a side of the backplate, and a plurality of light-emitting element bodies. The auxiliary layer includes a plurality of first members and a second member. At least one first member of the plurality of first members surrounds one part of the eutectic bonding layer, and the second member surrounds the plurality of first members. Each of the plurality of light-emitting element bodies is located at a side of the eutectic bonding layer and is connected to one part of the eutectic bonding layer.
    Type: Application
    Filed: August 25, 2023
    Publication date: December 14, 2023
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventor: Canyuan ZHANG
  • Patent number: 11776942
    Abstract: A method for manufacturing a display panel includes providing a backplate, forming bonding parts on backplate, forming an auxiliary layer on backplate, releasing light-emitting elements onto the auxiliary layer such that electrodes of the light-emitting elements are in contact with the first parts to form an intermediate backplate, arranging the intermediate backplate under first predetermined condition under which a fluidity of the first part is greater than that of the second part, and bonding the electrodes and the bonding parts to form an eutectic bonding layer, and arranging the intermediate backplate under second predetermined condition such that the first and second parts form solid-state first and second members. The backplate includes first and second regions. The bonding parts are located in the first regions. The auxiliary layer covers the backplate and the bonding parts. The auxiliary layer includes first and second parts respectively located in the first and second regions.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: October 3, 2023
    Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventor: Canyuan Zhang
  • Publication number: 20230117132
    Abstract: A method for manufacturing a display panel includes providing a backplate, forming bonding parts on backplate, forming an auxiliary layer on backplate, releasing light-emitting elements onto the auxiliary layer such that electrodes of the light-emitting elements are in contact with the first parts to form an intermediate backplate, arranging the intermediate backplate under first predetermined condition under which a fluidity of the first part is greater than that of the second part, and bonding the electrodes and the bonding parts to form an eutectic bonding layer, and arranging the intermediate backplate under second predetermined condition such that the first and second parts form solid-state first and second members. The backplate includes first and second regions. The bonding parts are located in the first regions. The auxiliary layer covers the backplate and the bonding parts. The auxiliary layer includes first and second parts respectively located in the first and second regions.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 20, 2023
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventor: Canyuan ZHANG
  • Patent number: 11309297
    Abstract: A light-emitting diode (LED) chip includes a semiconductor epitaxial structure, an insulating substrate, a first metal layer, and a second metal layer. The semiconductor epitaxial structure includes a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a light-emitting layer interposed between the first semiconductor epitaxial layer and the second semiconductor epitaxial layer. The insulating substrate has two opposite surfaces, and the first and second metal layers are respectively disposed on the two surfaces of the insulating substrate. An LED device and an LED lamp including the LED chip are also disclosed.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: April 19, 2022
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xiaoqiang Zeng, Shaohua Huang, Jianfeng Yang, Canyuan Zhang
  • Publication number: 20220005993
    Abstract: A light-emitting device includes a lead frame having a first surface on which a patterned conductive layer is provided, and a light-emitting element. The light-emitting element includes an insulating substrate formed on the first surface, a plurality of light-emitting units formed on the insulating substrate, at least one first electrode, at least one second electrode and at least a pair of bonding wires. The first and second electrodes are respectively placed in electrical connection with a first one and a second one of the light-emitting units, and are disposed outward of the light-emitting units. Each of the pair of bonding wires is disposed to electrically connect a respective one of the first and second electrodes to the patterned conductive layer.
    Type: Application
    Filed: September 2, 2021
    Publication date: January 6, 2022
    Inventors: SHAOHUA HUANG, XIAOQIANG ZENG, JIANFENG YANG, CANYUAN ZHANG
  • Publication number: 20210226088
    Abstract: Disclosed is a light-emitting diode chip. A first electrode and a second electrode of the light-emitting diode chip face towards a front side. A back side of a first conduction layer is directly connected to a front side of a base. A portion of the first conduction layer is at least exposed from the front side to be used for the arrangement of the first electrode. A portion of a second conduction layer is at least exposed from the front side to be used for the arrangement of the second electrode. The exposed first conduction layer and the exposed second conduction layer are of equal height. An insulating layer extending from a recess covers a back side of the second conductive layer.
    Type: Application
    Filed: April 8, 2021
    Publication date: July 22, 2021
    Inventors: Canyuan ZHANG, Shaohua HUANG, Xiaoqiang ZENG, Chen-ke HSU
  • Publication number: 20210226089
    Abstract: A light emitting device includes at least one light emitting unit that includes an insulating layer, a first electrically conductive layer, and a semiconductor layer structure having at least one recess. The first electrically conductive layer and the insulating layer extend into the recess. A contact area between a conductive protrusion portion of the first electrically conductive layer and a first-type semiconductor layer of the semiconductor layer structure is larger than 1.5% of an area of a bottom surface of the first-type semiconductor layer. A method for producing the light emitting device is also disclosed.
    Type: Application
    Filed: April 8, 2021
    Publication date: July 22, 2021
    Inventors: SHAOHUA HUANG, XIAOQIANG ZENG, CANYUAN ZHANG, JIANFENG YANG
  • Publication number: 20200381412
    Abstract: A light-emitting diode (LED) chip includes a semiconductor epitaxial structure, an insulating substrate, a first metal layer, and a second metal layer. The semiconductor epitaxial structure includes a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a light-emitting layer interposed between the first semiconductor epitaxial layer and the second semiconductor epitaxial layer. The insulating substrate has two opposite surfaces, and the first and second metal layers are respectively disposed on the two surfaces of the insulating substrate. An LED device and an LED lamp including the LED chip are also disclosed.
    Type: Application
    Filed: August 17, 2020
    Publication date: December 3, 2020
    Inventors: Xiaoqiang ZENG, Shaohua HUANG, Jianfeng YANG, Canyuan ZHANG