Patents by Inventor Cariappa Baduvamanda

Cariappa Baduvamanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11685990
    Abstract: Processing chamber components and methods of manufacture of same are provided herein. In some embodiments, a component part body includes a component part body having a base plane and at least one textured surface region, wherein the at least one textured surface region comprises a plurality of independent surface features having a first side having at least a 45 degree angle with respect to the base plane. In at least some embodiments, the textured surface includes a plurality of independent surface features which are pore free.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: June 27, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Cariappa Baduvamanda, Ong Pang Yen, Lit Ping Lam
  • Publication number: 20190177835
    Abstract: Processing chamber components and methods of manufacture of same are provided herein. In some embodiments, a component part body includes a component part body having a base plane and at least one textured surface region, wherein the at least one textured surface region comprises a plurality of independent surface features having a first side having at least a 45 degree angle with respect to the base plane. In at least some embodiments, the textured surface includes a plurality of independent surface features which are pore free.
    Type: Application
    Filed: December 8, 2017
    Publication date: June 13, 2019
    Inventors: Cariappa BADUVAMANDA, Ong Pang Yen, Lit Ping LAM
  • Patent number: 10168229
    Abstract: Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: January 1, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Govinda Raj, Bopanna Ichettria Vasantha, Ashish Bhatnagar, Cariappa Baduvamanda
  • Publication number: 20180017447
    Abstract: Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.
    Type: Application
    Filed: September 28, 2017
    Publication date: January 18, 2018
    Inventors: Govinda RAJ, Bopanna Ichettria VASANTHA, Ashish BHATNAGAR, Cariappa BADUVAMANDA
  • Patent number: 9823133
    Abstract: Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.
    Type: Grant
    Filed: July 17, 2010
    Date of Patent: November 21, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Govinda Raj, Bopanna Ichettria, Ashish Bhatnagar, Cariappa Baduvamanda
  • Publication number: 20110013669
    Abstract: Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.
    Type: Application
    Filed: July 17, 2010
    Publication date: January 20, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: GOVINDA RAJ, Bopanna Ichettria, Ashish Bhatnagar, Cariappa Baduvamanda
  • Publication number: 20060255321
    Abstract: In one embodiment, a radiation shielding composition comprises lead oxide or lead composite material of predetermined particle size, and an adhesive, wherein the composition comprises free flow property.
    Type: Application
    Filed: May 10, 2005
    Publication date: November 16, 2006
    Applicant: General Electric Company
    Inventors: Cariappa Baduvamanda, Bhaskar Raj
  • Publication number: 20060007624
    Abstract: Methods and arrangements for reducing partial discharges on a printed circuit board are provided. A method of reducing partial discharge in a printed circuit board includes providing a conducting surface coupled to a component under at least one of electrical and thermal stress, wherein the conducting surface is a metallic plate.
    Type: Application
    Filed: July 9, 2004
    Publication date: January 12, 2006
    Inventors: Senthil Sundaram, Rohini Krishnamoorthy, Cariappa Baduvamanda