Abstract: A cure promoter composition is disclosed, including an accelerator which may include a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, sulfur chloride, or combinations thereof. The cure promoter composition also includes a compatibilizing carrier, one or more organic solvents, a catalyst, an optional reducing agent, an optional reactive silane, an optional reactive organometallic, an optional gelling agent, and an optional aqueous component.

Abstract: A cure promoter composition is disclosed, including an accelerator which may include a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, sulfur chloride, or combinations thereof. The cure promoter composition also includes a compatibilizing carrier, one or more organic solvents, a catalyst, an optional reducing agent, an optional reactive silane, an optional reactive organometallic, an optional gelling agent, and an optional aqueous component.

Abstract: A cure promoter composition is disclosed, including an accelerator which may include a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, sulfur chloride, or combinations thereof. The cure promoter composition also includes a compatibilizing carrier, one or more organic solvents, a catalyst, an optional reducing agent, an optional reactive silane, an optional reactive organometallic, an optional gelling agent, and an optional aqueous component.

Abstract: Disclosed herein are methods and apparatuses for curing a polymerizable material capable of cure through a redox reaction by electrically contacting the polymerizable material with an anode and a cathode to create a voltage bias that promotes curing of the polymerizable material.

Abstract: An adhesion promoter composition is disclosed. The adhesion promoter composition also includes one or more reactive silanes which includes a mercaptopropyltrimethoxysilane, a glycidoxypropyltrimethoxysilane, or combinations thereof. The adhesion promoter composition also includes one or more reactive organometallics. The composition may include one or more organic solvents, an optional one or more gelling agents, and an optional one or more functional additives.

Abstract: An adhesion promoter composition is disclosed. The adhesion promoter composition includes a first reactive silane compound and a second reactive silane compound, where the second reactive silane is different from the first. The adhesion promoter composition also includes one or more organic solvents and an organic base. A method for applying the adhesion promoter composition is also disclosed.

Abstract: Methods comprising the steps of contacting a surface with a liquid composition comprising a cleaning agent, an adhesion promoter, and at least one dye, the surface having a first surface contamination; transitioning at least one portion of the surface in the first surface contamination state to a second surface contamination state and simultaneously distributing the at least one dye and at least one adhesion promoter on the surface associated with the second surface contamination state, the second surface contamination state having reduced or eliminated surface contamination, the transitioning step simultaneously cleaning and preparing the at least one portion of the surface for adhesion to another material; and identifying remaining surface in the first surface contamination state, and compositions adapted for the method thereof.

Abstract: Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR1R2R3, wherein each of R1, R2, and R3 is independently linear or branched C1-20 alkyl or two or more of R1, R2, and R3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70° F. and at least 8 ksi at 2% offset at 190° F.

Abstract: Methods comprising the steps of contacting a surface with a liquid composition comprising a cleaning agent, an adhesion promoter, and at least one dye, the surface having a first surface contamination; transitioning at least one portion of the surface in the first surface contamination state to a second surface contamination state and simultaneously distributing the at least one dye and at least one adhesion promoter on the surface associated with the second surface contamination state, the second surface contamination state having reduced or eliminated surface contamination, the transitioning step simultaneously cleaning and preparing the at least one portion of the surface for adhesion to another material; and identifying remaining surface in the first surface contamination state, and compositions adapted for the method thereof.

Abstract: Methods comprising the steps of contacting a surface with a liquid composition comprising a cleaning agent, an adhesion promoter, and at least one dye, the surface having a first surface contamination; transitioning at least one portion of the surface in the first surface contamination state to a second surface contamination state and simultaneously distributing the at least one dye and at least one adhesion promoter on the surface associated with the second surface contamination state, the second surface contamination state having reduced or eliminated surface contamination, the transitioning step simultaneously cleaning and preparing the at least one portion of the surface for adhesion to another material; and identifying remaining surface in the first surface contamination state, and compositions adapted for the method thereof.

Abstract: Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR1R2R3, wherein each of R1, R2, and R3 is independently linear or branched C1-20 alkyl or two or more of R1, R2, and R3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70° F. and at least 8 ksi at 2% offset at 190° F.

Abstract: Methods comprising the steps of contacting a surface with a liquid composition comprising a cleaning agent, an adhesion promoter, and at least one dye, the surface having a first surface contamination; transitioning at least one portion of the surface in the first surface contamination state to a second surface contamination state and simultaneously distributing the at least one dye and at least one adhesion promoter on the surface associated with the second surface contamination state, the second surface contamination state having reduced or eliminated surface contamination, the transitioning step simultaneously cleaning and preparing the at least one portion of the surface for adhesion to another material; and identifying remaining surface in the first surface contamination state, and compositions adapted for the method thereof.

Abstract: A method and apparatus for covering a fastener system. In one illustrative embodiment, an apparatus comprises a cover. The cover is configured to be placed over a fastener system at a surface of an object in which the fastener system is installed. The cover is comprised of a number of composite materials selected such that the cover is configured to reduce an effect of an electrical discharge, which occurs around the fastener system, on an environment outside the cover.

Abstract: Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR1R2R3, wherein each of R1, R2, and R3 is independently linear or branched C1-20 alkyl or two or more of R1, R2, and R3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70° F. and at least 8 ksi at 2% offset at 190° F.

Abstract: A method and apparatus for applying sealant. The apparatus may comprise a shaping portion, a centering portion, and a support system. The shaping portion may have a cavity configured to receive a fastener system and receive a sealant. The centering portion may have a channel configured to position the shaping portion in a desired position around the fastener system when the fastener system is received in the cavity. The support system may be configured to maintain the desired position of the apparatus.

Abstract: Cured flexible sealant may be removed from a substrate if the cured flexible sealant includes within its volume a susceptor such as metal susceptor particles. Removal proceeds by exposing the sealant with the susceptor to radio-frequency radiation sufficient to cause dielectric heating in the susceptor. The consequent heating in the cured sealant reduces the bond strength of the cured sealant. The reduced bond-strength sealant may be removed by physical methods, such as scraping etc., much more easily than the original (unexposed) cured sealant. Also disclosed are sealant compositions with susceptor, susceptor tools to introduce susceptor into cured sealant, and handheld radio-frequency heaters to apply radio-frequency radiation to cured sealant.

Abstract: Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR1R2R3, wherein each of R1, R2, and R3 is independently linear or branched C1-20 alkyl or two or more of R1, R2, and R3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70° F. and at least 8 ksi at 2% offset at 190° F.

Abstract: A method for installing a seal cap. The seal cap may be adhered to a fastener element using a material. A portion of the material may be squeezed out as excess material in response to adhering the seal cap to the fastener element. A number of projections associated with the seal cap may be moved along an interface formed between the seal cap and an object in which the fastener element has been installed. The excess material may be faired using the number of projections as the number of projections is moved along the interface between the seal cap and the object.

Abstract: Cured flexible sealant may be removed from a substrate if the cured flexible sealant includes within its volume a susceptor such as metal susceptor particles. Removal proceeds by exposing the sealant with the susceptor to radio-frequency radiation sufficient to cause dielectric heating in the susceptor. The consequent heating in the cured sealant reduces the bond strength of the cured sealant. The reduced bond-strength sealant may be removed by physical methods, such as scraping etc., much more easily than the original (unexposed) cured sealant. Also disclosed are sealant compositions with susceptor, susceptor tools to introduce susceptor into cured sealant, and handheld radio-frequency heaters to apply radio-frequency radiation to cured sealant.

Abstract: Cured sealant may be removed from a substrate if the cured sealant includes a susceptor within its volume. Removal proceeds by exposing the sealant with the susceptor to radio-frequency radiation sufficient to cause dielectric heating in the susceptor and the consequent heating in the cured sealant reduces the bond strength of the cured sealant. The reduced bond-strength sealant may be removed by physical methods, such as scraping etc., much more easily than the original (unexposed) cured sealant. Also disclosed are sealant compositions with susceptor, susceptor tools to introduce susceptor into cured sealant, and handheld radio-frequency heaters to apply radio-frequency radiation to cured sealant.