Abstract: The present invention relates to a method for etching at least one surface of a plastic substrate, the method comprising steps (A) to (C), wherein step (B) comprises a contacting with a pre-treatment composition comprising one or more than one fluorine-free surface-active compound, and step (C) comprises a contacting with an etching composition comprising one or more than one manganese species, wherein after step (B) and prior to step (C) no rinsing is applied, and the etching composition is substantially free of, preferably does not comprise, fluorine-containing surface-active compounds.

Abstract: The present invention relates to a method for etching at least one surface of a plastic substrate, the method comprising the steps (A) to (C), wherein step (C) is an etching step including a contacting with an etching composition. The etching composition comprises permanganate ions and phosphoric acid, each in specifically defined concentration ranges.

Abstract: The present invention relates to a method for etching at least one surface of a plastic substrate, the method comprising steps (A) to (C), wherein step (B) comprises a contacting with a pre-treatment composition comprising one or more than one fluorine-free surface active compound, and step (C) comprises a contacting with an etching composition comprising chromic acid, wherein after step (B) and prior to step (C) no rinsing is applied, and the etching composition is substantially free of fluorine-containing surface active compounds.

Abstract: The present invention relates to a method for metallizing a non-metallic substrate, the method comprising the steps (A) to (C), wherein step (A) is a pre-treatment step for etching and step (C) the metallization step. In step (A) a pre-treatment composition is utilized comprising individual manganese (II), (III), and (IV) species. The present invention furthermore relates to a specific pre-treatment composition.

Abstract: The present invention relates to a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.

Abstract: The present invention relates to a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.

Abstract: The present invention relates to a composition of an etching solution and a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.

Abstract: The present invention relates to a composition of an etching solution and a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.

Abstract: The present invention concerns an electroless nickel plating bath suitable for application in plating on plastic processes. The plating bath is free of hazardous substances such as lead ions and ammonia and allows deposition of nickel phosphorous alloys on plastic substrates at plating temperatures not higher than 55° C. Furthermore, the deposition of copper from an immersion type copper plating bath onto the nickel phosphorous coatings require no activation step which results in less process steps and less waste water production.

Abstract: The present invention concerns an electroless nickel plating bath suitable for application in plating on plastic processes. The plating bath is free of hazardous substances such as lead ions and ammonia and allows deposition of nickel phosphorous alloys on plastic substrates at plating temperatures not higher than 55° C. Furthermore, the deposition of copper from an immersion type copper plating bath onto the nickel phosphorous coatings require no activation step which results in less process steps and less waste water production.

Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.

Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.

Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) sulfur-containing compound represented by the formula Y—S—R1—SO3X??I wherein X is H or an alkali metal, R1 is an alkylene group containing from 1 to about 5 carbon atoms, Y is H, S—R1—SO3X, C(S)NR2?, C(S)OR?, C(NH2)NR2?, or a heterocyclic group, and each R? is independently H, or an alkyl group containing from 1 to about 5 carbon atoms. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.

Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) sulfur-containing compound represented by the formula Y—S—R1—SO3X??I wherein X is H or an alkali metal, R1 is an alkylene group containing from 1 to about 5 carbon atoms, Y is H, S—R1—SO3X, C(S)NR2?, C(S)OR?, C(NH2)NR2?, or a heterocyclic group, and each R? is independently H, or an alkyl group containing from 1 to about 5 carbon atoms. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.

Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) a sulfur-containing compound selected from sulfoalkylated polyethylene imines, sulfonated safranin dye, and mercapto aliphatic sulfonic acids or alkali metal salts thereof. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.

Abstract: The aqueous acidic solution for electrolytically depositing high polish, decorative bright, smooth and level copper coatings on large area metal or plastic parts contains a) at least one oxygen-containing, high molecular additive and b) at least one water soluble sulfur compound, wherein the solution additionally contains c) at least one aromatic halogen derivative having the general formula (I), wherein R1, R2, R3, R4, R5 and R6 are each independently radicals selected from the group comprising hydrogen, aldehyde, acetyl, hydroxyls, hydroxyalkyl having 1-4 carbon atoms, alkyl having 1-4 carbon atoms and halogen, with the proviso that the number of residues R1, R2, R3, R4, R5 and R6 which are halogen ranges from 1 to 5.