Abstract: A recycled deposition source is ruthenium (Ru) or Ru-based alloy material in the form of a powder material having a size not greater than a 325 mesh size and having an average tap density greater than about 5 gm/cm3. The power material may be non-porous and not agglomerated The recycled deposition source may have less than about 500 ppm of iron and less than about 500 ppm of oxygen. The recycled deposition source may be a recycled Ru or RuCr deposition source, where the recycled Ru or RuCr deposition source has a density comparable to a density of a Ru or RuCr deposition source fabricated from virgin Ru or RuCr powder material, and has a hardness greater than a hardness of a Ru or RuCr deposition source fabricated from virgin Ru or RuCr powder material. The recycled deposition source may be in the form of a sputtering target.

Abstract: A method of recycling ruthenium (Ru) and Ru-based alloys comprises steps of: providing a solid body of Ru or a Ru-based alloy; segmenting the body to form a particulate material; removing contaminants, including Fe, from the particulate material; reducing the sizes of the particulate material to form a powder material; removing contaminants, including Fe, from the powder material; reducing oxygen content of the powder material to below a predetermined level to form a purified powder material; and removing particles greater than a predetermined size from the purified powder material. The purified powder material may be utilized for forming deposition sources, e.g., sputtering targets.

Abstract: A method of recycling ruthenium (Ru) and Ru-based alloys comprises steps of: providing a solid body of Ru or a Ru-based alloy; segmenting the body to form a particulate material; removing contaminants, including Fe, from the particulate material; reducing the sizes of the particulate material to form a powder material; removing contaminants, including Fe, from the powder material; reducing oxygen content of the powder material to below a predetermined level to form a purified powder material; and removing particles greater than a predetermined size from the purified powder material. The purified powder material may be utilized for forming deposition sources, e.g., sputtering targets.

Abstract: A method of making a homogeneous granulated metal-based powder, comprises steps of: providing preselected amounts of at least one metal element or metal alloy, at least one ceramic compound, and/or at least one non-metallic element; forming a homogeneous slurry/suspension or wet mixture comprising the preselected amounts of metal element(s) and/or metal alloys, ceramic compound(s), and/or non-metallic element(s), a liquid phase comprising at least one liquid, and at least one binder material; drying the slurry/suspension or mixture to remove at least a portion of the liquid phase and form a powder mixture comprising partially or completely dried granules; and subjecting the granules to a thermal de-binder process for effecting: additional removal of any remaining liquid phase, if necessary; removal of the at least one binder material; reduction of carbon content; reduction of oxygen on the surfaces or interior of the metal or metal alloy phases in the granules; and optional partial sintering for strengthening

Abstract: A method of making a NiPt alloy having an ultra-high purity of at least about 4N5 and suitable for use as a sputtering target, comprises steps of: heating predetermined amounts of lesser purity Ni and Pt at an elevated temperature in a crucible to form a NiPt alloy melt, the crucible being composed of a material which is inert to the melt at the elevated temperature; and transferring the melt to a mold having a cavity with a surface coated with a release agent which does not contaminate the melt with impurity elements. The resultant NiPt alloy has a very low concentration of impurity elements and is subjected to cross-directional hot rolling for reducing thickness and grain size.

Abstract: A method of fabricating a sputtering target assembly comprises steps of mixing/blending selected amounts of powders of at least one noble or near-noble Group VIII metal at least one Group IVB, VB, or VIB refractory metal; forming the mixed/blended powder into a green compact having increased density; forming a full density compact from the green compact; cutting a target plate slice from the full density compact; diffusion bonding a backing plate to a surface of the target plate slice to form a target/backing plate assembly; and machining the target/backing plate assembly to a selected final dimension. The disclosed method is particularly useful for fabricating large diameter Ru—Ta alloy targets utilized in semiconductor metallization processing.

Abstract: A method of manufacturing sputtering targets from powder materials, comprising steps of: providing at least one raw powder material; forming the at least one raw powder material into a green body with density greater than about 40 % of theoretical maximum density; treating the green body with microwaves to form a sintered body with density greater than about 97% of theoretical maximum density; and forming a sputtering target from the sintered body. The methodology is especially useful in the fabrication of targets comprising dielectric and cermet materials.

Abstract: A method of making Re and Re-based materials comprises steps of: providing a Re powder starting material or a Re powder starting material and at least one additional powder material; subjecting at least the Re powder to a first degassing treatment for reducing the oxygen content thereof; increasing the density of the degassed Re powder or a mixture of the degassed Re powder and the at least one additional powder material to form a green billet; subjecting the billet to a second degassing treatment to further reduce the oxygen content; and consolidating the billet to form a consolidated material with greater than about 95% of theoretical density and low oxygen content below about 200 ppm for Re and below about 500 ppm for Re-based materials formed from the mixture, excluding oxygen from non-metallic compounds and ceramics. Materials so produced are useful in the manufacture of deposition sources such as sputtering targets.