Abstract: The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically 50-150 microns thick and the size of the pattern features may typically be in the range 1-10 microns across. Larger and smaller structures are possible. The patterning is done by means of optical exposure, either by exposure of a photosensitive resist or lacquer, or by other thermal or photochemical interaction between the light and the substrate. The substrate may typically be loaded as a roll and after exposure and other processing it may be rolled up on a second output roll, so called roll-to-roll (R-to-R) processing.

Abstract: The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically 50-150 microns thick and the size of the pattern features may typically be in the range 1-10 microns across. Larger and smaller structures are possible. The patterning is done by means of optical exposure, either by exposure of a photosensitive resist or lacquer, or by other thermal or photochemical interaction between the light and the substrate. The substrate may typically be loaded as a roll and after exposure and other processing it may be rolled up on a second output roll, so called roll-to-roll (R-to-R) processing.

Abstract: The present invention relates to a system and a method for microlithographic writing on photosensitive substrates, and specially printing of patterns with extremely high precision, such as photomasks for semiconductor device patterns, display panels, integrated optical devices and electronic interconnect structures. The system comprises a light source (1), preferably a laser, a computer-controlled light modulator (3) and a lens to contract the at least one light beam from the light source before it reaches the substrate. Further it comprises a device for controlling the position of incidence of the beam on the substrate, a detector for detecting the deviation from the intended position of incidence of the beam on the substrate, and correcting device for controlling the position controlling to device in accordance with the detected deviation diminish position errors at the substrate related to the deviations.