Abstract: An automatic apparatus for downsetting lead frame strips includes a die set mounted in a punch press, two parallel guide rails for guiding the lead frame strips into the die set, a placing mechanism for placing lead frame strips onto the guide rails one at a time, a slide mechanism for advancing a lead frame strip along the guide rails and into the die set and for unloading a downset lead frame strip from the die set, a retractable stop and a slot in the die set for positioning the lead frame strip within the die set, and a stacker mechanism for neatly stacking downset lead frame strips on an output stack as they are unloaded from the die set.

Abstract: A roller, for guiding strips of material, that can tilt in one plane with respect to a support shaft located inside the roller but is carefully prevented from moving out of the one plane by separate guides, also inside the roller, which separate guides are independent of the clearances needed in the bearing that allows tilting.

Abstract: An automatic self-adjusting processing apparatus for plating an object is described. The apparatus has a plating head, an apparatus coupled to the plating head which is responsive to the presence of the object for indicating the relative position of the plating head and the object, and an apparatus coupled to the indicating apparatus for automatically adjusting, if necessary, the relative position of the plating head and the object to a predetermined relative position.

Abstract: An automatic taping machine for automatically applying tapes to lead frames includes a lead frame feeding mechanism and a tape feeding mechanism with an automatic cutter and applying mechanism for automatically cutting and applying strips of tape to the lead frame. The cutting mechanism is adapted to eliminate the waste in tape and utilizes the entire roll of tape fed to it and includes feeders for feeding tape from both sides to a double cutter head which cuts strips of tape across the entire width of the tapes and includes a vacuum holder for holding the tape to a face of the cutter head for then applying the tape to the lead frames. The frames are advanced through the mechanism and the tapes applied and then fed through a heating press for heating the tape and securing it in place on the lead frames.

Abstract: The leads on a Semiconductor Package of the type having a generally round configuration and generally termed a header, are crimped into a conducting relationship for plating by means of an apparatus comprising a track type of conveyer for conveying the headers along a specific path, and a pair of rollers disposed on opposite sides of the track for engaging the leads as the header passes therebetween for crimping the leads together in a conducting relationship. The rollers comprise wheels mounted for rotation in opposite directions at different speeds, such that the header is rotated between the wheels but simultaneously moved in a linear direction along the conveyer.

Abstract: A method and apparatus for selectively plating the die-attach area of a semiconductor chip header are described. The apparatus comprises a rotary disc assembly. In the assembly there is provided a plurality of cavities for removably receiving individual headers. In each cavity there is provided an annular masking member for masking a header situated therein. Associated with each cavity, there is provided a cam-operated clamping means for clamping a header against the masking member and for coupling a source of potential to the header. Also associated with each cavity is a fluid jet for jetting a plating fluid against the header through a hole in the center of the sealing member. Plating fluid is selectively pumped, by means of a pumping means, to each of the jets along a plurality of fluid passageways from a fluid manifold. The fluid manifold is adapted to couple a predetermined number of the fluid passageways and jets to the pumping means as the disc assembly is rotated.

Abstract: A method and apparatus for plating the posts of a semiconductor chip header is described. A means is provided for orientating the headers and feeding them in single file to a predetermined position in the apparatus. A transporting means is provided for transporting the headers from the feeding means over a plating bath such that the posts of the header are immersed in the bath. Attached to the transporting means is a plurality of clamping assemblies. Each of the clamping assemblies includes a knife-like member for electrically insulating the thru-leads of the header from its envelope lead and means for clamping the thru-leads of the header to the knife-like member. The clamping means of the clamping assemblies also include means for coupling a source of potential between the plating bath and the thru-leads clamped therein.

Abstract: A method and apparatus for selectively plating the die-attach area of a semiconductor chip header are described. The apparatus comprises a rotary disc assembly. In the assembly there is provided a plurality of cavities for removably receiving individual headers. In each cavity there is provided an annular masking member for masking a header situated therein. Associated with each cavity, there is provided a cam-operated clamping means for clamping a header against the masking member and for coupling a source of potential to the header. Also associated with each cavity is a fluid jet for jetting a plating fluid against the header through a hole in the center of the sealing member. Plating fluid is selectively pumped, by means of a pumping means, to each of the jets along a plurality of fluid passageways from a fluid manifold. The fluid manifold is adapted to couple a predetermined number of the fluid passageways and jets to the pumping means as the disc assembly is rotated.