Patents by Inventor Carl Mengel

Carl Mengel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8622450
    Abstract: An apparatus for efficiently lifting heavy trusses used in constructing buildings requiring a pitched roof. The use of this apparatus reduces the manpower requirement for constructing roofs by providing a J-shape cam-hook-lift-apparatus to latch onto a truss and use the power of a lifting mechanism, such as a crane, to raise and place the roof trusses into a predetermined position. Using this apparatus will reduce the amount of time needed to complete a roof assembly and increase safety for workers.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: January 7, 2014
    Inventor: Carl Mengel
  • Patent number: 7301231
    Abstract: Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: November 27, 2007
    Assignee: Agere Systems, Inc.
    Inventors: Joze E. Antol, Philip William Seitzer, Daniel Patrick Chesire, Rafe Carl Mengel, Vance Dolvan Archer, Thomas B. Gans, Taeho Kook, Sailesh M. Merchant
  • Patent number: 7115985
    Abstract: Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: October 3, 2006
    Assignee: Agere Systems, Inc.
    Inventors: Joze E. Antol, Philip William Seitzer, Daniel Patrick Chesire, Rafe Carl Mengel, Vance Dolvan Archer, Thomas B. Gans, Taeho Kook, Sailesh M. Merchant