Abstract: A solder bump stretch device is disclosed for use in mounting an electronic component to a substrate by a plurality of solder bump interconnections that are produced by reflowing preformed solder bumps carried on the component. the device is fastened to the component, which is in turn assembled with the substrate so that the bumps rest upon the substrate in preparation for solder reflow operations. The device comprises a flexible web that overlies the component outer face and is connected to legs that depend about the component. Prior to solder reflow, the web is held by an expendable spacer in a biased position wherein the legs are raised apart from the substrate. During heating to melt the solder bumps, the spacer is expended, releasing the web, whereupon the legs engage the substrte to lift the component relative to the substrate and thereby stretch the molten solder to form elongated interconnections preferably having hourglass configurations.