Patents by Inventor Carl W. Pobanz

Carl W. Pobanz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7567153
    Abstract: A bandpass filter includes a plurality of resonators. An input pin is connected to a first resonator of the plurality of resonators. An output pin is connected to a second resonator of the plurality of resonators. The first and second resonators are magnetically coupled to each other. The first and second resonators are coupled to other resonators using mixed coupling. The other resonators are coupled to each other using electric coupling.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: July 28, 2009
    Assignee: Broadcom Corporation
    Inventors: Sung-Hsien Chang, Ramon A. Gomez, Lawrenece M. Burns, Carl W. Pobanz
  • Patent number: 7408393
    Abstract: A master-slave flip-flop comprises master and slave latches, with the data output of the master latch connected to the data input of the slave latch. The latches receive clock signals CKM and CKS at their respective clock inputs; each latch is transparent when its clock signal is in a first state and latches a signal applied to its input when its clock signal is in a second state. A clock buffer receives an input clock CKin and generates nominally complementary clock signals CKM and CKS such that one latch is latched while the other is transparent. The clock buffer is arranged to skew CKS with respect to CKM such that the slave latch is made transparent earlier than it would without the skew, making the minimum delay (tpd) between the toggling of CKin and a resulting change at the slave latch's output less than it would otherwise be.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: August 5, 2008
    Assignee: Inphi Corporation
    Inventors: Dhruv Jain, Gopal Raghavan, Jeffrey C. Yen, Carl W. Pobanz
  • Patent number: 7375604
    Abstract: A bandpass filter includes a plurality of resonators on a printed circuit board. An input pin is connected to a first resonator of the plurality of resonators. An output pin is connected to a second resonator of the plurality of resonators. The first and second resonators are magnetically coupled to each other. The first and second resonators are coupled to other resonators using mixed coupling. The other resonators are coupled to each other using electric coupling.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: May 20, 2008
    Assignee: Broadcom Corporation
    Inventors: Sung-Hsien Chang, Ramon A Gomez, Lawrence M Burns, Carl W Pobanz
  • Patent number: 7351660
    Abstract: A method for fabricating high performance vertical and horizontal electrical connections in a three dimensional semiconductor structure. A dielectric film is imprinted with a stamp pattern at high vacuum and with precise temperature and stamping pressure control. The stamp pattern may be formed on a substrate using semiconductor fabrication techniques. After the dielectric film is stamped, residual dielectric film is removed to allow access to an underlying layer. Via and trench regions formed within the dielectric film by stamping are then metalized to provide the high performance interconnections. Multiple layers of interconnections in the three dimensional structure are provided by stacking layers of stamped and metalized dielectric films on top of each other.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: April 1, 2008
    Assignee: HRL Laboratories, LLC
    Inventors: Peter D. Brewer, Carl W. Pobanz
  • Patent number: 7253091
    Abstract: A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or more layers containing the components are placed on a host substrate containing host circuits. Electrical interconnects are provided between and among the electronic components in the dielectric layers and the host circuits. The layers containing the components may also be provided by growing the electronic devices on a growth substrate. The growth substrate is then removed after the layer is attached to the host substrate.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: August 7, 2007
    Assignee: HRL Laboratories, LLC
    Inventors: Peter D. Brewer, Michael G. Case, Andrew T. Hunter, Mehran Matloubian, John A. Roth, Carl W. Pobanz
  • Patent number: 7215218
    Abstract: The invention is a balun transformer that converts a single-ended (or unbalanced) signal to a differential (or balanced) signal. The balun is a printed metal pattern on a circuit board in conjunction with several low cost chip capacitors and a low cost chip inductor. The balun transformer is a modified Marchand balun that is implemented using printed transmission lines. The balun has a plurality of coupled transmission lines to improve tolerances to variations in PC board fabrication. To make the balun compact, it is electrically lengthened through the use of capacitive loading, which reduces the required physical size. Additionally, the capacitors increase the bandwidth due to the resonant interaction between the short inductive balun and the capacitors that are placed in series with the input and the output.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: May 8, 2007
    Assignee: Broadcom Corporation
    Inventors: Lawrence M. Burns, Carl W. Pobanz
  • Patent number: 7084720
    Abstract: A printed bandpass filter is mounted on a precision substrate to eliminate the need for post-fabrication tuning. The filter input is capacitively coupled to a series of quarter wavelength resonators and the filter output. The quarter wavelength resonators are printed as spirals to reduce filter size. The resonators define the bandpass characteristics of the filter. The filter also weakly couples the input signal to the filter output in a manner to cancel the signal image. Mechanical clips mitigate thermal stress on solder connections when the precision substrate is mounted on a second printed circuit board.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: August 1, 2006
    Assignee: Broadcom Corporation
    Inventors: Ramon A. Gomez, Lawrence M. Burns, Sung-Hsien Chang, Carl W. Pobanz
  • Patent number: 7071798
    Abstract: A printed bandpass filter is mounted on a precision substrate to eliminate the need for post-fabrication tuning. The filter input is capacitively coupled to a series of quarter wavelength resonators and the filter output. The quarter wavelength resonators are printed as spirals to reduce filter size. The resonators define the bandpass characteristics of the filter. The filter also weakly couples the input signal to the filter output in a manner to cancel the signal image. Mechanical clips mitigate thermal stress on solder connections when the precision substrate is mounted on a second printed circuit board.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: July 4, 2006
    Assignee: Broadcom Corporation
    Inventors: Ramon A. Gomez, Lawrence M. Burns, Sung-Hsien Chang, Carl W. Pobanz
  • Patent number: 7010008
    Abstract: A fast, high-swing driver circuit for driving an electro-optical modulator includes an output stage comprising first and second transistors arranged as a differential pair. The collector of the first transistor is coupled to ground, and its base provides the stage's input. The collector of the second transistor is coupled via an impedance to a supply voltage, and provides the stage's output. A reference voltage is provided to the second transistor's base, which is also AC-coupled to ground. A bias generator provides the second transistor's base voltage, and a second differential pair converts a differential input signal to a single-ended output that drives the output stage's input—preferably via a pair of cascaded emitter-follower stages that serve to present a low impedance. A complete electro-optical modulator driver is formed with the addition of a bias-T network at the output stage's output.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: March 7, 2006
    Assignee: Inphi Corporation
    Inventor: Carl W. Pobanz
  • Patent number: 6980021
    Abstract: An output buffer for driving a capacitively-terminated transmission line produces a waveform which comprises a first portion during which the waveform transitions from a voltage V1 to a voltage V2; a second portion during which it remains fixed at V2; a third portion during which it transitions to a voltage V3; and a fourth portion during which it remains fixed at V3. The waveform is created within a unit interval whenever successive data bits transition between logic states. The first and second portions are generated with circuitry arranged such that V2 is maximized by reducing the buffer's output impedance. The fourth portion is generated with circuitry which has a non-zero output impedance preferably equal to the transmission line's characteristic impedance, to absorb transitions reflected back to the source circuitry by the capacitive termination.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: December 27, 2005
    Assignee: Inphi Corporation
    Inventors: Nikhil K. Srivastava, Gopal Raghavan, Carl W. Pobanz
  • Patent number: 6828556
    Abstract: A focal plane array for millimeter wave imaging comprising a three dimensional stack of antenna elements and radiometer microwave monolithic integrated circuits (MMICs) embedded in polymer dielectric layers built on top of a silicon substrate. Each radiometer MMIC and antenna element comprise a radiometer pixel. The silicon substrate contains integrated circuits to collect and process the signals from each radiometer pixel and generate a full-frame video signal. The array can be fabricated on a single silicon wafer or can be constructed from structures fabricated on multiple silicon wafers.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: December 7, 2004
    Assignee: HRL Laboratories, LLC
    Inventors: Carl W. Pobanz, Mehran Matloubian, Peter D. Brewer
  • Patent number: 6819199
    Abstract: The invention is a balun transformer that converts a single-ended (or unbalanced) signal to a differential (or balanced) signal. The balun is a printed metal pattern on a circuit board in conjunction with several low cost chip capacitors and a low cost chip inductor. The balun transformer is a modified Marchand balun that is implemented using printed transmission lines. The balun has a plurality of coupled transmission lines to improve tolerances to variations in PC board fabrication. To make the balun compact, it is electrically lengthened through the use of capacitive loading, which reduces the required physical size. Additionally, the capacitors increase the bandwidth due to the resonant interaction between the short inductive balun and the capacitors that are placed in series with the input and the output.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: November 16, 2004
    Assignee: Broadcom Corporation
    Inventors: Lawrence M. Burns, Carl W. Pobanz
  • Patent number: 6621331
    Abstract: An effective means and apparatus for generating a negative resistance including a circuit element that exhibits an increase in current as the applied voltage is decreased. Other embodiments of the present invention provide electronic means for improving the quality Q factor of on-chip resonators, which enables the creation of high-performance bipolar RF circuits with a minimum of external components.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: September 16, 2003
    Assignee: HRL Laboratories, LLC
    Inventors: Carl W. Pobanz, Gopal Raghavan
  • Publication number: 20030140317
    Abstract: A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or more layers containing the components are placed on a host substrate containing host circuits. Electrical interconnects are provided between and among the electronic components in the dielectric layers and the host circuits. The layers containing the components may also be provided by growing the electronic devices on a growth substrate. The growth substrate is then removed after the layer is attached to the host substrate.
    Type: Application
    Filed: September 26, 2002
    Publication date: July 24, 2003
    Inventors: Peter D. Brewer, Michael G. Case, Andrew T. Hunter, Mehran Matloubian, John A. Roth, Carl W. Pobanz
  • Publication number: 20030128084
    Abstract: A bandpass filter includes a plurality of resonators on a printed circuit board. An input pin is connected to a first resonator of the plurality of resonators. An output pin is connected to a second resonator of the plurality of resonators. The first and second resonators are magnetically coupled to each other. The first and second resonators are coupled to other resonators using mixed coupling. The other resonators are coupled to each other using electric coupling.
    Type: Application
    Filed: November 18, 2002
    Publication date: July 10, 2003
    Applicant: Broadcom Corporation
    Inventors: Sung-Hsien Chang, Ramon A. Gomez, Lawrence M. Burns, Carl W. Pobanz
  • Publication number: 20030128085
    Abstract: A printed bandpass filter is mounted on a precision substrate to eliminate the need for post-fabrication tuning. The filter input is capacitively coupled to a series of quarter wavelength resonators and the filter output. The quarter wavelength resonators are printed as spirals to reduce filter size. The resonators define the bandpass characteristics of the filter. The filter also weakly couples the input signal to the filter output in a manner to cancel the signal image. Mechanical clips mitigate thermal stress on solder connections when the precision substrate mounted on a second printed circuit board.
    Type: Application
    Filed: January 9, 2002
    Publication date: July 10, 2003
    Applicant: Broadcom Corporation
    Inventors: Ramon A. Gomez, Lawrence M. Burns, Sung-Hsien Chang, Carl W. Pobanz
  • Publication number: 20030122079
    Abstract: A focal plane array for millimeter wave imaging comprising a three dimensional stack of antenna elements and radiometer microwave monolithic integrated circuits (MMICs) embedded in polymer dielectric layers built on top of a silicon substrate. Each radiometer MMIC and antenna element comprise a radiometer pixel. The silicon substrate contains integrated circuits to collect and process the signals from each radiometer pixel and generate a full-frame video signal. The array can be fabricated on a single silicon wafer or can be constructed from structures fabricated on multiple silicon wafers.
    Type: Application
    Filed: September 26, 2002
    Publication date: July 3, 2003
    Inventors: Carl W. Pobanz, Mehran Matloubian, Peter D. Brewer
  • Publication number: 20030112576
    Abstract: A method for fabricating high performance vertical and horizontal electrical connections in a three dimensional semiconductor structure. A dielectric film is imprinted with a stamp pattern at high vacuum and with precise temperature and stamping pressure control. The stamp pattern may be formed on a substrate using semiconductor fabrication techniques. After the dielectric film is stamped, residual dielectric film is removed to allow access to an underlying layer. Via and trench regions formed within the dielectric film by stamping are then metalized to provide the high performance interconnections. Multiple layers of interconnections in the three dimensional structure are provided by stacking layers of stamped and metalized dielectric films on top of each other.
    Type: Application
    Filed: September 26, 2002
    Publication date: June 19, 2003
    Inventors: Peter D. Brewer, Carl W. Pobanz
  • Patent number: 6548840
    Abstract: A method and apparatus for substantially canceling the effects of temperature on the electrical performance of Field Effect Transistor (FET) integrated circuits (IC's) by exploiting a subtle feature of an epitaxial resistor implemented in an FET process. Specifically, the invention takes advantage of two constituent epitaxial resistor components having resistances that vary monotonically in opposite directions as functions of temperature. The invention includes a method for selecting the geometry of such an epitaxial resistor to give it either temperature invariance or a specific, useful functional temperature dependence.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: April 15, 2003
    Assignee: HRL Laboratories, LLC
    Inventors: Carl W. Pobanz, Mehran M. Matloubian
  • Publication number: 20030030485
    Abstract: An effective means and apparatus for generating a negative resistance including a circuit element that exhibits an increase in current as the applied voltage is decreased. Other embodiments of the present invention provide electronic means for improving the quality Q factor of on-chip resonators, which enables the creation of high-performance bipolar RF circuits with a minimum of external components.
    Type: Application
    Filed: August 7, 2001
    Publication date: February 13, 2003
    Inventors: Carl W. Pobanz, Gopal Raghavan