Abstract: A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.

Abstract: A chemical mechanical polishing pad window having a controlled texture surface comprising repeated patterned features. The window results in an improved endpoint detection and in situ rate monitoring by providing consistent values of the ISRMmax-min characteristic over the lifetime of a CMP pad. Also provided is a chemical mechanical polishing pad with the inventive window.

Abstract: A chemical mechanical polishing (CMP) pad with a release liner that has a pull tab is prepared by contacting the CMP pad to an adhesive layer with release liner. The adhesive layer sheet is cut along a first portion of a perimeter of the CMP pad. An extension of the adhesive layer is cut that extends beyond an edge of the CMP pad at the remaining portion of the perimeter of the CMP pad, thereby creating an extension of the adhesive layer sheet with the adhesive layer exposed. The exposed adhesive layer is cut to a depth not to extend into the release liner. The adhesive layer is removed from the exposed region leaving only the release liner pull tab as a continuous extension of the release liner material.

Abstract: A chemical mechanical polishing pad window having a controlled texture surface comprising repeated patterned features. The window results in an improved endpoint detection and in situ rate monitoring by providing consistent values of the ISRMmax-min characteristic over the lifetime of a CMP pad. Also provided is a chemical mechanical polishing pad with the inventive window.

Abstract: A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.

Abstract: The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.

Abstract: The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.

Abstract: An optical waveguide suitable for a slanted Bragg grating (SBG) to be written thereinto has a refractive index profile defining a core and a cladding and a specific photosensitivity profile. This photosensitivity profile W(r) is such that, for a given SBG writing angle ?, the coupling of the fundamental mode into itself as counterpropagation in the waveguide, K(?), is substantially zero and such that its derivative K?(?) with respect to the angle ? is also substantially equal to zero. The zero derivative, and also the zero coupling of the fundamental mode as a function of the angle, means that a widened reflection pocket about the grating write angle is guaranteed.