Abstract: A system for monitoring of the resin front during resin infusion into a fiber preform for the manufacturing of composites. Such monitoring is based on Optical Frequency Domain Reflectometry by emitting light pulses through optic fibers which forms a resin infusion mesh in a fiber preform.

Abstract: A system for monitoring of the resin front during resin infusion into a fiber preform for the manufacturing of composites. Such monitoring is based on Optical Frequency Domain Reflectometry by emitting light pulses through optic fibers which forms a resin infusion mesh in a fiber preform.

Abstract: An ultrasound inspection roller provided with a wheel, a sensing system and a support for holding the sensing system inside the wheel, a wedge connected to the ultrasound sensing system at one end and provided with a curved profile at its other end facing the wheel, adapted to the curvilinear shape of the wheel, and a liquid of a density higher than 9.9*102 kg/mm3 placed inside the wheel such that the sensory system, the wheel and the wedge are acoustically coupled. The roller allows the early detection of problems during manufacturing of composites and the performance of corrective measures in real time, and assures a good coupling between the transducers and the material to be inspected in dry conditions.

Abstract: An ultrasound inspection roller provided with a wheel, a sensing system and a support for holding the sensing system inside the wheel, a wedge connected to the ultrasound sensing system at one end and provided with a curved profile at its other end facing the wheel, adapted to the curvilinear shape of the wheel, and a liquid of a density higher than 9.9*102 kg/mm3 placed inside the wheel such that the sensory system, the wheel and the wedge are acoustically coupled. The roller allows the early detection of problems during manufacturing of composites and the performance of corrective measures in real time, and assures a good coupling between the transducers and the material to be inspected in dry conditions.

Abstract: A method for making an integrated circuit includes forming an aluminum layer adjacent a semiconductor wafer, and forming a photoresist layer adjacent the aluminum layer, with at least a portion of the aluminum layer being uncovered. The method also includes exposing the photoresist layer to a pattern image, developing the exposed photoresist layer using a developer and stripping away undeveloped photoresist portions to define a mask including mask features having reduced widths than would otherwise occur adjacent the aluminum layer. The reduced widths are based upon an interaction between the photoresist, the developer and the aluminum. The method may include etching the aluminum layer using the mask to thereby define circuit features having a smaller critical dimension than would otherwise be produced.