Abstract: Controlled shape bumps are fabricated into the metal contact fingers that are to be used in the gang bonding assembly of semiconductor devices. The bump shape permits the gang bonding of a plurality of contact fingers simultaneously while producing reliable, uniformly high strength bonds.

Abstract: A non-impact form of thermocompression gang bonding of metal lead fingers to integrated circuit chip pads is disclosed. The method produces a plurality of simultaneously bonded chips using conventional heating means and totally avoids mechanical and thermal shock. The result is highly reliable bonding that results in exceptionally high bond strength.

Abstract: The leads on a VLSI semiconductor package are bent and secured to the package so as to improve their stability. The thin fragile leads are thereby substantially immobilized so that they will not be deformed during post packaging handling and testing.

Abstract: A tape assembly process attaches semiconductor chips to a tape via thermocompression gang bonding and the tape is wound onto a reel. The tape is fabricated during its manufacture to have a plurality of spaced finger array patterns. The inner finger ends are located so as to mate with the bonding pads of a semiconductor device and are bonded thereto. A ring-shaped strip is included in each finger pattern that joins all of the fingers in each pattern into a unitary structure in which the fingers are accurately spaced. Where the ring joins onto the fingers, weakened regions are introduced and the side of the tape that contains the semiconductor device includes a recess that is in registry with the ring. A ceramic substrate that will ultimately mount the semiconductor device is provided with an array of conductor patterns that match the tape finger patterns. A layer of sealing glass is screened over the ceramic, so as to align with the ring.

Abstract: In an automatic tape assembly process an IC chip is bonded to the finger pattern created in a metal assembly tape. Then the housing is applied to encapsulate the IC during assembly. An insulating strip is then applied to the metal fingers that will ultimately become the packaged device loads. The strip is located just inside that point where the fingers will be excised from the tape so that after excision the strip will hold the leads in position for testing and handling.

Abstract: In an automatic assembly tape for semiconductor device assembly a continuous tape includes a plurality of sequential metal finger patterns. Each pattern includes a plurality of fingers that extend inwardly to form an array that mates with the bonding pads on a semiconductor device chip. The fingers are bonded to the chip pads so that the chip is then associated with the tape and therefore amenable to further assembly on high speed machines on a reel-to-reel tape handling basis. Each finger pattern includes an inner tear strip ring that initially holds the fingers together in a unitary structure. The fingers are joined to the ring via intermediate weakened regions. After the fingers are bonded to the chip pads, the ring is torn away so as to separate at the weakened regions. Prior to bonding, the fingers are held in precise location and in a common plane. This allows close spaced complex finger patterns and avoids bent fingers which can cause bond failure and possibly clogging of the auto assembly machines.

Abstract: A tape assembly process attaches semiconductor chips to a tape via thermocompression gang bonding and the tape is wound onto a reel. The tape is fabricated during its manufacture to have a plurality of spaced finger array patterns. The inner finger ends are located so as to mate with the bonding pads of a semiconductor device and are bonded thereto. A ring-shaped strip is included in each finger pattern that joins all of the fingers in each pattern into a unitary structure in which the fingers are accurately spaced. Where the ring joins onto the fingers, weakened regions are introduced and the side of the tape that contains the semiconductor device includes a recess that is in registry with the ring. A ceramic substrate that will ultimately mount the semiconductor device is provided with an array of conductor patterns that match the tape finger patterns. A layer of sealing glass is screened over the ceramic, so as to align with the ring.

Abstract: A continuous tape is employed in the automatic assembly of semiconductor devices. The tape contains a sequential series of patterns, each one comprising a plurality of metal fingers. Each pattern includes fingers having an inward extension that terminates in a configuration that mates with the contact pattern of the semiconductor device. Desirably these fingers are thermocompression gang bonded to the semiconductor contact pads. This attaches the semiconductor device to the tape for further processing. In one assembly method the fingers have an outward extending portion that is designed for bonding to a secondary structure such as a lead frame destined to become part of the final housing. The fingers in the pattern are joined together by means of a ring located at or near the point at which they are bonded to the lead frame. After the lead frame bonds are achieved, preferably by thermocompression gang bonding, the ring is severed at locations between the fingers.

Abstract: A semiconductor device is bonded to a contact finger pattern which is located in a continuous tape. A metal package cup is fabricated from metal stock so as to have a flat rim portion around its periphery. A plastic insulating sheet is punched so that it forms an overlapping cover for the flat rim and is attached thereto. The tape mounted semiconductor device is then bonded to the inside of the cup and the metal fingers bonded to the insulating sheet covering the flat rim. Provision is made for one of the fingers to connect to the cup. Then the device is encapsulated using one of two techniques. In the first a cap that mates with the cup is provided with a bonded insulating film cover and is bonded to the cup with its overlying metal fingers, so that a metal housing results. An encapsulating material is then injected inside the housing by way of a hole in the cap. Alternatively the semiconductor device can be covered by a suitable casting material.

Abstract: In an automatic assembly tape for semiconductor device assembly a continuous tape includes a plurality of sequential metal finger patterns. Each pattern includes a plurality of fingers that extend inwardly to form an array that mates with the bonding pads on a semiconductor device chip. The fingers are bonded to the chip pads so that the chip is then associated with the tape and therefore emenable to further assembly on high speed machines on a reel-to-reel tape handling basis. Each finger pattern includes an inner tear strip ring that initially holds the fingers together in a unitary structure. The fingers are joined to the ring via intermediate weakened regions. After the fingers are bonded to the chip pads, the ring is torn away so as to separate at the weakened regions. Prior to bonding, the fingers are held in precise location and in a common plane. This allows close spaced complex finger patterns and avoids bent fingers which can cause bond failure and possibly clogging of the auto assembly machines.

Abstract: A composite tape made of highly different components is laminated in a process that maintains registry between the components. Strips of metal and insulating material are aligned in registry and first tack bonded at intervals. Then the strips are area bonded to create the composite.

Abstract: A composite tape product, employed in the gang bonding of semiconductor devices, is manufactured on an insulating strip that has a series of apertures therein. A plurality of metal fingers are bonded to the strip so that groups of fingers extend over the apertures. The finger ends terminate in a configuration where each finger mates with an integrated circuit bonding pad. A thermocompression bonding tool can then gang bond the fingers to the bonding pads. The tape mounted fingers then include the bonded chip and the tape can then carry the chip to the chip mounting and finger bonding operation. The composite tape is manufactured using mating prepunched or pre-etched insulating and metal strips. The metal strip is first partly etched to define the finger pattern. Then the metal and insulating strips are bonded together so that the partly defined finger patterns register with the prepunched insulating tap apertures.

Abstract: Copper parts associated with thermal compression bonding of lead structures to a semiconductive device, such as the lead frame, the interconnect lead, and the gang bonding bumps, are coated with an antioxidant material. The antioxidant material and its thickness are chosen to be compatible with thermal compression bonding therethrough so that the completed thermal compression bond forms a bonding interface to the copper through the antioxidant coating. Suitable antioxidant coating materials include, gold, chromate, and copper phosphate.

Abstract: An apparatus for and method of shaping interconnect leads which have been cut from an interconnect lead tape and have a semiconductor chip attached thereto. With a semiconductor chip attached to the interconnect leads of one section of an interconnect lead tape, and either during or after cutting of such leads from the remaining portion of the tape by means of a punch and matrix, a pressure differential is developed across the leads and chip to shape the leads to a desired and repeatable uniform configuration. While this pressure differential is applied, the free ends of the leads are held in one plane, such that the semiconductor chip is translated to a position which is spaced from the plane in which the free ends of the leads are held, thus bending the leads to conform to this change in position. This shaping can occur either before, during, or after the free ends of such interconnect leads are bonded to a lead frame.

Abstract: A gang bonding interconnect tape for use in an automatic bonding machine for gang bonding of semiconductive devices is fabricated by depositing a series of electrically insulative support structures, such as rings of epoxy resin, onto a metallic tape, as of copper, there being at least one of said electrically insulative support structures for individual ones of the interconnect lead patterns to be formed in said metallic tape. The side of the metallic tape, opposite to the support structure, is photoetched with a series of interconnect lead patterns with individual ones of said lead patterns being etched in registration with individual ones of said electrically insulative support structures. The individual electrically insulative support structure, preferably in the form of a ring, is located in each of the lead patterns intermediate the central region thereof and the outer region thereof for supporting the individual leads thereof in circumferentially spaced relation.

Abstract: Gang bonding structures for connecting a semiconductive device to associated circuitry includes both copper and gold portions which are heated and pressed into thermal compression bonding relation. The resultant bond comprises a solid state interdiffusion of the copper and gold portions to obtain, upon cooling thereof, a bonding interface between the copper and gold portions comprising a solid state interdiffusion of the copper and the gold. In a preferred embodiment such copper-to-gold thermal compression bonds are obtained between copper portions of gang bonding bumps on the semiconductive device and the inner ends of a copper interconnect lead structure as well as between the outer ends of the copper lead structure and gold plated inner ends of the lead frame structure of a base metal as of copper, nickel, or kovar.

Abstract: A gang bonding interconnect tape for use in an automatic bonding machine for gang bonding of semiconductive devices is fabricated by depositing a series of electrically insulative support structures, such as rings of epoxy resin, onto a metallic tape, as of copper, there being at least one of said electrically insulative support structures for individual ones of the interconnect lead patterns to be formed in said metallic tape. The side of the metallic tape, opposite to the support structure, is photoetched with a series of interconnect lead patterns with individual ones of said lead patterns being etched in registration with individual ones of said electrically insulative support structures. The individual electrically insulative support structure, preferably in the form of a ring, is located in each of the lead patterns intermediate the central region thereof and the outer region thereof for supporting the individual leads thereof in circumferentially spaced relation.