Abstract: The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

Abstract: The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

Abstract: The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

Abstract: The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

Abstract: Compositions including at least one curable fluoropolymer are disclosed which include at least one functional group for crosslinking the fluoropolymer, a curative capable of crosslinking the at least one fluoropolymer selected from the group consisting of functionalized biphenyl-based compounds, various monoamidine and monoamidoxime compounds as well as bisamidine compounds and combinations thereof; and at least one cure accelerator which may be an organic peroxide or an organic peroxide in combination with a colorant. Adhesive fluoroelastomeric compositions comprising colorants are also provided. The compositions described provide beneficial physical properties, increased plasma resistance, unique adhesive properties and/or reduced contamination associated with use of external adhesives. Methods for forming articles which incorporate fluoroelastomers bonded to metallic surfaces are also provided.

Abstract: The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

Abstract: Compositions including at least one curable fluoropolymer are disclosed which include at least one functional group for crosslinking the fluoropolymer, a curative capable of crosslinking the at least one fluoropolymer selected from the group consisting of functionalized biphenyl-based compounds, various monoamidine and monoamidoxime compounds as well as bisamidine compounds and combinations thereof; and at least one cure accelerator which may be an organic peroxide or an organic peroxide in combination with a colorant. Adhesive fluoroelastomeric compositions comprising colorants are also provided. The compositions described provide beneficial physical properties, increased plasma resistance, unique adhesive properties and/or reduced contamination associated with use of external adhesives. Methods for forming articles which incorporate fluoroelastomers bonded to metallic surfaces are also provided.

Abstract: A self contained sensing apparatus includes a housing establishing an interior compartment, the housing having a maximum thickness which is less than the size of a gate opening of a semiconductor wafer processing chamber for inserting the housing into the semiconductor wafer processing chamber for sensing a parameter. The housing includes a window extending through a principal housing surface. A sensor is provided within the housing and generally aligned with the window for sensing at least one parameter. A transmitter is provided within the housing and coupled with the sensor for receiving signals representative of the sensed parameter and transmitting the signals out of the housing.

Abstract: A self contained sensing apparatus includes a housing establishing an interior compartment, the housing having a maximum thickness which is less than the size of an access portal for inserting the housing into an area for sensing. The housing includes a window extending through a principal housing surface. A sensor is provided within the housing and generally aligned with the window for sensing at least one parameter. In a preferred embodiment, the sensor is an optical sensor for sensing images through the window. A transmitter is provided within the housing and coupled with the sensor for receiving signals representative of the sensed parameter and transmitting the signals out of the housing.

Abstract: A self contained sensing apparatus includes a housing establishing an interior compartment, the housing having a maximum thickness which is less than the size of a gate opening of a semiconductor wafer processing chamber for inserting the housing into the semiconductor wafer processing chamber for sensing a parameter. The housing includes a window extending through a principal housing surface. A sensor is provided within the housing and generally aligned with the window for sensing at least one parameter. A transmitter is provided within the housing and coupled with the sensor for receiving signals representative of the sensed parameter and transmitting the signals out of the housing.

Abstract: A self contained sensing apparatus includes a housing establishing an interior compartment, the housing having a maximum thickness which is less than the size of an access portal for inserting the housing into an area for sensing. The housing includes a window extending through a principal housing surface. A sensor is provided within the housing and generally aligned with the window for sensing at least one parameter. In a preferred embodiment, the sensor is an optical sensor for sensing images through the window. A transmitter is provided within the housing and coupled with the sensor for receiving signals representative of the sensed parameter and transmitting the signals out of the housing.