Abstract: A semiconductor module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups of thin wire cooling fins mounted on a heat dissipating conductor unit also providing the necessary mechanical rigidity of the module.The interconnection comprises a layer containing grains, preferably diamond, leaving high electrically insulating and high thermally conductive properties.

Abstract: A heat exchanging member, more particularly for cooling a semiconductor module, having at a first and a second side, respectively, inlets and outlets, respectively, for a preferably gaseous heat exchanging medium, and having a heat exchanging component made of a highly thermal conductive material, such as metal, in which channels disposed side by side and running from its inlet side to its outlet side have been formed, such that medium flowing in through the inlet channels is constrained to flow at an angle to the direction of entry via the heat exchanging material to the adjacent outlet channels, characterized in that the heat exchanging material has a structure which comprises packed parts including:a) randomly packed elementary parts, such as grains, fibers or scales, orb) parts packed in an ordered fashion, such as gauze or plates, with the exception of individual wires.In a preferred embodiment the heat exchanging material is made up of sintering bronze.