Patents by Inventor Caroline Lima Salles de SOUZA

Caroline Lima Salles de SOUZA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Engineered nanostructured passivated contacts and method of making the same
    Patent number: 11961925
    Abstract: The present disclosure relates to a passivating contact that includes a dielectric layer constructed of a first material, an intervening layer constructed of a second material, and a substrate constructed of a semiconductor, where the dielectric layer is positioned between the substrate and the intervening layer, the dielectric layer has a first thickness, and the substrate has a second thickness. The passivating contact also includes a plurality of conductive pathways that include the second material and pass through the first thickness, the second material penetrates into the second thickness forming a plurality of penetrating regions within the substrate, and the plurality of conductive pathways are configured to allow current to pass through the first thickness.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: April 16, 2024
    Assignee: Alliance for Sustainable Energy, LLC
    Inventors: Pauls Stradins, William Michael Nemeth, David Levi Young, Caroline Lima Salles de Souza
  • ENGINEERED NANOSTRUCTURED PASSIVATED CONTACTS AND METHOD OF MAKING THE SAME
    Publication number: 20220140161
    Abstract: The present disclosure relates to a passivating contact that includes a dielectric layer constructed of a first material, an intervening layer constructed of a second material, and a substrate constructed of a semiconductor, where the dielectric layer is positioned between the substrate and the intervening layer, the dielectric layer has a first thickness, and the substrate has a second thickness. The passivating contact also includes a plurality of conductive pathways that include the second material and pass through the first thickness, the second material penetrates into the second thickness forming a plurality of penetrating regions within the substrate, and the plurality of conductive pathways are configured to allow current to pass through the first thickness.
    Type: Application
    Filed: November 1, 2021
    Publication date: May 5, 2022
    Inventors: Pauls STRADINS, William Michael NEMETH, David Levi YOUNG, Caroline Lima Salles de SOUZA