Abstract: An oil-lubricated rotary vane vacuum pump includes a rotary vane unit, having a rotary vane chamber and a rotary vane rotor, and an oil separator device having an air/oil separating unit that has a filter element with a plug-in ring that can be plug-connected on a housing side. The plug-in ring is designed for radial sealing and axial displaceability in a housing receptacle. The filter element has a moulding for bayonet mounting, which faces the end associated with the outer wall. A mounting wall of the housing, extending at a distance from the outer wall of the housing, is designed to interact with the moulding of the filter element and to form the bayonet mounting. A separate cover closes a mounting opening associated with the filter element in the outer wall of the housing. The cover form-fittingly interacts with the filter element to secure the filter element against rotation.

Abstract: An oil-lubricated rotary vane vacuum pump includes a rotary vane unit, having a rotary vane chamber and a rotary vane rotor, and an oil separator device having an air/oil separating unit that has a filter element with a plug-in ring that can be plug-connected on a housing side. The plug-in ring is designed for radial sealing and axial displaceability in a housing receptacle. The filter element has a moulding for bayonet mounting, which faces the end associated with the outer wall. A mounting wall of the housing, extending at a distance from the outer wall of the housing, is designed to interact with the moulding of the filter element and to form the bayonet mounting. A separate cover closes a mounting opening associated with the filter element in the outer wall of the housing. The cover form-fittingly interacts with the filter element to secure the filter element against rotation.

Abstract: A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edges that symmetrically overlie portions of the soldering pad.

Abstract: A semiconductor component includes a substrate having a chip side and a solder ball side. A semiconductor chip is mounted on the chip side of a substrate. The semiconductor chip is electrically conductively connected to a conductor structure on the substrate. Ball pads are disposed over the solder ball side of the substrate. The ball pads are electrically conductively connected to the conductor structure and suitable for application of solder balls. A mask made from a soldering resist is disposed on the solder ball side. A sealing region at a surface of the solder ball side of the substrate is provided with seal elements for a sealing connection to an encapsulation mold on the surface of the solder ball side.

Abstract: An arrangement increases the reliability of substrate-based Ball-Grid-Array (BGA) packages, with a die (chip) that is mounted on a substrate and electrically connected to interconnects of the substrate and for which the substrate is provided with solder balls arranged in a predetermined grid. The arrangement is particularly simple to realize and effective for increasing the reliability of substrate-based Ball-Grid-Array packages. This is achieved by a laminate layer provided with openings for receiving the solder balls at the positions of ball pads being laminated on the side of the substrate that is provided with the interconnects.

Abstract: A packaged electronic component includes a substrate with an upper layer, a lower layer and a middle layer between the upper layer and the lower layer. The middle layer is formed from a first material that is more flexible than the material of the upper layer and the material of the lower layer. An electronic component, such as a semiconductor chip, can be adhered over the upper layer of the substrate. Solder balls can be adhered over the lower layer of the substrate.

Abstract: A packaged chip includes a substrate that includes flat and rigid supporting regions that are connected to an upper surface of the substrate. A chip is mounted face-down on the upper surface of the substrate such that a connection between the substrate and the chip extends virtually completely over one side of the chip. An encapsulating compound overlies a backside of the chip. Further, rigid supporting zones can be connected to the backside of the chip such that the supporting zones are at least partly interconnected with the encapsulating compound.

Abstract: A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edges that symmetrically overlie portions of the soldering pad.

Abstract: The invention relates to an arrangement for improving module reliability, in particular the reliability of soldered connections on semiconductor products with BGA or BGA-like components to a substrate on which chips are attached by a die attach material, in particular substrate-based IC packages, solder balls mounted on the side that is opposite from the chip, on contact pads of the substrate on a patterned copper foil, being provided for the electrical connection to printed circuit boards, and the chip and the substrate on the chip side being encapsulated with a mold cap. With the invention, it is intended to provide an arrangement for improving module reliability with which stress acting on the solder balls during alternating thermal loading is reduced. According to the invention, an intermediate layer (3) which consists of a compliant or flexible material is arranged at least between the contact pads (2) and the substrate (1) or the printed circuit board.

Abstract: The invention relates to an improved process for obtaining pure crystalline betulin which is substantially free from betulinic acid, from an extract of birch bark.

Abstract: The invention relates to a process for obtaining crystalline rosemary acid from balm, in which the ground-up plant parts are first extracted with an alcohol.