Patents by Inventor Carsten Schwiekendick

Carsten Schwiekendick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8042726
    Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: October 25, 2011
    Assignee: Atotech Deutschland GmbH
    Inventors: Ralph Herber, Olaf Kurtz, Johannes Etzkorn, Christian Madry, Carsten Schwiekendick, Gerd Schafer
  • Publication number: 20090202858
    Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.
    Type: Application
    Filed: August 2, 2007
    Publication date: August 13, 2009
    Applicant: ATOTECH DEUTSCHLAND GmbH
    Inventors: Ralph Herber, Olaf Kurtz, Johannes Etzkorn, Christian Madry, Carsten Schwiekendick, Gerd Schäfer
  • Patent number: 7380698
    Abstract: A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: June 3, 2008
    Assignee: Atotech Deutschland GmbH
    Inventors: Heinrich Meyer, Konrad Crämer, Olaf Kurtz, Ralph Herber, Wolfgang Friz, Carsten Schwiekendick, Oliver Ringtunatus, Christian Madry
  • Publication number: 20040084509
    Abstract: Known manufacturing methods for microstructure components, in particular for microreactors, micro-heat exchangers, and micromixers, are not reliable enough to ensure that the component's pressure and corrosion resistance is high enough, that the component's tightness against fluid exiting from the component or fluid spilling over into adjacent microchannels is high enough, and that the microchannels have a sufficiently low flow resistance. In addition, known manufacturing methods are not cost-effective enough that the microstructured components can be employed in a wide variety of applications.
    Type: Application
    Filed: March 21, 2003
    Publication date: May 6, 2004
    Inventors: Heinrich Meyer, Konrad Cramer, Olaf Kurtz, Ralph Herber, Wolfgang Friz, Carsten Schwiekendick, Oliver Ringtunatus, Christian Madry